CSBGA Pbfree Cuwire100

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
5.85%
0.0086
Mold
66.11%
0.0972
100 csBGA
0.147
Grams
% of Total
Weight (g)
Pkg. Wt.
56.19%
3.97%
3.97%
0.99%
0.13%
0.86%
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.94%
0.92%
7.16%
11.56%
7.46%
with SnAgCu Solder Balls
0.08260
0.00583
0.00583
0.00146
0.00019
0.00126
Cu Wire Version
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
Other (trade secret)
60676-86-0
1333-86-4
-
Notes / Assumptions:
Die size: 4.71 x 2.90 mm
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenol resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
0.76%
0.19%
0.00111
0.00028
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4.0 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
0.91%
0.01%
0.00134
0.00002
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5% Cu
1.5% Pd
6.91%
0.21%
0.04%
0.01016
0.00032
0.00005
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5
7.86%
3.70%
0.01156
0.0054
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0014
0.0014
0.0105
0.0170
0.0110
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. K
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