Specifications Download

NICHIA STS-DA1-4011A <Cat.No.160419>
NICHIA CORPORATION
SPECIFICATIONS FOR UV LED
NVSU119CT
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-4011A <Cat.No.160419>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
U375
U385
U395
Symbol
Absolute Maximum Rating
Unit
Forward Current
IF
1400
mA
Pulse Forward Current
IFP
2000
mA
Power Dissipation
PD
5.18
W
Junction Temperature
TJ
125
°C
Forward Current
IF
1400
mA
Pulse Forward Current
IFP
2000
mA
Power Dissipation
PD
5.18
W
Junction Temperature
TJ
125
°C
Forward Current
IF
1400
mA
Pulse Forward Current
IFP
2000
mA
Power Dissipation
PD
5.18
W
Junction Temperature
TJ
130
°C
Allowable Reverse Current
IR
85
mA
Operating Temperature
Topr
-10~85
°C
Storage Temperature
Tstg
-40~100
°C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Condition
Typ
Max
Unit
VF
IF=700mA
3.40
-
V
Radiant Flux
Φe
IF=700mA
1160
-
mW
Peak Wavelength
λp
IF=700mA
375
-
nm
Spectrum Half Width
Δλ
IF=700mA
9.0
-
nm
Thermal Resistance
RθJS
-
3.4
3.8
°C/W
VF
IF=700mA
3.35
-
V
Radiant Flux
Φe
IF=700mA
1340
-
mW
Peak Wavelength
λp
IF=700mA
385
-
nm
Spectrum Half Width
Δλ
IF=700mA
11
-
nm
Thermal Resistance
RθJS
-
2.6
3.1
°C/W
Forward Voltage
VF
IF=700mA
3.30
-
V
Radiant Flux
Φe
IF=700mA
1340
-
mW
Forward Voltage
U375
Forward Voltage
U385
U395
Peak Wavelength
λp
IF=700mA
395
-
nm
Spectrum Half Width
Δλ
IF=700mA
12
-
nm
Thermal Resistance
RθJS
-
2.6
3.1
°C/W
* Characteristics at TS=25°C.
* Radiant Flux value as per CIE 127:2007 standard.
* RθJS is Thermal Resistance from junction to TS measuring point.
* It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
1
NICHIA STS-DA1-4011A <Cat.No.160419>
RANKS
Item
Rank
Forward Voltage
Radiant Flux
Peak Wavelength
Min
Max
M1
3.6
3.8
L
3.2
3.6
K2
3.0
3.2
P9d21
1340
1460
P8d22
1230
1340
P8d21
1130
1230
P7d22
1040
1130
P7d21
950
1040
U395
390
400
U385
380
390
U375
370
380
Unit
V
mW
nm
* Ranking at TS=25°C.
* Forward Voltage Tolerance: ±0.05V
* Radiant Flux Tolerance: ±6%
* Peak Wavelength Tolerance: ±3nm
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
Radiant Flux Ranks by Peak Wavelength
Ranking by
Radiant Flux
Ranking by
P7d21
P7d22
P8d21
P8d22
P9d21
Peak Wavelength
U375
U385,U395
2
NICHIA STS-DA1-4011A <Cat.No.160419>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
管理番号 No.
NVSU119C
STS-DA7-8357A
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
3.5
2.9
3.5
0.4
2
Cathode Mark
3.2
3.2
0.5
Cathode
K
項目 Item
内容 Description
パッケージ材質
Package Materials
セラミックス
Ceramics
封止樹脂材質
Encapsulating Resin
Materials
シリコーン樹脂
Silicone Resin
電極材質
Electrodes Materials
金メッキ
Au-plated
レンズ材質
Lens Materials
シリコーン樹脂
Silicone Resin
質量
Weight
0.030g(TYP)
Anode
A
保護素子
Protection Device
3
NICHIA STS-DA1-4011A <Cat.No.160419>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
260°CMax
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
● Recommended Soldering Pad Pattern
4.1
3.5
0.6
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
Using a nozzle designed for the LEDs is recommended. (See Figure below)
* The nozzle must not have any direct contact with the encapsulating resin.
0.4
1.9
0.5
Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate.
Φ3.5
4.5
A
0.15
A部拡大
Expansion of A
(単位 Unit: mm)
4
NICHIA STS-DA1-4011A <Cat.No.160419>
* Repairing should not be done after the LEDs have been soldered.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
* All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed
by a normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions.
