CABGA SNPB Auwire256

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
July, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
1.74%
0.009
Mold
47.10%
0.251
D/A Epoxy
0.28%
1.41%
0.0075
Solder Balls
21.58%
0.115
Foil
21.57%
6.31%
with SnPb Solder Balls
MSL: 3
Peak Reflow Temp: 240°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 3.53 x 4.17 mm
34.85%
9.42%
0.24%
0.47%
0.47%
1.41%
0.24%
0.1854
0.0501
0.0013
0.0025
0.0025
0.0075
0.0013
Silica (fused or amorphous)
Epoxy/Phenol Resins
Antimony Trioxide
Antimony Pentoxide
Brominated Epoxy Resin
Siloxanes
Carbon Black
60676-86-0
1309-64-4
1314-60-9
1333-86-4
0.22%
0.06%
0.0012
0.0003
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
67 to 85% Fused silica filler (LSC uses 74% in our calculation)
15 to 28% Epoxy/Phenol resins (LSC uses 20% in our calculation)
0.1 to 1% Antimony Trioxide (LSC uses 0.5% in our calculation)
1% Antimony Pentoxide (LSC uses 1% in our calculation)
<2% Brominated Epoxy Resin (LSC uses 1% in our calculation)
1 to 5% Siloxanes (LSC uses 3% in our calculation)
0.1 to 1% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
1.00 mil diameter; 1 wire per solder ball
Solder ball composition Sn63/Pb37%
0.0015
Wire
Substrate
256 caBGA
0.532
Grams
13.60%
7.99%
0.0723
0.0425
Tin (Sn)
Lead (Pb)
7440-31-5
7440-50-8
14.67%
6.90%
0.0780
0.0367
BT Resin
Fibrous-glass-wool
Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.1148
0.0336
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B
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