CSBGA Halogenfree Cuwire184

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
March, 2013
% of Total
Pkg. Wt.
Weight (g)
Die
4.50%
0.0078
Mold
49.65%
0.0864
D/A Epoxy
Wire
Solder Balls
Substrate
0.65%
5.29%
9.50%
30.41%
184 csBGA
0.174
Grams
with SnAgCu Solder Balls
Copper Bond Wire
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 143 x 147 mil
41.31%
2.48%
0.74%
2.48%
2.48%
0.15%
0.0719
0.0043
0.0013
0.0043
0.0043
0.0003
Silica fused
Epoxy Resin A
Epoxy Resin B
Phenol Novolac
Metal Hydroxide
Carbon Black
60676-86-0
9003-35-4
1333-86-4
Mold Compound: EME-G750E
75 to 95% Fused silica filler (LSC uses 83.2% in our calculation)
2 to 8% Epoxy resin A (LSC uses 5% in our calculation)
0.5 to 2.5% Epoxy resin B (LSC uses 1.5% in our calculation)
2 to 8% Phenol Novolac (LSC uses 5% in our calculation)
2 to 8% Metal Hydroxide (LSC uses 5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.3% in our calculation)
0.90%
0.22%
0.0009
0.0002
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Die attach epoxy: Ablebond 2100A
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
5.15%
0.14%
0.0074
0.0018
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
10.70%
0.45%
0.06%
0.0160
0.0005
0.0001
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
20.69%
2.53%
5.07%
0.84%
0.03%
4.39%
0.0116
0.0044
0.0088
0.0015
0.0001
0.0054
BT Resin CCL-HL832NX
Copper
Solder Mask-PSR4000 AUS 308
Nickel plating
Gold plating
Copper thickness in hole
7440-50-8
7440-02-0
7440-57-5
7440-50-8
0.0011
0.0092
0.0165
0.0529
SAC305
Solder ball composition Sn96.5/Ag3/Cu0.5
CCL-HL832NX
68.06%
8.33%
16.67%
2.78%
0.11%
4.17%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
Similar pages