Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight August, 2008 % of Total Pkg. Wt. Weight (g) Die 0.61% 0.009 Mold 74.16% 1.149 D/A Epoxy 0.05% 20 PDIP 1.55 Grams with Matte Sn Plating % of Total Weight (g) Pkg. Wt. Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 3.0 x 2.7 x 0.50 mm 63.55% 4.45% 4.45% 1.48% 0.22% 0.985 0.069 0.069 0.023 0.003 Silica Fused Epoxy Resin Phenol Resin Epoxy, Cresol Novolac Carbon black 60676-86-0 29690-82-2 1333-86-4 Mold Compound Density between 1.7 and 2.1 grams/cc 75 to 95% Silica Fused (LSC uses 85.7% in our calculation) 2 to 8% Epoxy Resin (LSC uses 6% in our calculation). 2 to 8% Phenol Resin (LSC uses 6% in our calculation) 1 to 3% Cresol Novolac Epoxy (LSC uses 2% in our calculation). 0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) 0.03% 0.02% 0.0005 0.0003 Silver-filled epoxy Silver (Ag) other 7440-22-4 - Die attach epoxy Density: 4 grams/cc (silver content: 60-100%; LSC uses 80% in our calculation) 0.0008 Wire 0.04% 0.0006 Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 1.77% 0.027 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is >10.2 um Leadframe 23.37% 0.362 Copper (Cu) Iron (Fe) Zinc (Zn) Phosphorus (P) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Leadframe thickness is nominal (per Case Outline) 97.46% Cu 2.35% Fe 0.12% Zn 0.07% P 22.78% 0.55% 0.03% 0.02% 0.353 0.009 0.0004 0.0003 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com