Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 2.48% 0.0031 Mold 51.11% 0.064 D/A Epoxy 0.40% 1.15% 0.0014 Solder Balls 14.87% 0.0186 Foil 23.27% 6.71% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Substance Silicon chip 43.44% 3.07% 3.07% 0.77% 0.10% 0.054 0.004 0.0038 0.0010 0.00013 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 0.32% 0.08% 0.0004 0.00010 Silver filled epoxy Silver (Ag) Organic esters and resins 0.0005 Wire Substrate 49 caBGA 0.125 Grams Gold (Au) 14.20% 0.59% 0.07% 0.0178 0.0007 0.00009 Tin (Sn) Silver (Ag) Copper (Cu) 15.82% 7.45% 0.0198 0.0093 Glass fiber BT Resins Notes / Assumptions: 7440-21-3 Die size: 1.7 x 2.9 mm Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 83% in our calculation) 2 to 10% Epoxy resin (LSC uses 7.5% in our calculation) 2 to 10% Phenol resin (LSC uses 7.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 7440-22-4 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Resins (LSC uses 20% in our calculation) 60676-86-0 1333-86-4 7440-57-5 1.00 mil diameter; 1 wire per solder ball; wire length 3 mm 7440-31-5 Solder ball composition Sn95.5/Ag4.0/Cu0.5% 7440-22-4 7440-50-8 0.0291 0.0084 Copper (Cu) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com CAS # 65997-17-3 60 to 75% glass fiber (LSC uses 68% in our calculation) 7440-50-8