44TQFP10mmPbFreeDeviceMaterialContentRevE1

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 44 TQFP (1.0mm) with matte Sn Plating
Total Device Weight 0.28
Grams
August, 2008
% of Total
Pkg. Wt.
Weight (g)
Die
1.52%
0.004
Mold
72.31%
0.202
D/A Epoxy
0.23%
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions
Silicon chip
7440-21-3
Die size: 2.1 x 3.0 mm
61.46%
3.62%
3.62%
0.72%
0.43%
2.46%
0.172
0.010
0.010
0.0020
0.0012
0.007
Silica Fused
Epoxy Resin
Phenol Resin
Antimony Trioxide
Carbon black
Other (trade secret)
60676-86-0
1309-64-4
1333-86-4
-
Mold Compound Density between 1.7 and 2.1 grams/cc
80 to 90% Silica Fused (LSC uses 85% in our calculation)
5 to 10% Epoxy Resin (LSC uses 5% in our calculation).
5 to 10% Phenol Resin (LSC uses 5% in our calculation).
0.1% to 1% Antimony Trioxide (LSC uses 1% in our calculation)
0.1 to 1% Carbon black (LSC uses 0.6% in our calculation)
1 to 4% Other (LSC uses 3.4% in our calculation)
0.184%
0.046%
0.0005
0.0001
Silver (Ag)
Esters & resins
7440-22-4
-
(silver content: 70-90%; LSC uses 80% in our calculation)
Die attach epoxy Density: 4 grams/cc
0.0006
Wire
0.46%
0.0013
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm
Leadframe Plating
2.71%
0.008
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
22.78%
0.064
Copper (Cu)
Silicon (Si)
Zinc (Zn)
Tin (Sn)
Chromium (Cr)
Nickel (Ni)
Magnesium (Mg)
7440-50-8
7440-21-3
7440-66-6
7440-31-5
7440-47-3
7440-02-0
7439-95-4
Leadframe thickness is nominal (per Case Outline)
Cu (LSC uses 97.5% in our calculation)
0 to 0.65% Si (LSC uses 0.4% in our calculation)
0 to 0.2% Zn (LSC uses 0.1% in our calculation)
0 to 0.25% Sn (LSC uses 0.2% in our calculation)
0 to 0.3% Cr (LSC uses 0.2% in our calculation)
0 to 3% Ni (LSC uses 1.5% in our calculation)
0 to 0.15% Mg (LSC uses 0.1% in our calculation)
22.21%
0.091%
0.02%
0.05%
0.05%
0.34%
0.02%
0.0622
0.00026
0.00006
0.00013
0.00013
0.0010
0.00006
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. E1
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