Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 Package: [email protected] Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 1.82% 0.0389 Mold 28.01% 0.5995 D/A Epoxy Wire Solder Balls Substrate Foil 0.26% 0.16% 17.60% 22.52% 29.64% 388 fpBGA 2.14 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Copper Bond Wire version MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 7.8 x 6.9 mm 24.54% 1.96% 1.40% 0.11% 0.5251 0.0420 0.0300 0.0024 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676-86-0 Trade secret Trade secret 1333-86-4 0.20% 0.05% 0.0044 0.0011 Silver Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica (LSC uses 87.6% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation) 3 to 8% Phenol Resin (LSC uses 5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 7 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) 0.155% 0.002% 0.00332 0.00005 Copper Palladium 7440-50-8 7440-05-3 0.8 mil diameter; 1 wire per solder ball 98.5% 1.5% 16.98% 0.53% 0.09% 0.3634 0.0113 0.0019 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 15.32% 7.21% 0.3278 0.1542 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.0055 0.0034 0.3766 Qualified Solder ball compositions: Sn96.5/Ag3/Cu0.5 0.4820 0.6342 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E