CABGA Halogenfree Auwire332

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
March, 2011
% of Total
Pkg. Wt.
Weight (g)
Die
0.72%
0.0075
Mold
45.04%
0.469
D/A Epoxy
0.10%
0.91%
0.0095
Solder Balls
11.32%
0.1177
Foil
27.29%
14.62%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 3.40 x 3.50 mm
40.53%
2.70%
1.80%
0.09%
0.422
0.028
0.019
0.0009
Silica
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
1333-86-4
0.08%
0.02%
0.0008
0.0002
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation)
1.5 to 7% Epoxy resin (LSC uses 6% in our calculation)
1 to 6% Phenol resin (LSC uses 4% in our calculation)
0.2% Carbon Black
Mold Compound Density ranges between 1.99 and 2.09 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.0114 mm (radius)
0.0011
Wire
Substrate
332 caBGA
1.04
Grams
10.86%
0.40%
0.06%
0.1130
0.0041
0.0006
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5
18.56%
8.73%
0.1930
0.0908
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.284
0.152
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. C
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