5
NICHIA STS-DA1-4011A <Cat.No.160419>
TAPE AND REEL DIMENSIONS
テーピング部 Tape
1.75±0.1
2±0.05 4±0.1
5.5±0.05
Cathode Mark
Nxxx119x
STS-DA7-6929
(単位 Unit: mm)
0.35±0.05
3.7±0.1
8±0.1
12+0.3
-0.1
Φ1.5+0.1
-0
管理番号 No.
2.25±0.1
-0
Φ 1.5+0.2
3.7±0.1
エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
LED装着部
Loaded Pockets
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
17.5±1
13.5±1
±2
* 数量は1リールにつき 3500個入りです。
Reel Size: 3500pcs
21 ±
0.
* JIS C 0806電子部品テーピングに準拠しています。
Φ100±1
8
Φ
13 ±
0
.2
330
Φ
ラベル
Label
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,
no more than 10N should be applied to
the embossed carrier tape.
The LEDs may stick to the top cover tape.
6
NICHIA STS-DA1-4011A <Cat.No.160419>
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
シリカゲル
Desiccants
リール
Reel
管理番号 No.
Nxxxxxxx
STS-DA7-1109B
ラベル Label
UV LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
熱シール
Seal
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
警告ラベル Warning and Explanatory Labels
アルミ防湿袋
Moisture-proof Bag
LE
LED 放射
D
ビームを直接見たり触れたり
UV LED
LED
LED RADIATION
RADIATION
AVOID
EXPOSURE
TO
AVOID
EXPOSURE
TO BEAM
ビームを直接見たり触れたり
しないこと
しないこと
E
クラス3B
クラス3B LLED製品
D 製品
BEAM
3B
T
PRODUC
CLAS 3B LED PRODUCT
LED
CLASS
S
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label
UV LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water. The box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using the original package material or equivalent in transit is recommended.
7
NICHIA STS-DA1-4011A <Cat.No.160419>
LOT NUMBERING CODE
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2015
F
2016
G
2017
H
2018
I
2019
J
2020
K
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Wavelength, Ranking by Radiant Flux, Ranking by Forward Voltage
8
NICHIA STS-DA1-4011A <Cat.No.160419>
DERATING CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8358A
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
1500
はんだ接合部温度(カソード側)-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
Derating2
RθJA =11.2°C/W
1500
(85, 1400)
(69, 1400)
1200
(85, 1000)
許容順電流
900
600
300
Allowable Forward Current(mA)
許容順電流
Allowable Forward Current(mA)
1200
900
600
300
0
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
許容順電流
Allowable Forward Current(mA)
10000
0
20
40
60
80
100
120
はんだ接合部温度(カソード側)
Solder Temperature(Cathode Side)(°C)
T A =25°C
2000
1400
1000
100
1
10
100
デューティー比
Duty Ratio(%)
* 本特性はピーク波長ランクU375に対応しています。
The graphs above show the characteristics for U375 LEDs of this product.
9
NICHIA STS-DA1-4011A <Cat.No.160419>
DERATING CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8359A
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
1500
はんだ接合部温度(カソード側)-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
Derating2
RθJA =9.1°C/W
1500
(85, 1400)
(80, 1400)
(85, 1240)
1200
許容順電流
900
600
300
Allowable Forward Current(mA)
許容順電流
Allowable Forward Current(mA)
1200
900
600
300
0
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
許容順電流
Allowable Forward Current(mA)
10000
0
20
40
60
80
100
120
はんだ接合部温度(カソード側)
Solder Temperature(Cathode Side)(°C)
T A =25°C
2000
1400
1000
100
1
10
100
デューティー比
Duty Ratio(%)
* 本特性はピーク波長ランクU385に対応しています。
The graphs above show the characteristics for U385 LEDs of this product.
10
NICHIA STS-DA1-4011A <Cat.No.160419>
DERATING CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8360A
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
1500
はんだ接合部温度(カソード側)-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
Derating2
RθJA =9.1°C/W
1500
(85, 1400)
(85, 1400)
1200
許容順電流
900
600
300
Allowable Forward Current(mA)
許容順電流
Allowable Forward Current(mA)
1200
900
600
300
0
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
許容順電流
Allowable Forward Current(mA)
10000
0
20
40
60
80
100
120
はんだ接合部温度(カソード側)
Solder Temperature(Cathode Side)(°C)
T A =25°C
2000
1400
1000
100
1
10
100
デューティー比
Duty Ratio(%)
* 本特性はピーク波長ランクU395に対応しています。
The graphs above show the characteristics for U395 LEDs of this product.
