Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 1.82% 0.0191 Mold 28.14% 0.2955 0.22% 0.0024 Wire 0.72% 0.0075 Solder Balls 23.71% 0.249 25.20% 0.265 20.18% 0.212 D/A Epoxy Substrate Foil 256 fpBGA 1.05 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 5.30 x 5.00 24.82% 1.41% 1.41% 0.42% 0.08% 0.2606 0.0148 0.0148 0.0044 0.0009 Silica (Fused or Amorphous) Epoxy resin Phenol resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound Density ranges between 1.8 and 2.1 grams/cc 75 to 95% Silica Fused or Amorphous (LSC uses 88.2% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation) 0 to 0.5% Carbon black (LSC uses 0.3% in our calculation) 0.18% 0.05% 0.0019 0.0005 Silver Organic esters and resins 7440-22-4 - Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.0127 mm (radius); 1 wire per package lead Qualified Solder ball compositions: Sn95.5/Ag4/Cu0.5 Sn96.5/Ag3/Cu0.5 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 22.77% 0.83% 0.12% 0.239 0.0087 0.0012 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 17.14% 8.06% 0.1799 0.0847 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B5