CSBGA Halogenfree Auwire328

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
August, 2012
% of Total Pkg.
Wt.
Weight (g)
Die
4.49%
0.0139
Mold
49.30%
0.1528
D/A Epoxy
0.69%
1.68%
0.0052
Solder Balls
11.11%
0.0344
Foil
20.48%
12.26%
% of Total
Weight (g)
Pkg. Wt.
with SnAgCu Solder Balls
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 4.60 x 5.20 mm
44.37%
2.96%
1.97%
0.10%
0.1375
0.0092
0.0061
0.0003
Silica
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
1333-86-4
0.55%
0.14%
0.0017
0.0004
Silver (Ag)
Organic esters & resins
7440-22-4
-
Mold Compound composition:
86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation)
1.5 to 7% Epoxy resin (LSC uses 6% in our calculation)
1 to 6% Phenol resin (LSC uses 4% in our calculation)
0.2% Carbon Black
Mold Compound Density ranges between 1.99 and 2.09 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
1 wire per solder ball
0.0021
Wire
Substrate
328 csBGA
0.31
Grams
10.72%
0.33%
0.06%
0.0332
0.0010
0.00017
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305)
13.92%
6.55%
0.0432
0.0203
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0635
0.0380
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. J
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