Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 3.58% 0.0790 Mold 25.52% 0.5640 D/A Epoxy Wire Solder Balls Substrate Foil 0.50% 0.19% 21.30% 19.19% 29.72% 484 fpBGA 2.21 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. (90nm and 65nm products) Copper Bond Wire version - Halogen Free MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 9.63 x 11.36 mm Mold Compound composition: 75 to 95% Silica (LSC uses 87.6% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation) 3 to 8% Phenol Resin (LSC uses 5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation) Mold Compound Density ranges between 1.85 and 2.15 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) 22.36% 1.79% 1.28% 0.10% 0.4941 0.0395 0.0282 0.0023 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676-86-0 Trade secret Trade secret 1333-86-4 0.40% 0.10% 0.0089 0.0022 Silver (Ag) Organic esters and resins 7440-22-4 Trade secret 0.414% 0.006% 0.00187 0.00003 Copper Palladium 7440-50-8 7440-05-3 0.8 mil diameter; 1 wire per solder ball 98.5% 1.5% 20.45% 0.75% 0.11% 0.454 0.0141 0.0024 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 SAC305 96.5% Sn 3% Ag 0.5% Cu 13.05% 6.14% 0.288 0.136 Glass fiber BT Resins 65997-17-3 Trade secret Copper (Cu) 7440-50-8 0.0111 0.0042 0.471 0.424 0.657 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E1