128tqfp14mmHF

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 128 TQFP (1.4mm)
0.66
Total Device Weight
Grams
Die
% of Total
Pkg. Wt.
5.34%
Mold
70.91%
November, 2010
D/A Epoxy
0.65%
Weight (g)
% of Total
Pkg. Wt.
with matte Sn Plating
Weight (g)
0.035
Halogen Free
MSL: 3
Peak Reflow Temp: 240°C
Substance
CAS #
Silicon chip
7440-21-3
Die size: 5.84 x 7.19 mm
Notes / Assumptions:
60.27%
4.25%
3.55%
0.28%
2.55%
0.398
0.028
0.023
0.002
0.017
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Other (trade secret)
60676-86-0
1333-86-4
-
Mold Compound Density between 1.7 and 2.1 grams/cc
75 to 95% (LSC uses 85% in our calculation)
3 to 10% (LSC uses 6% in our calculation)
2 to 8% (LSC uses 5% in our calculation)
0.1 to 0.5% (LSC uses 0.4% in our calculation)
0 to 5% (LSC uses 3.6% in our calculation)
0.52%
0.13%
0.003
0.001
Silver (Ag)
other
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
(silver content: 70-90%; LSC uses 80% in our calculation)
0.468
0.004
Wire
0.57%
0.004
Gold (Au)
7440-57-5
0.8 to 1.2 mil diameter; 1 wire per package lead; wire length 3 mm
Lead Plating
1.88%
0.012
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
20.66%
0.136
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
96.2% Cu
3% Ni
0.65% Si
0.15% Mg
19.88%
0.62%
0.13%
0.03%
0.1312
0.0041
0.00089
0.00020
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
Similar pages