11
NICHIA STS-DA1-4011A <Cat.No.160419>
OPTICAL CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8361A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
発光スペクトル
Spectrum
TA =25°C
IFP=700mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
300
350
400
450
500
550
600
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
TA =25°C
IFP=700mA
10°
20°
-30°
30°
-40°
40°
放射角度
Radiation Angle
-50°
50°
-60°
60°
-70°
70°
-80°
80°
-90°
90°
1
0.5
0
0.5
1
相対放射強度
Relative Radiant Intensity(a.u.)
* 本特性はピーク波長ランクU375に対応しています。
The graphs above show the characteristics for U375 LEDs of this product.
12
NICHIA STS-DA1-4011A <Cat.No.160419>
OPTICAL CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8362A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
発光スペクトル
Spectrum
TA =25°C
IFP=700mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
300
350
400
450
500
550
600
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
TA =25°C
IFP=700mA
10°
20°
-30°
30°
-40°
40°
放射角度
Radiation Angle
-50°
50°
-60°
60°
-70°
70°
-80°
80°
-90°
90°
1
0.5
0
0.5
1
相対放射強度
Relative Radiant Intensity(a.u.)
* 本特性はピーク波長ランクU385に対応しています。
The graphs above show the characteristics for U385 LEDs of this product.
13
NICHIA STS-DA1-4011A <Cat.No.160419>
OPTICAL CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8363A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
発光スペクトル
Spectrum
TA =25°C
IFP=700mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity(a.u.)
0.8
0.6
0.4
0.2
0.0
300
350
400
450
500
550
600
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
TA =25°C
IFP=700mA
10°
20°
-30°
30°
-40°
40°
放射角度
Radiation Angle
-50°
50°
-60°
60°
-70°
70°
-80°
80°
-90°
90°
1
0.5
0
0.5
1
相対放射強度
Relative Radiant Intensity(a.u.)
* 本特性はピーク波長ランクU395に対応しています。
The graphs above show the characteristics for U395 LEDs of this product.
14
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8364A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
VfIf
TA =25°C
2000
1000
700
100
2.5
TaVf
IFP=700mA
4.0
順電圧
Forward Voltage(V)
10000
順電流
Forward Current(mA)
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
3.5
3.0
2.5
3.0
3.5
4.0
-60 -40 -20
順電圧
Forward Voltage(V)
順電流-相対放射束特性
Forward Current vs
Relative Radiant Flux
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
IfIv
TA =25°C
3.5
0
周囲温度-相対放射束特性
Ambient Temperature vs
Relative Radiant Flux
TaIv
IFP=700mA
1.4
相対放射束
Relative Radiant Flux(a.u.)
相対放射束
Relative Radiant Flux(a.u.)
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.0
0.6
0
500
1000
1500
2000
2500
順電流
Forward Current(mA)
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU375に対応しています。
The graphs above show the characteristics for U375 LEDs of this product.
15
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8365A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
VfIf
TA =25°C
2000
1000
700
100
2.5
TaVf
IFP=700mA
4.0
順電圧
Forward Voltage(V)
10000
順電流
Forward Current(mA)
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
3.5
3.0
2.5
3.0
3.5
4.0
-60 -40 -20
順電圧
Forward Voltage(V)
順電流-相対放射束特性
Forward Current vs
Relative Radiant Flux
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
IfIv
TA =25°C
3.5
0
周囲温度-相対放射束特性
Ambient Temperature vs
Relative Radiant Flux
TaIv
IFP=700mA
1.4
相対放射束
Relative Radiant Flux(a.u.)
相対放射束
Relative Radiant Flux(a.u.)
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.0
0.6
0
500
1000
1500
2000
2500
順電流
Forward Current(mA)
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU385に対応しています。
The graphs above show the characteristics for U385 LEDs of this product.
