CSBGA Halogenfree Auwire284_ice40

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
April, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.45%
0.0037
Mold
48.55%
0.1244
Tape
Wire
Solder Balls
Substrate
0.07%
1.15%
9.97%
38.80%
284 LBGA
0.256
Grams
with SnAgCu Solder Balls
iCE40
MSL: 3
Peak Reflow Temp: 260°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 106 X 94 MIL
43.70%
2.67%
2.18%
0.1120
0.0068
0.0056
Silica
Epoxy Resin(1)
Phenol Resin-1
60676-86-0
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KE-G1250LKDS
75 to 95% Fused silica filler (LSC uses 90% in our calculation)
1 to 10% Epoxy resin (LSC uses 5.5% in our calculation)
2 to 7% Phenol resin (LSC uses 4.5% in our calculation)
0.018%
0.018%
0.004%
0.049%
0.00002
0.00002
0.00001
0.00013
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
25038-59-9
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FH-900T-25
10 to 20% (LSC uses 12% in our calculation)
10 to 20% (LSC uses 12% in our calculation)
1 to 10% (LSC uses 6% in our calculation)
65 to 75% (LSC uses 70% in our calculation)
1.138%
0.011%
0.0029
0.00003
Gold (Au)
Palladium (Pd)
7440-57-5
7440-05-3
9.82%
0.10%
0.05%
0.0252
0.0003
0.0001
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
10.92%
8.19%
3.28%
4.09%
2.73%
0.05%
8.19%
1.37%
0.0280
0.0210
0.0084
0.0105
0.0070
0.0001
0.0210
0.0035
BT Resin (1)(3) GHPL-830NX(A)
BT Resin (2) CCL-HL832NX(A-HS)
Copper (1)(4)
Copper (2)(3)
Copper thickness in hole
Nickel plating
Gold plating
Solder mask PSR4000 AUS 308
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7440-50-8
7440-50-8
7440-50-8
7440-02-0
7440-57-5
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0.0002
0.0030
0.0256
0.0995
0.7 MIL GPG-3 (2N)
99% Au
1% Pd
SAC105
Solder ball composition Sn98.5/Ag1.0/Cu0.5%
GHPL-830NX(A), CCL-HL832NX(A-HS), AUS308
28.1%
21.1%
8.4%
10.5%
7.0%
0.1%
21.1%
3.5%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. A
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