Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight July, 2012 % of Total Pkg. Wt. Weight (g) Die 8.59% 0.00130 Mold 55.74% 0.00842 Tape Wire Solder Balls Substrate 0.42% 0.54% 2.79% 31.92% 49 LBGA 0.015 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. iCE40 Halogen-free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 59 X 59 MIL 50.17% 3.07% 2.51% 0.00758 0.00046 0.00038 Silica Epoxy Resin(1) Phenol Resin-1 60676-86-0 Trade secret Trade secret KE-G1250LKDS 75 to 95% Fused silica filler (LSC uses 90% in our calculation) 1 to 10% Epoxy resin (LSC uses 5.5% in our calculation) 2 to 7% Phenol resin (LSC uses 4.5% in our calculation) 0.050% 0.050% 0.025% 0.291% 0.00001 0.00001 0.00000 0.00004 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 25038-59-9 Trade secret Trade secret Trade secret FH-900-HR-9004 10 to 20% (LSC uses 12% in our calculation) 10 to 20% (LSC uses 12% in our calculation) 1 to 10% (LSC uses 6% in our calculation) 65 to 75% (LSC uses 70% in our calculation) 0.882% 0.009% 0.00008 0.00000 Copper (Cu) Palladium (Pd) 7440-50-8 7440-05-3 11.025% 0.112% 0.056% 0.00041 0.00000 0.00000 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 15.200% 9.650% 4.560% 2.280% 0.230% 0.00230 0.00146 0.00069 0.00034 0.00003 BT Resin CCL-HL832NX Copper Solder mask PSR4000 AUS 308 Nickel plating Gold plating Trade secret 7440-50-8 Trade secret 7440-02-0 7440-57-5 0.00006 0.00008 0.00042 0.00482 0.7 MIL Pd coated 99% Au 1% Pd SAC105 Solder ball composition Sn98.5/Ag1.0/Cu0.5% CCL-HL832NX, AUS 308 47.7% 30.3% 14.3% 7.1% 0.6% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A