CSBGA Pbfree Auwire56

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
2.56%
0.0021
Mold
55.11%
0.0457
D/A Epoxy
0.41%
1.98%
0.0016
Solder Balls
7.10%
0.0059
Foil
25.40%
7.43%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 1.77 x 1.91 mm
46.85%
3.31%
3.31%
0.83%
0.11%
0.0389
0.0027
0.0027
0.0007
0.00009
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
0.33%
0.08%
0.0003
0.00007
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenol resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density between 1.9 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 90% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.0003
Wire
Substrate
56 csBGA
0.083
Grams
6.78%
0.28%
0.04%
0.0056
0.0002
0.00003
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn95.5/Ag4/Cu0.5
17.27%
8.13%
0.0143
0.0067
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0211
0.0062
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A3
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