Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 USA [email protected] Package: Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 1.48% 0.0489 Mold 37.15% 1.226 D/A Epoxy Wire Solder Balls Substrate Foil 0.21% 0.18% 19.89% 18.87% 22.23% 672 fpBGA 3.30 Grams % of Total Weight (g) Pkg. Wt. with SnAgCu Solder Balls (90nm and 65nm products) Copper Bond Wire version MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 8.11 x 8.34 mm Mold Compound Density between 1.8 and 2.1 grams/cc 75 to 95% Silica (LSC uses 87.6% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation) 3 to 8% Phenol Resin (LSC uses 5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation) 32.54% 2.60% 1.86% 0.15% 1.0738 0.0858 0.0613 0.0049 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676-86-0 Trade secret Trade secret 1333-86-4 0.17% 0.04% 0.0055 0.0014 Silver Esters & resins 7440-22-4 - Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 1 to 10% Esters & resins (LSC uses 20% in our calculation) 0.17% 0.00% 0.0057 0.0001 Copper Palladium 7440-50-8 7440-05-3 0.8 mil diameter; 1 wire per solder ball 98.5% 1.5% 19.19% 0.60% 0.10% 0.6333 0.0197 0.0033 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 12.83% 6.04% 0.424 0.199 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.0069 0.0058 0.656 Qualified Solder ball compositions: Sn96.5/Ag3/Cu0.5 0.623 0.734 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E