Chapter 1: Package Design

 Chapter 1 Package Design
CHAPTER 1 PACKAGE DESIGN
Package Codes
Product Date Codes
Flammability Rating
Oxygen Index
Ball Grid Array
Land Grid Array
Leadframe
Packages and Packing Methodologies Handbook
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 Chapter 1 Package Design
PACKAGE CODES
The following two tables—"Package Codes for Spansion Memory Products" and "Die and Wafer
Package Codes for Spansion Memory Products"—provide the definitions of the internal package
codes for each package design, the data being grouped by package family type.
Package Codes for Spansion Memory Products
Package Code
Description
Ball Grid Array (BGA)
ALD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.1 mm maximum height
ALF
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.05 mm maximum height
ALG
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.1 mm maximum height
ALH
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15.00 mm x 15.00 mm body size, 1.1 mm maximum height
ALJ
Fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm pitch; 12.0
mm x 12.0 mm body size, 1.15 mm maximum height
ALK
Fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm pitch; 13.0
mm x 11.5 mm body size, 1.2 mm maximum height
AMA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15.00 mm x 15.00 mm body size, 1.2 mm maximum height
AMB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.15 mm maximum height
ASA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 11.00 mm x 8.00 mm body size, 1.2 mm maximum height
ASB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.2 mm maximum height
ASC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 12.00 mm x 12.00 mm body size, 1.1 mm maximum height
ASD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 13.00 mm x 8.00 mm body size, 1.2 mm maximum height
ASE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15.00 mm x 15.00 mm body size, 1.1 mm maximum heigh
ASF
Fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm pitch; 12.00
mm x 12.00 mm body size, 1.15 mm maximum height
ASH
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 11.00 mm x 9.00 mm body size, 1.2 mm maximum height
ATA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15.00 mm x 15.00 mm body size, 1.2 mm maximum height
BEA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 13.00 mm x 8.00 mm body size, 1.4 mm maximum height
BFA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 13.00 mm x 9.00 mm body size, 1.4 mm maximum height
BNA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 13.00 mm x 11.50 mm body size, 1.4 mm maximum height
BNB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 13.00 mm x 9 mm body size, 1.4 mm maximum height
BTA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15.00 mm x 15.00 mm body size, 1.25 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
BWA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 14 mm x 14 mm body size, 1.7 mm maximum height
BWB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm
pitch; 15 mm x 15 mm body size, 1.3 mm maximum height
FAA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm
pitch; 13 mm x 10 mm body size, 1.2 mm maximum height
FAB
Thin profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 8
mm x 6 mm body size, 1.2 mm maximum height
FAC
Thin profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 8
mm x 6 mm body size, 1.2 mm maximum height
FBA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 8.15 mm x 6.15 mm body size, 1.2 mm maximum height
FBB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 9.00 mm x 6.0 mm body size, 1.2 mm maximum height
FBC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 9.00 mm x 8.00 mm body size, 1.2 mm maximum height
FBD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 14.00 mm x 8.00 mm body size or 12.00 mm x 6.0 mm body size, 1.2 mm maximum height
FBE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 15.00 mm x 8.0 mm body size or 12.00 mm x 11.00 mm body size, 1.2 mm maximum height
FBF
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals 0.5 mm
pitch; 9.2 mm x 8 mm body size, 1.2 mm maximum height
FDD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals 0.5 mm
pitch; 10 mm x 7 mm body size, 1.2 mm maximum height
FDE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals 0.5 mm
pitch; 10 mm x 11 mm body size, 1.2 mm maximum height
FEA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FEB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FEC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch, 11 mm x 8 mm body size, 1.3 mm maximum height
FED
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height, minimum ball height 0.21 mm
FEE
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch, 11 mm x 8 mm body size, 1.4 mm maximum height
FEF
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch, 11 mm x 9 mm body size, 1.4 mm maximum height
FFA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FFB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FFC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 9 mm body size, 1.55 mm maximum height
FFD
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 9 mm body size, 1.55 mm maximum height
FIA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
FIB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.6 mm maximum height
FJA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.6 mm maximum height
FLA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11 mm x 8 mm body size, 1.4 mm maximum height
FLB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FLG
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11 mm x 9 mm body size, 1.4 mm maximum height
FLJ
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FLK
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 9 mm body size, 1.4 mm maximum height
FMB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 13 mm x 9 mm body size, 1.4 mm maximum height