16
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8366A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
VfIf
TA =25°C
2000
1000
700
100
2.5
TaVf
IFP=700mA
4.0
順電圧
Forward Voltage(V)
10000
順電流
Forward Current(mA)
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
3.5
3.0
2.5
3.0
3.5
4.0
-60 -40 -20
順電圧
Forward Voltage(V)
順電流-相対放射束特性
Forward Current vs
Relative Radiant Flux
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
IfIv
TA =25°C
3.5
0
周囲温度-相対放射束特性
Ambient Temperature vs
Relative Radiant Flux
TaIv
IFP=700mA
1.4
相対放射束
Relative Radiant Flux(a.u.)
相対放射束
Relative Radiant Flux(a.u.)
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.0
0.6
0
500
1000
1500
2000
2500
順電流
Forward Current(mA)
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU395に対応しています。
The graphs above show the characteristics for U395 LEDs of this product.
17
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8367A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-ピーク波長特性
Forward Current vs
Peak Wavelength
TA =25°C
IfλD
381
ピーク波長
Peak Wavelength(nm)
379
377
375
373
371
369
10
100
1000
10000
順電流
Forward Current(mA)
周囲温度-ピーク波長特性
Ambient Temperature vs
Peak Wavelength
381
IFP= 700mA
TaλD
ピーク波長
Peak Wavelength(nm)
379
377
375
373
371
369
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU375に対応しています。
The graphs above show the characteristics for U375 LEDs of this product.
18
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8368A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-ピーク波長特性
Forward Current vs
Peak Wavelength
TA =25°C
IfλD
391
ピーク波長
Peak Wavelength(nm)
389
387
385
383
381
379
10
100
1000
10000
順電流
Forward Current(mA)
周囲温度-ピーク波長特性
Ambient Temperature vs
Peak Wavelength
391
IFP= 700mA
TaλD
ピーク波長
Peak Wavelength(nm)
389
387
385
383
381
379
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU385に対応しています。
The graphs above show the characteristics for U385 LEDs of this product.
19
NICHIA STS-DA1-4011A <Cat.No.160419>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NVSU119C
管理番号 No. STS-DA7-8369A
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-ピーク波長特性
Forward Current vs
Peak Wavelength
TA =25°C
IfλD
401
ピーク波長
Peak Wavelength(nm)
399
397
395
393
391
389
10
100
1000
10000
順電流
Forward Current(mA)
周囲温度-ピーク波長特性
Ambient Temperature vs
Peak Wavelength
401
IFP= 700mA
TaλD
ピーク波長
Peak Wavelength(nm)
399
397
395
393
391
389
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
* 本特性はピーク波長ランクU395に対応しています。
The graphs above show the characteristics for U395 LEDs of this product.
20
NICHIA STS-DA1-4011A <Cat.No.160419>
RELIABILITY
(1) Tests and Results
Reference
Test
Standard
Resistance to
Soldering Heat
(Reflow Soldering)
Temperature Cycle
Tsld=260°C, 10sec, 2reflows,
300 301
Precondition: 30°C, 70%RH, 168hr
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Room Temperature
Operating Life
High Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
Electrostatic Discharges
Duration
JEITA ED-4701
High Temperature
Vibration
Test
Test Conditions
Failure
Criteria
#
Units
Failed/Tested
#1
0/10
100cycles
#1
0/10
TA=100°C
1000hours
#1
0/10
TA=60°C, RH=90%
1000hours
#1
0/10
TA=-40°C
1000hours
#1
0/10
TA=25°C, IF=1400mA
1000hours
#1
0/10
TA=85°C, IF=1000mA
1000hours
#1
0/10
60°C, RH=90%, IF=700mA
500hours
#1
0/10
TA=-10°C, IF=700mA
1000hours
#1
0/10
48minutes
#1
0/10
#1
0/10
JEITA ED-4701
200m/s2, 100~2000~100Hz,
400 403
4cycles, 4min, each X, Y, Z
JEITA ED-4701
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
300 304
alternately positive or negative
NOTES:
1) U375：RθJA≈11.2°C/W,
U385, U395：RθJA≈9.1°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
#1
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=700mA
>Initial value×1.1
Radiant Flux(ΦE)
IF=700mA
<Initial value×0.7
21
NICHIA STS-DA1-4011A <Cat.No.160419>
CAUTIONS
(1) Storage
Conditions
Storage
Temperature
Humidity
Time
Before Opening Aluminum Bag
≤30°C
≤90%RH
Within 1 Year from Delivery Date
After Opening Aluminum Bag
≤30°C
≤70%RH
≤168hours
65±5°C
-
≥24hours
Baking
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
● Although the leads or electrode pads (anode and cathode) of the product are plated with gold,
prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish,
and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container.
