Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight 100 TQFP (1.4mm) 0.65 Grams with matte Sn Plating Copper Bond Wire Version Halogen Free MSL: 3 - Peak Reflow Temp: 260°C Die % of Total Pkg. Wt. 3.61% Mold 74.68% August, 2012 D/A Epoxy 0.44% Weight (g) % of Total Pkg. Wt. Weight (g) 0.0234 Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 4.30 x 6.50 mm 63.48% 4.48% 3.73% 0.30% 2.69% 0.4126 0.0291 0.0243 0.0019 0.0175 Silica Fused Epoxy Resin Phenol Resin Other (trade secret) Carbon black 60676-86-0 1333-86-4 Mold Compound Density between 1.87 and 2.17 grams/cc 82 to 94% Silica Fused (LSC uses 86.8% in our calculation) 1.5 to 11% Epoxy Resin (LSC uses 8% in our calculation). 3 to 6% Phenol Resin (LSC uses 4% in our calculation). 2% (max) Other (LSC uses 1% in our calculation) 0.2% (typical) Carbon black (LSC uses 0.2% in our calculation) 0.35% 0.09% 0.0023 0.0006 Silver (Ag) other 7440-22-4 - Die attach epoxy Density: 3 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) 0.4854 0.0028 Wire 0.21% 0.0014 Copper (Cu) 7440-50-8 0.8 mil wire diameter; 1 wire for each package lead; wire length 3 mm Lead Plating 1.83% 0.0119 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 19.23% 0.1250 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) Cu 96.2% Ni 3.0% Si 0.65% Mg 0.15% Copper area is fixed at 50% package area 18.50% 0.577% 0.125% 0.029% 0.1203 0.0038 0.00081 0.00019 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com rev. B