FMC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FMD
ow profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FME
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 11 mm x 9 mm body size, 1.4 mm maximum height
FMI
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 13 mm x 11 mm body size, 1.4 mm maximum height
FND
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.4 mm maximum height
FOA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.55 mm maximum height
FPB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 9 mm body size, 1.55 mm maximum height
FSA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 11 mm body size, 1.7 mm maximum height
FSB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.55 mm maximum height
FSC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FSD
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals, 0.8 mm
pitch; 11.95 mm x 10.95 mm body size, 1.4 mm maximum height
FTA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8 mm body size, 1.4 mm maximum height
FTD
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.5 mm x 9 mm body size, 1.4 mm maximum height
FTE
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 9 mm body size, 1.4 mm maximum height
FTF
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FTG
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
FTI
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FTJ
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11 mm x 9 mm body size, 1.4 mm maximum height
FTK
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 10.5 mm body size, 1.4 mm maximum height
FTL
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 9.0 mm body size, 1.4 mm maximum height
FTM
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11.0 mm body size, 1.4 mm maximum height
FUB
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FVC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 9.0 mm body size, 1.6 mm maximum height
FVE
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.55 mm maximum height
FWA
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12 mm x 9 mm body size, 1.4 mm maximum height
FWC
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.4 mm maximum height
FWD
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13 mm x 11 mm body size, 1.4 mm maximum height
LAA
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.4 mm maximum height
LAB
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 15
mm x 10 mm body size, 1.4 mm maximum height
LAC
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 12
mm x 18 mm body size, 1.4 mm maximum height
LAD
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 11
mm x 9 mm body size, 1.4 mm maximum height
LAE
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 9.0
mm x 9.0 mm body size, 1.4 mm maximum height
LIA
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.6 mm maximum height
LSA
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.7 mm maximum height
LSB
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.6 mm maximum height
LSC
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 18
mm x 12 mm body size, 1.6 mm maximum height
LSE
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.4 mm maximum height
LSF
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.6 mm maximum height
LSG
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.4 mm maximum height
LSH
Low profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 13
mm x 11 mm body size, 1.4 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
MMB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 13.0 mm x 11.0 mm body size, 1.4 mm maximum height
MTA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 11.0 mm x 10.0 mm body size, 1.3 mm maximum height
NLA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 10.95 mm x 9.95 mm body size, 1.2 mm maximum height
NLB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 8.0 mm x 9.2 mm body size, 1.2 mm maximum height
NLC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 11 mm x 10 mm body size, 1.2 mm maximum height
NLD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 7.7 mm x 6.2 mm body size, 1.2 mm maximum height
NLE
Low profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 8.00 mm x 8.00 mm body size, 1.1 mm maximum height
NSA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 10.95 mm x 9.95 mm body size, 1.2 mm maximum height
NSB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 9.2 mm x 8.0 mm body size, 1.2 mm maximum height
NSC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 8.0 mm x 8.0 mm body size, 1.1 mm maximum height
NSD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 7.7 mm x 6.2 mm body size, 1.2 mm maximum height
NSE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5 mm
pitch; 10.0 mm x 8.0 mm body size, 1.2 mm maximum height
PIA
Ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 18 mm x 14 mm
body size, 1.8 mm maximum height
PNA
Ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 18 mm x 14 mm
body size, 1.8 mm maximum height
RLA
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.7 mm x 6.2 mm body size, 1.0 mm maximum height
RLB
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 8.0 mm x 8.0 mm body size, 1.0 mm maximum height
RLD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 11.0 mm x 10.0 mm body size, 1.0 mm maximum height
RLE
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 11.0 mm x 10.0 mm body size, 1.0 mm maximum height
RLF
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.5 mm x 5.0 mm body size, 1.0 mm maximum height
RLG
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 6.0 mm x 5.0 mm body size, 1.0 mm maximum height
RSB
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.5 mm x 5.0 mm body size, 1.0 mm maximum height
RSC
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 8.0 mm x 8.0 mm body size, 1.0 mm maximum height