Nichia recommends using the original moisture-proof bag for storage.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals.
Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,
caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
● Do not store the LEDs in a dusty environment.
● Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than
normal room temperature.
(2) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● This product should be operated using forward current. Ensure that the product is not subjected to
either forward or reverse voltage while it is not in use. In particular, subjecting it to continuous reverse voltage
may cause migration, which may cause damage to the LED die. When used in displays that are not used for a long time,
the main power supply should be switched off for safety.
● It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
● Ensure that excessive voltages such as lightning surges are not applied to the LEDs.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
● This product also emits visible light. If the LEDs are used as a light source in applications such as sensors, etc.
take into consideration the emission that is in the visible light spectrum.
● If this product is stored and/or used constantly under high temperature and high humidity conditions,
it may accelerate the deterioration of the die; this may cause the radiant flux to decrease.
If the LEDs are stored and/or used under these conditions, sufficient verification must be done prior to use to ensure
there are no issues for the chosen application.
22
NICHIA STS-DA1-4011A <Cat.No.160419>
(3) Handling Precautions
● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics:
it might cause the LED to be deformed and/or the bump to break, which will cause the LED not to illuminate.
● When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures.
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
● If an aluminum PCB is used, customer is advised to verify the PCB with the products before use.
Thermal stress during use can cause the solder joints to crack.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Ensure that tools, jigs and machines that are being used are properly grounded and
that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs,
protection against surge voltages should also be used.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement at low current (≤1mA).
● ESD damaged LEDs may have current flow at a low voltage.
Failure Criteria: VF<2.0V at IF=0.5mA
23
NICHIA STS-DA1-4011A <Cat.No.160419>
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measuring point: °C/W
W=Input power(IF×VF): W
Ts Point
(7) Cleaning
● The LEDs should not be cleaned with water, benzine, and/or thinner.
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
(8) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.
● The products are UV light LEDs, and radiate intense UV light during operation. Since UV light can be harmful to eyes,
do NOT look directly into the UV light, even through an optical instrument. In case of the light reflection,
UV protective glasses are required to use in order to avoid damage by the light.
24
NICHIA STS-DA1-4011A <Cat.No.160419>
(9) Others
● This product is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication
devices); it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, automobiles,
combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters,
traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications,
unless otherwise detailed in the specification, Nichia will neither guarantee that the product is fit for that purpose nor be
responsible for any resulting property damage, injuries and/or loss of life/health.
This product does not comply with ISO/TS 16949 and is not intended for automotive applications.
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● The specifications and appearance of this product may change without notice;
Nichia does not guarantee the contents of this specification. Both the customer and Nichia
will agree on the official specifications of supplied products before the volume production of a program begins.
25
Application Note
Mounting Techniques for LEDs with a Lens
1. Introduction
As LEDs have recently been miniaturized and highly-functional, higher mounting technologies are necessary
for them. It has been difficult to mount such advanced LEDs because of the lenses and the smaller
absorption area. Improper mounting will affect the function and the reliability of the performance from the
end product. To manufacture high-performance lighting fixtures with high functional LEDs, it is critical to
develop the mounting technology.
We have seen many mounting problems in highly-functional LEDs with a lens. This document provides the
mounting techniques for such LEDs, exhibiting some mounting failures. Please note that this document
recommends a modular mounter to be used.
2. Mounting Failures in LEDs with a Lens
Many LEDs with a lens have been developed for higher performance. Such lenses are mostly made of resin;
when external stress is applied to the lens, some are susceptible to damage, leading to abnormal optical
characteristics, and others are susceptible to wire breakage, leading to abnormal electrical characteristics.
Therefore, applying external stress to the lens has to be avoided as much as possible.
Moreover, the contact area of a pick-and-place nozzle and the lens is limited by the presence of the lens,
which sometimes causes air leak, resulting in absorption error.
Problem 1:
Damage to the lens during the mounting process
Problem 2:
Absorption error due to air leak
An LED lens sometimes sticks to the top cover tape due to the resin’s adhesive property, resulting in LED
tilting within the cavity.
Also, the center of gravity of an LED with a lens is located higher. When the emboss carrier tape is exposed
to an excessive vibration, the LED may be tilted within the cavity.
