48tqfp10mmHF

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 48 TQFP (1.0mm) with matte Sn Plating
Total Device Weight 0.14
Grams
November, 2010
% of Total
Pkg. Wt.
Weight (g)
Die
2.12%
0.003
Mold
70.17%
0.0982
D/A Epoxy
0.32%
% of Total
Weight (g)
Pkg. Wt.
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 2.00 x 2.20 mm
59.64%
4.21%
3.51%
0.28%
2.53%
0.0835
0.0059
0.0049
0.0004
0.0035
Silica Fused
Epoxy Resin
Phenol Resin
Carbon black
Other (trade secret)
60676-86-0
1333-86-4
-
Mold Compound Density between 1.7 and 2.1 grams/cc
75 to 95% (LSC uses 85% in our calculation)
3 to 10% (LSC uses 6% in our calculation)
2 to 8% (LSC uses 5% in our calculation)
0.1 to 0.5% (LSC uses 0.4% in our calculation)
0 to 5% (LSC uses 3.6% in our calculation)
0.26%
0.06%
0.0004
0.0001
Silver (Ag)
Other
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
(silver content: 70-90%; LSC uses 80% in our calculation)
0.0004
Wire
1.01%
0.0014
Gold (Au)
7440-57-5
1.00 mil diameter; 1 wire per package lead; wire length 3 mm
Lead Plating
4.06%
0.0057
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
22.32%
0.0313
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
96.2% Cu
3% Ni
0.65% Si
0.15% Mg
21.47%
0.67%
0.15%
0.03%
0.0301
0.0009
0.00020
0.00005
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
Similar pages