RSD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.7 mm x 6.2 mm body size, 1.0 mm maximum height
RSE
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 6.0 mm x 5.0 mm body size, 1.0 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
TLA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm
pitch; 11.6 mm x 8 mm body size, 1.2 mm maximum height
TLB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 10.0 mm x 8.0 mm body size, 1.2 mm maximum height
TLC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8.0 mm body size, 1.2 mm maximum height
TLD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12.0 mm x 9.0 mm body size, 1.2 mm maximum height
TLE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.0 mm x 8.0 mm body size, 1.2 mm maximum height
TLF
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 8.15 mm x 6.15 mm body size, 1.2 mm maximum height
TLH
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 10.5 mm body size, 1.2 mm maximum height
TLI
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.0 mm x 9.0 mm body size, 1.2 mm maximum height
TLJ
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 10.0 mm x 10.0 mm body size, 1.2 mm maximum height
TLK
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 11.0 mm body size, 1.2 mm maximum height
TLM
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.5 mm x 9.0 mm body size, 1.2 mm maximum height
TMA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12.00 mm x 9.00 mm body size, 1.2 mm maximum height
TMB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.00 mm x 11.00 mm body size, 1.2 mm maximum height
TSA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.0 mm x 8.0 mm body size, 1.2 mm maximum height
TSB
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8.0 mm body size, 1.2 mm maximum height
TSC
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 9.0 mm x 7.0 mm body size, 1.2 mm maximum height
TSD
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 12.0 mm x 9.0 mm body size, 1.2 mm maximum height
TSE
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 10.0 mm x 8.0 mm body size, 1.2 mm maximum height
TSF
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 10.5 mm body size, 1.2 mm maximum height
TSG
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.0 mm x 9.0 mm body size, 1.2 mm maximum height
TSH
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.5 mm x 9.0 mm body size, 1.2 mm maximum height
TTA
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 11.6 mm x 8.0 mm body size, 1.2 mm maximum height
T3A
Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm
pitch; 13.0 mm x 11.0 mm body size, 1.2 mm maximum height
UDA
Ultra thin fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.50 mm
pitch; 6.0 mm x 5.00 mm body size, 0.52 mm maximum height
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
VBB
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals (80
ball); 11.50 mm x 9.00 mm package body size, 1.0 mm maximum height, 0.8 mm pitch
VBC
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 11.95
mm x 10.95 mm package body size, 1.0 mm maximum height, 0.8 mm pitch
VBD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 8.95
mm x 7.95 mm package body size, 1.0 mm maximum height, 0.8 mm pitch
VBE
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 11.95
mm x 9.65 mm package body size, 1.0 mm maximum height, 0.8 mm pitch
VBF
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 8.15
mm x 6.15 mm package body size, 1.0 mm maximum height, 0.8 mm pitch
VBG
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11 mm x 8 mm body size, 1.0 mm maximum height
VBH
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11.6 mm x 8 mm body size, 1.0 mm maximum height
VBJ
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 8.95 mm x 7.95 mm body size, 1.0 mm maximum height
VBK
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 8.15 mm x 6.15 mm body size, 1.0 mm maximum height
VBL
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11 mm x 8 mm body size, 1.0 mm maximum height
VBM
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11 mm x 9 mm body size, 1.0 mm maximum height
VBN
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 10 mm x 6 mm body size, 1.0 mm maximum height
VBP
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 13 mm x 11 mm x 1.0 mm body size, 14 mm x 10 mm ball matrix, 1.0 mm maximum
height
VBR
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 9 mm x 7 mm x body size, 1.0 mm maximum height
VBS
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11.95 mm x 9.65 mm x body size, 1.0 mm maximum height
VBU
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 9 mm x 7 mm body size, 1.0 mm maximum height
VBV
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 10.0 mm x 10.0 mm body size, 1.0 mm maximum height
VBW
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 10.0 mm x 8.0 mm body size, 1.0 mm maximum height
VBY
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 12.0 mm x12.0 mm body size, 1.0 mm maximum height
VCD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.75
mm pitch, 9.00 mm x 7.70 mm body size, 1.0 mm maximum height
VCA
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.75
mm pitch, 9.3 mm x 7.70 mm package body size, 1.0 mm maximum height
VCB
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.75
mm pitch, 7.8 mm x 9.0 mm package body size, 1.0 mm maximum height
VCC
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 11.00
mm x 9.00 mm package body size, 1.0 mm maximum height, 9 mm x 8 mm depopulated ball
matrix with 0.8 mm pitch
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
VCE
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.75
mm pitch, 9.0 mm x 7.7 mm x body size, 1.0 mm maximum height
VDA
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch; 8 mm x 9.2 mm body size, 1.0 mm maximum height
VDC
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 10.95 mm x 9.95 mm body size, 1.0 mm maximum height