Problem 3:
LED tilting within the cavity due to its adhesion to the top cover tape
Problem 4:
LED tilting within the cavity due to vibration of the emboss carrier tape
Please refer to the following sheets for the countermeasures against Problems 1 to 4.
1/8
This sheet contains tentative information; we may change contents without notice.
Application Note
0.15
φ5.3
2
2.7
0.5
3. Mounting Techniques
3-1. Problem 1: Damage to the lens during the mounting process
Nichia establishes the optimal absorption method and the optimal cavity shape/size for each LED with a
lens.
In general, there are two absorption methods; one is the “nozzle insertion system” and the other is the
“non-insertion nozzle system.”
3-1-1. Nozzle Insertion System
The nozzle insertion system is optimal for the 383/385 series, considering the LED shape/tolerance and the
cavity shape/size. The LEDs can be absorbed in a stable condition, when the nozzle is inserted into the
cavity and brought close to the lens. Please take care not to insert the nozzle too close to the lens. Therefore,
please refer to Nichia’s specifications for the insertion depth.
R0.15
6.3
Inserted into the Cavity
φ3.8
4.4
Outline Dimension of the Nozzle
Outline Dimension of the Nozzle
for NS9x383
for NFSx385
The pick-and-place nozzle is chamfered so as to form a “C Surface” (a sloped surface) and an “R Surface”
(a curved surface), enabling a smooth mounting of the LEDs. Such design of the nozzle can prevent the
LEDs from tilting in the cavities.
3-1-2. Non-Insertion Nozzle System
When the nozzle insertion system is used for the x19 series, the nozzle may touch the lens and apply
excessive stress to it, considering the LED’s shape/tolerance and the dimensional tolerance of the nozzle. If
the clearance is left between the nozzle and the lens to avoid the contact with each other, it may be
impossible to insert the nozzle into the cavity due to the oversized nozzle.
Then, Nichia recommends that the “Non-Insertion Nozzle system” be used for the x19 series. With this
system, the nozzle reaches at the top surface of the cavity and absorbs the LEDs.
With the nozzle insertion system, the lens can get damaged due to the insertion pressure of the nozzle. On
the other hand, with the non-insertion nozzle system, the nozzle is less likely to apply stress to the lens; only
a slight absorption stress is applied to the lens.
Also, superior durability of the nozzle is achieved because of its sufficient thickness, since it does not have to
be inserted into the cavities.
2/8
This sheet contains tentative information; we may change contents without notice.
φ3
0.15
3.8
1.9
0.5
0.5
1.9
0.4
0.4
Application Note
φ3.5
0.15
4.5
Outline Dimension of the Nozzle
Outline Dimension of the Nozzle
for x19A series
for x19B series
Absorbed by air
Correction of the Absorption Point
Please adjust the mounter to ensure that the nozzle should absorb the correct point on the LEDs. The
absorption point can be corrected with the image recognition unit by aiming at the center of the hole on the
bottom surface of the cavity. Please refer to the following pictures for the image recognition unit.
for ref. Panasonic CM Mounter
for ref. Yamaha YS Mounter
3-2. Problem 2: Absorption error due to air leak
By the presence of the lens, the contact area of a pick-and-place nozzle and the lens is limited, which
sometimes causes air leak, resulting in absorption error. In such cases, please change the absorption
power into a more appropriate value. Judging from Nichia’s evaluation results, the LEDs can be properly
mounted by adjusting the absorption power from -40 to -90 kpa.
3-3. Problem 3: LED tilting within the cavity due to its adhesion to the top cover tape
LED lenses are made of resin. Therefore, the lenses sometimes adhere to the top cover tape due to the
resin’s stickiness. When the cover tape is peeled from the carrier tape, the LEDs tilt within their cavities,
resulting in mounting failure.
It is impossible to eliminate the stickiness of the lens. Please refer to the following pages for the
countermeasures against the LED tilting.
3/8
This sheet contains tentative information; we may change contents without notice.
Application Note
3-3-1. Slow down the feeding speed.
When the feeding speed is fast, the pick-and-place nozzle absorbs the LED before the lens is detached
from the top cover tape, resulting in mounting failure.
In case of High Feeding Speed
Top Cover Tape
カバーテープ
Mounting Failure
Emboss Carrier Tape
エンボス
Even when the LED is in contact with the top cover tape; however, by lowering the feeding speed, it can
be detached from the tape before absorbed by the nozzle.
