48tqfp14mmHF

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 48 TQFP (1.4mm) with matte Sn Plating
Total Device Weight 0.18
Grams
February, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
2.05%
0.0037
Mold
76.58%
0.138
D/A Epoxy
0.25%
% of Total
Weight (g)
Pkg. Wt.
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 2.00 x 2.20 mm
65.09%
4.59%
3.83%
0.31%
2.76%
0.117
0.0083
0.0069
0.0006
0.0050
Silica Fused
Epoxy Resin
Phenol Resin
Carbon black
Other (trade secret)
60676-86-0
1333-86-4
-
Mold Compound Density between 1.7 and 2.1 grams/cc
80 to 90% Silica Fused (LSC uses 85% in our calculation)
5 to 10% Epoxy Resin (LSC uses 6% in our calculation).
5 to 10% Phenol Resin (LSC uses 5% in our calculation).
0.1 to 1% Carbon black (LSC uses 0.4% in our calculation)
1 to 4% Other (LSC uses 3.6% in our calculation)
0.20%
0.05%
0.0004
0.0001
Silver (Ag)
other
7440-22-4
-
(silver content: 70-90%; LSC uses 80% in our calculation)
Die attach epoxy Density: 4 grams/cc
0.0004
Wire
0.78%
0.0014
Gold (Au)
7440-57-5
0.8 to1.0 mil diameter; 1 wire per package lead; wire length 3 mm
Lead Plating
2.98%
0.0054
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
17.36%
0.0313
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
96.2% Cu
3% Ni
0.65% Si
0.15% Mg
16.70%
0.52%
0.11%
0.03%
0.0301
0.00094
0.00020
0.00005
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A
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