Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 3.46% 0.0093 Mold 52.49% 0.1407 D/A Epoxy 0.56% 1.09% 0.0029 Solder Balls 14.16% 0.0380 Foil 21.85% 6.39% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 3.53 x 4.17 mm 44.62% 3.15% 3.15% 0.79% 0.10% 0.1196 0.0084 0.0084 0.0021 0.0003 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.45% 0.11% 0.0012 0.0003 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 83% in our calculation) 2 to 10% Epoxy resin (LSC uses 7.5% in our calculation) 2 to 10% Phenol resin (LSC uses 7.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.9 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball; wire length 3 mm 0.0015 Wire Substrate 100 caBGA 0.27 Grams 13.52% 0.57% 0.07% 0.0362 0.0015 0.0002 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn95.5/Ag4.0/Cu0.5% 14.86% 6.99% 0.0398 0.0187 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0586 0.0171 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A3