CABGA SNPB Auwire49

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
2.46%
0.003
Mold
48.81%
0.062
D/A Epoxy
0.40%
1.14%
0.0014
Solder Balls
17.44%
0.022
Foil
23.08%
6.66%
with SnPb Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Substance
Silicon chip
Notes / Assumptions:
7440-21-3 Die size: 1.7 x 2.9 mm
Mold Compound composition:
65 to 95% Fused silica filler (LSC uses 84% in our calculation)
4 to 28% Epoxy/Phenol resins (LSC uses 8.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 1.0% Carbon Black (LSC uses 0.5% in our calculation)
1-5% Siloxanes (LSC uses 3% in our calculation)
<2% Brominated Epoxy Resin (LSC uses 1% in our calculation)
0.1-1% Antimony Trioxide (LSC uses 0.5% in our calculation)
1% Antimony Pentoxide (LSC uses 1% in our calculation)
Mold Compound Density between 1.8 and 2.1 grams/cc
0.052
0.005
0.0009
0.0031
0.0018
0.0006
0.0003
0.0006
Silica
Epoxy/Phenol Resin
Metal hydroxide
Carbon black
Siloxanes
Brominated Epoxy Resin
Antimony Trioxide
Antimony Pentoxide
60676-86-0
1333-86-4
68928-70-1
1344-28-1
1314-60-9
0.32%
0.08%
0.0004
0.0001
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4 Die attach epoxy Density: 4 grams/cc
-
Gold (Au)
7440-57-5 1.00 mil diameter; 1 wire per solder ball
10.99%
6.45%
0.014
0.008
Tin (Sn)
Lead (Pb)
7440-31-5 Solder ball composition Sn63/Pb37
7439-92-1
15.70%
7.39%
0.0198
0.0093
Glass fiber
BT Resins
65997-17-3 60 to 75% glass fiber (LSC uses 68% in our calculation)
-
0.029
0.008
Copper (Cu)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
CAS #
41.00%
4.15%
0.73%
2.44%
1.46%
0.49%
0.24%
0.49%
0.0005
Wire
Substrate
49 caBGA
0.126
Grams
7440-50-8
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