CSBGA Pbfree Cuwire64

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
64 csBGA
0.047
Grams
December, 2012
% of Total Pkg.
Wt.
Weight (g)
% of Total
Weight (g)
Pkg. Wt.
Die
4.53%
0.0021
Mold
49.16%
0.0231
with SnAgCu Solder Balls
Copper Bond Wire version
MSL: 3
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.73%
1.85%
14.33%
20.30%
9.11%
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 1.77 x 1.91 mm
42.77%
2.46%
2.46%
1.35%
0.12%
0.02010
0.00116
0.00116
0.00064
0.00006
Silica fused
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 87% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
0.5 to 5% Metal hydroxide (LSC uses 2.75% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation)
0.58%
0.15%
0.00027
0.00007
Silver (Ag)
Organic esters & resins
7440-22-4
-
60 to 90% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
1.82%
0.03%
0.00085
0.00001
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5% Cu
1.5% Pd
13.77%
0.43%
0.07%
0.0065
0.0002
0.00003
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305)
13.80%
6.50%
0.0065
0.0031
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.00034
0.0009
0.0067
0.0095
0.0043
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K
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