CABGA Pbfree Cuwire256

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.74%
0.0093
Mold
51.18%
0.2723
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.28%
0.65%
18.26%
21.57%
6.31%
256 caBGA
0.532
Grams
with SnAgCu Solder Balls
Copper Bond Wire Version
MSL: 3
Peak Reflow Temp: 260°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 3.53 x 4.17 mm
42.48%
3.84%
3.84%
0.77%
0.26%
0.2260
0.0204
0.0204
0.0041
0.0014
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
0.22%
0.06%
0.0012
0.0003
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 83% in our calculation)
2 to 10% Epoxy resin (LSC uses 7.5% in our calculation)
2 to 10% Phenal resin (LSC uses 7.5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Resins (LSC uses 20% in our calculation)
0.64%
0.01%
0.00342
0.00005
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
17.62%
0.55%
0.09%
0.0937
0.0029
0.0005
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
14.67%
6.90%
0.0780
0.0367
BT Resin
Fibrous-glass-wool
Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.0015
0.0035
0.0971
0.1148
0.0336
Solder ball composition Sn95.5/Ag3.0/Cu0.5%
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K
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