CABGA Pbfree Auwire49

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
2.48%
0.0031
Mold
51.11%
0.064
D/A Epoxy
0.40%
1.15%
0.0014
Solder Balls
14.87%
0.0186
Foil
23.27%
6.71%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Substance
Silicon chip
43.44%
3.07%
3.07%
0.77%
0.10%
0.054
0.004
0.0038
0.0010
0.00013
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
0.32%
0.08%
0.0004
0.00010
Silver filled epoxy
Silver (Ag)
Organic esters and resins
0.0005
Wire
Substrate
49 caBGA
0.125
Grams
Gold (Au)
14.20%
0.59%
0.07%
0.0178
0.0007
0.00009
Tin (Sn)
Silver (Ag)
Copper (Cu)
15.82%
7.45%
0.0198
0.0093
Glass fiber
BT Resins
Notes / Assumptions:
7440-21-3 Die size: 1.7 x 2.9 mm
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenol resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
7440-22-4 60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Resins (LSC uses 20% in our calculation)
60676-86-0
1333-86-4
7440-57-5 1.00 mil diameter; 1 wire per solder ball; wire length 3 mm
7440-31-5 Solder ball composition Sn95.5/Ag4.0/Cu0.5%
7440-22-4
7440-50-8
0.0291
0.0084
Copper (Cu)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
CAS #
65997-17-3 60 to 75% glass fiber (LSC uses 68% in our calculation)
7440-50-8
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