CSBGA Pbfree Auwire100

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
May, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
5.85%
0.00859
Mold
65.03%
0.09560
100 csBGA
0.147
Grams
% of Total
Weight (g)
Pkg. Wt.
55.28%
3.90%
3.90%
0.98%
0.13%
0.85%
D/A Epoxy
0.94%
Wire
2.00%
0.00293
Solder Balls
7.16%
0.01053
Foil
11.56%
7.46%
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
0.08126
0.00574
0.00574
0.00143
0.00019
0.00124
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
Other (trade secret)
60676-86-0
1333-86-4
-
0.0011
0.0003
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4.0 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball; wire length 3 mm
0.00139
0.76%
0.19%
Substrate
with SnAgCu Solder Balls
Notes / Assumptions:
Die size: 4.71 x 2.90 mm
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenol resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
6.84%
0.29%
0.04%
0.0101
0.0004
0.00005
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn95.5/Ag4/Cu0.5
7.86%
3.70%
0.0116
0.0054
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.01700
0.01096
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A4
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