Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 10.17% 0.0031 Mold 43.27% 0.013 D/A Epoxy 1.64% 2.67% 0.0008 Solder Balls 12.94% 0.0039 Foil 19.03% 10.28% % of Total Weight (g) Pkg. Wt. with SnAgCu Solder Balls MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 2.31 x 2.10 mm 37.64% 2.16% 2.16% 1.19% 0.11% 0.0113 0.0006 0.0006 0.0004 0.00003 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 1.31% 0.33% 0.0004 0.0001 Silver filled epoxy Silver (Ag) Organic esters & resins 7440-22-4 - Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 87% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0.5 to 5% Metal hydroxide (LSC uses 2.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) Mold Compound Density ranges between 1.9 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.80 mil diameter; 1 wire per solder ball 0.0005 Wire Substrate 64 ucBGA 0.03 Grams 12.49% 0.39% 0.06% 0.0037 0.00012 0.00002 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305) 12.94% 6.09% 0.0039 0.0018 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0057 0.0031 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A3