Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight January, 2004 % of Total Pkg. Wt. Weight (g) Die 4.28% 0.221 Mold 36.85% 1.901 680 fpBGA 5.16 Grams with SnPb Solder Balls % of Total Weight (g) Pkg. Wt. 28.92% 4.61% 0.55% 0.74% 0.92% 0.92% 0.18% 1.493 0.238 0.029 0.038 0.048 0.048 0.010 Substance CAS # Notes / Assumptions: Silicon 7440-21-3 Die size: 17.25 x 17.72 mm Silica Epoxy resin Phenolic resin Brominated resin Mixed siloxanes Antimony Pent/Trioxide Carbon black 60676-86-0 129915-35-1 26834-02-6 68928-70-1 1309-64-4 1333-86-4 Mold Compound composition: 65 to 95% silica filler (LSC uses 78.5% in our calculation) 5 to 20% Epoxy resin (LSC uses 12.5% in our calculation) 0 to 3% Phenolic resin (LSC uses 1.5% in our calculation) 2% to unspecified maximum Brominated resin (LSC uses 2% in our calculation) 0 to 5% Mixed siloxanes (LSC uses 2.5% in our calculation) 0.6 to 5% Antimony Pent/Trioxide (LSC uses 2.5% in our calculation) 0.1 to1% Carbon black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc 7440-22-4 Die attach epoxy Density: 4 grams/cc D/A Epoxy 0.60% 0.031 Silver filled epoxy Wire 0.39% 0.020 Gold (Au) 7440-57-5 Solder Balls 15.55% 0.802 Tin (Sn) Lead (Pb) 7440-31-5 Solder ball composition Sn63/Pb37 7439-92-1 8.14% 7.41% Substrate 19.85% 1.024 Foil 22.49% 1.160 0.420 0.383 129915-35-1 BT Resin Copper (Cu) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com 1.00 mil diameter; 1 wire per solder ball 7440-50-8