FPBGA Pbfree Auwire100

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
2.84%
0.0086
Mold
51.61%
0.1564
100 fpBGA
0.303
Grams
% of Total
Weight (g)
Pkg. Wt.
42.84%
3.87%
3.87%
0.77%
0.26%
D/A Epoxy
0.40%
Wire
0.97%
0.0029
Solder Balls
12.52%
0.0380
Foil
24.82%
6.84%
0.1298
0.0117
0.0117
0.0023
0.0008
Substance
CAS #
Silicon chip
7440-21-3
Fused silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
Silver
Organic esters and resins
7440-22-4
-
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
1.00 mil diameter; 1 wire per solder ball; wire length 3 mm
0.0012
0.32%
0.08%
Substrate
with SnAgCu Solder Balls
0.0010
0.00024
Die size: 4.71 x 2.90 mm
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenal resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
11.96%
0.50%
0.06%
0.0362
0.0015
0.00019
Tin (Sn) (95.5%)
Silver (Ag) (4.0%)
Copper (Cu) (0.5%)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn95.5/Ag4.0/Cu0.5%
16.88%
7.94%
0.0511
0.0241
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0752
0.0207
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Notes / Assumptions: