Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 4.04% 0.222 Mold 34.02% 1.871 D/A Epoxy 0.57% 0.61% 0.0339 Solder Balls 20.33% 1.118 Foil 19.32% 21.10% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Die size: 17.25 x 17.72 mm Mold Compound composition: 75 to 95% Silica filler (LSC uses 88% in our calculation) 1 to 10% Epoxy resin (LSC uses 6% in our calculation) 2 to 8% Phenolic resin (LSC uses 6% in our calculation) Mold Compound Density ranges between 1.95 and 2.05 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 15% in our calculation) 1 to 5% Functionalized Urethane (LSC uses 5% in our calculation) 1.647 0.1123 0.1123 Silica Epoxy resin Phenol resin 60676-86-0 - 0.45% 0.09% 0.28% 0.0250 0.0047 0.0156 Silver (Ag) Organic esters and resins Functionalized Urethane 7440-22-4 - Gold (Au) 7440-57-5 Wire: 0.0127 mm (radius) Assume 1 wire per solder ball 19.62% 0.61% 0.10% 1.079 0.0335 0.0056 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Qualified Solder ball compositions: Sn96.5/Ag3/Cu0.5 13.14% 6.18% 0.723 0.340 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 1.063 1.160 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Notes / Assumptions: 29.94% 2.04% 2.04% 0.0313 Wire Substrate 1152 fpBGA 5.50 Grams