CABGA Halogenfree Cuwire256_ice40

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
April, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
0.88%
0.00375
Mold
61.36%
0.2609
Tape
Wire
Solder Balls
Substrate
0.04%
0.37%
16.50%
20.84%
256 LBGA
0.425
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
iCE40
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 106 X 95 MIL
55.22%
3.37%
2.76%
0.2348
0.0144
0.0117
Silica
Epoxy Resin(1)
Phenol Resin-1
60676-86-0
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KE-G1250LKDS
75 to 95% Fused silica filler (LSC uses 90% in our calculation)
1 to 10% Epoxy resin (LSC uses 5.5% in our calculation)
2 to 7% Phenol resin (LSC uses 4.5% in our calculation)
0.005%
0.005%
0.003%
0.030%
0.00002
0.00002
0.00001
0.00013
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
25038-59-9
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TAPE FH-900T-25_HR9004
10 to 20% (LSC uses 12% in our calculation)
10 to 20% (LSC uses 12% in our calculation)
1 to 10% (LSC uses 6% in our calculation)
65 to 75% (LSC uses 70% in our calculation)
0.363%
0.010%
0.0015
0.00004
Copper (Cu)
Palladium (Pd)
Total of impurities
7440-57-5
7440-05-3
NA
15.92%
0.495%
0.083%
0.06769
0.00210
0.00035
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
9.53%
2.38%
5.95%
0.99%
0.04%
1.98%
0.0405
0.0101
0.0253
0.0042
0.0002
0.0084
BT Resin CCL-HL832NX (A-HS)
Copper
Solder mask PSR4000 AUS 308
Nickel plating
Gold plating
Copper thickness in hole
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7440-50-8
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7440-02-0
7440-57-5
7440-50-8
0.00018
0.0016
0.0701
0.0886
EX1 0.7 MIL Pd Coated
>97.8% Cu
<2.7% Pd
<0.02%
SAC305
Solder ball composition Sn96.5/Ag3.0/Cu0.5%
CCL-HL832NX(A-HS), AUS 308
45.7%
11.4%
28.6%
4.8%
0.2%
9.5%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A
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