100tqfp14mmHF Cuwire

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
100 TQFP (1.4mm)
0.65
Grams
with matte Sn Plating
Copper Bond Wire Version
Halogen Free
MSL: 3 - Peak Reflow Temp: 260°C
Die
% of Total
Pkg. Wt.
3.61%
Mold
74.68%
August, 2012
D/A Epoxy
0.44%
Weight (g)
% of Total
Pkg. Wt.
Weight (g)
0.0234
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 4.30 x 6.50 mm
63.48%
4.48%
3.73%
0.30%
2.69%
0.4126
0.0291
0.0243
0.0019
0.0175
Silica Fused
Epoxy Resin
Phenol Resin
Other (trade secret)
Carbon black
60676-86-0
1333-86-4
Mold Compound Density between 1.87 and 2.17 grams/cc
82 to 94% Silica Fused (LSC uses 86.8% in our calculation)
1.5 to 11% Epoxy Resin (LSC uses 8% in our calculation).
3 to 6% Phenol Resin (LSC uses 4% in our calculation).
2% (max) Other (LSC uses 1% in our calculation)
0.2% (typical) Carbon black (LSC uses 0.2% in our calculation)
0.35%
0.09%
0.0023
0.0006
Silver (Ag)
other
7440-22-4
-
Die attach epoxy Density: 3 grams/cc
(silver content: 70-90%; LSC uses 80% in our calculation)
0.4854
0.0028
Wire
0.21%
0.0014
Copper (Cu)
7440-50-8
0.8 mil wire diameter; 1 wire for each package lead; wire length 3 mm
Lead Plating
1.83%
0.0119
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
19.23%
0.1250
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
Cu 96.2%
Ni 3.0%
Si 0.65%
Mg 0.15%
Copper area is fixed at 50% package area
18.50%
0.577%
0.125%
0.029%
0.1203
0.0038
0.00081
0.00019
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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rev. B
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