CSBGA Halogenfree Auwire132_ice65

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
April, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
6.13%
0.0065
Mold
53.35%
0.0566
Tape
Wire
Solder Balls
Substrate
0.30%
0.89%
11.19%
28.14%
132 LBGA
0.106
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 148 X 118 MIL
48.01%
2.93%
2.40%
0.0510
0.0031
0.0026
Silica
Epoxy Resin(1)
Phenol Resin-1
60676-86-0
Trade secret
Trade secret
KE-G1250LKDS
75 to 95% Fused silica filler (LSC uses 90% in our calculation)
1 to 10% Epoxy resin (LSC uses 5.5% in our calculation)
2 to 7% Phenol resin (LSC uses 4.5% in our calculation)
0.036%
0.036%
0.018%
0.208%
0.00004
0.00004
0.00002
0.00022
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
25038-59-9
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Trade secret
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FH-900-HR-9004
10 to 20% (LSC uses 12% in our calculation)
10 to 20% (LSC uses 12% in our calculation)
1 to 10% (LSC uses 6% in our calculation)
65 to 75% (LSC uses 70% in our calculation)
0.882%
0.009%
0.00094
0.00001
Gold (Au)
Palladium (Pd)
7440-57-5
7440-05-3
11.025%
0.112%
0.056%
0.01170
0.00012
0.00006
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
13.400%
8.510%
4.020%
2.009%
0.200%
0.0142
0.0090
0.0043
0.0021
0.0002
BT Resin CCL-HL832NX
Copper
Solder mask PSR4000 AUS 308
Nickel plating
Gold plating
Trade secret
7440-50-8
Trade secret
7440-02-0
7440-57-5
0.0003
0.00095
0.0119
0.0299
0.7 MIL GPG-3 (2N)
99% Au
1% Pd
SAC105
Solder ball composition Sn98.5/Ag1.0/Cu0.5%
CCL-HL832NX, AUS 308
47.6%
30.2%
14.3%
7.1%
0.7%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
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