In case of Low Feeding Speed
The LED can be detached
The nozzle can appropriately
from the top cover tape.
pick and place the LED.
For example, the feeding speed can be changed by the screen as follows:
for ref. Panasonic CM Mounter
for ref. Yamaha YS Mounter
4/8
This sheet contains tentative information; we may change contents without notice.
Application Note
* It is impossible to change the feeding speed of
Panasonic BM Mounter. Instead, the operation
speed of the head can be
lengthening the absorption pitch.
lowered,
for ref. Panasonic BM Mounter
3-3-2. Change the peeling angle.
As the following figures show, when the top cover tape is peeled off from the emboss carrier tape in an
acute angle, the LED can be easily detached from the top cover tape, preventing it from tilting within the
cavity.
The LED continues to
adhere to the cover tape.
Top Cover Tape
カバーテープ
The LED can be detached
from the cover tape.
Emboss Carrier Tape
エンボス
Peeling Angle: Obtuse
Peeling Angle: Acute
The peeling angle can be adjusted to its optimal value by some of the mounters as follows:
for ref. Panasonic CM Mounter
5/8
This sheet contains tentative information; we may change contents without notice.
Application Note
3-4. Problem 4: LED tilting within the cavity due to vibration of the emboss carrier tape
When an excessive vibration is applied to the emboss carrier tape, LEDs may tilt within the cavities.
LEDs with a lens are susceptible to vibration, resulting in tilting, since its center of gravity is located higher.
3-4-1. Slow down the feeding speed.
The higher the feeding speed is, the more the vibration affects the LEDs within the cavities. When LEDs
tilt within the cavities, please lower the feeding speed to decrease the vibration.
(For ref. Nichia recommends that the feeding speed should be a little slower than high speed.)
The carrier tape may be vibrated by an air feeder much more than an electric feeder. Please select the
feeder depending on the LEDs to ensure that they are properly mounted.
The LED stays in a stable condition.
The LED tilts within the cavity.
Emboss Carrier Tape
エンボス
Higher Feeding Speed
Lower Feeding Speed
3-4-2. Change the peeling point.
When the top cover tape is peeled off from the emboss carrier tape long before the nozzle comes down to
absorb an LED, some of the LEDs move around within the space between the feeder cover and the carrier
tape, leading to LED tilting.
Please peel off the cover tape just before the nozzle comes down to absorb an LED. Then, LED’s
up-and-down movement can be restricted, preventing from LED tilting.
LEDs move within the space.
吸着までの間、上下方向のクリアランスが大きい
Conventional Peeling Position
LEDs are difficult to move within the cavity.
直前でカバーを剥ぐことによりLEDを規制
New Peeling Position
6/8
This sheet contains tentative information; we may change contents without notice.
Application Note
New Peeling
Conventional
New Peeling
Conventional
Position
Peeling Position
Position
Peeling Position
for ref. Panasonic CM Mounter
New Peeling
Conventional
Position
Peeling Position
for ref. Yamaha YS Mounter
for ref. Panasonic BM Mounter
Comparison of the Peeling Positions
* Please note that some of the mounters are equipped with a shutter. In such cases, it is impossible to
change the peeling position of the top cover tape.
7/8
This sheet contains tentative information; we may change contents without notice.
Application Note
4. Caution
Please refrain from splicing the tape together.
“Splicing” stands for the tape joint process while the mounter is operated. When there are a few LEDs left on
the reel which is loaded on the mounter, some customers cut off and joint the edge of the tape to the next
tape without detaching the feeder from the device. The splicing is to raise the machine utilization without
bringing the device to a halt.
The splicing, however, may lead to the LED mounting failure; the LEDs may be tilted within the cavities due
to the external stress applied to the carrier tape.
There are a few LEDs left on a reel.
The edge of the tape is cut off and
jointed to the next tape.
Splicing
5. Notice
Some mounting techniques for LEDs with a lens are described herein; however, they don’t fit in with all the
mounters. Please select the optimal mounting techniques depending on the LED model and the mounter.
Nichia will aim to continue collecting data concerning the mounting techniques and offering beneficial
information to our customers.
When you are concerned about any mounting technique, please contact us.
We would appreciate your cooperation.
8/8
This sheet contains tentative information; we may change contents without notice.