VDD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 9.2 mm x 8.0 mm body size, 1.0 mm maximum height
VDE
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 6.2 mm x 7.7 mm body size, 1.0 mm maximum height
VDF
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 6 mm x 4 mm body size, 1.0 mm maximum height
VDG
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 6 mm x 5 mm body size, 1.0 mm maximum height
VDH
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 9.2 mm x 8.0 mm body size, 1.0 mm maximum height
VDL
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.5 mm x 5 mm body size, 1.0 mm maximum height
VDJ
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.5
mm pitch, 7.7 mm x 6.2 mm body size, 1.0 mm maximum height
VLB
Very thin profile fine pitch rectangular ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8 mm pitch; 10.0 mm x 8.0 mm body size, 1.0 mm maximum height
VLD
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11 mm x 9 mm body size, 1.0 mm maximum height
VSA
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 11.6 mm x 8.0 mm body size, 1.0 mm maximum height
VSB
Very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.8
mm pitch, 10.0 mm x 8.0 mm body size, 1.0 mm maximum height
WZA
Very, very thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball terminals;
0.65 mm pitch, 5.0 mm x 7.0 mm body size, 0.8 mm maximum height
ZSA
Thin profile ball grid array; wire bondable rigid substrate; solder ball terminals; 1.0 mm pitch; 8
mm x 6 mm body size, 1.2 mm maximum height
Land Grid Array (LGA)
L1A
Low profile fine pitch rectangular land grid array; wire bondable rigid substrate; land terminals;
0.8 mm pitch; 29 mm x 27 mm body size, 1.7 mm maximum height
L2A
Low profile fine pitch rectangular land grid array; wire bondable rigid substrate; land terminals;
0.8 mm pitch; 29 mm x 27 mm body size, 1.7 mm maximum height
L3A
Low profile fine pitch rectangular land grid array; wire bondable rigid substrate; land terminals;
0.8 mm pitch; 29 mm x 27 mm body size, 1.7 mm maximum height
L4A
Low profile fine pitch rectangular land grid array; wire bondable rigid substrate; land terminals;
0.8 mm pitch; 29 mm x 27 mm body size, 1.7 mm maximum height
Plastic Dual-In-Line (PDIP)
PD
Standard mil size1; rectangular package; through-hole leads
Plastic Leaded Chip Carrier (PLCC)
PL
Rectangular package; J-bend leads
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
Package Codes for Spansion Memory Products (Continued)
Package Code
Description
Plastic Quad Flat Package (PQFP)
PQR
Rectangular package; quad-directional, gull-wing leads
Shrink Small Outline Package (SSOP)
SSO
Rectangular package; 5.3 mm body width
Small Outline Package (SOIC)
SL3
300 mil body width1; 7.5 mm x 10.3 mm body size
SO
13.30 mm body width; gull-wing leads; standard pin out
SO3
300 mil body width1; gull-wing leads
SOA
150 mil body width1; gull-wing leads
SOC
208 mil body width1; gull-wing leads
SS3
300 mil body width1; 7.5 mm x 10.3 mm body size
Thin Small Outline Package - Type 1 (leads on the two short sides of package) (TSOP)
TS
Standard, Type I package; bi-directional, gull-wing leads; pin-out is standard
TSR
Standard, Type I package; bi-directional, gull-wing leads; pin-out is reverse
TS2
Standard, Type I package; gull-wing leads; standard pin-out
Thin Small Outline Package - Type 2 (leads on the two long sides of package) (TSOP)
T2/T2A
Standard, Type II package; bi-directional, gull-wing leads; pin-out is standard
Ultra Thin Small Outline No Lead Package (USON)
UNE
5 mm x 6 mm body size, 0.55 mm maximum height
Very Thin Quad Flat No Lead Package (VQFN)
VQA
10 mm x 10 mm body size, 0.9 maximum height
Very Very Thin Small Outline No Lead Package (WSON)
WND
5 mm x 6 mm body size, 0.8 maximum height
WNF
6 mm x 8 mm body size, 0.8 maximum height
WNG
6 mm x 8 mm body size, 0.8 maximum height
WNH
6 mm x 8 mm body size, 0.8 maximum height
Notes:
1 Mil size refers to the lead-tip to lead-tip width of the package when the leads are straightened for insertion into a board or socket.
Die and Wafer Package Codes for Spansion Memory Products
Device Format
Package Code
Description
Die
GDE
Known good/tested die packed in embossed tape and reel
Die
GDP
Known good/tested die packed in waffle pack
Die
GDT
Known good/tested die packed in surf tape and reel
Wafer
GWJ
Known good/tested wafer packed in wafer jar
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
PRODUCT DATE CODES
Every Spansion memory product
manufactured is assigned a
product date code that provides
information so the product’s manufacturing history can be traced.
YY WW A B C
where:
YY =
WW =
A=
Last two digits of year in which product was seal/molded.
Work week in which the product was seal/molded.
Alphanumeric character for the day of the week in which the
product was seal/molded. ("M" designates that assembly lots
have been combined).
Alphanumeric character for the assembly location.
Alphanumeric character for the wafer lot sequence for the day
("A" through "Z" with "M" only being used if fab lots are combined).
Figure 1.1 shows the seal date
code format for products marked B =
prior to third quarter of 2007. The C =
first 4 digits of the seal date code
are also used for product age Figure 1.1 Date code format-seal/mold date code (for prior to third quanrter 2007)
control and are printed on the
packing label. Product age is
YY WW T XX
controlled by the Spansion man- where:
ufacturing enterprise system
YY =
Last two digits of year in which product was seal/molded.
using the seal date code. SpanWW =
Work week in which the product was seal/molded.
sion continues to use the seal
T=
Alphanumeric character for the assembly location.
date code for product age control
XX =
Alphanumeric running sequence between 00-99 (automatically
and to print on the label.
assigned by the system).
Figure 1.2 shows date code for- Figure 1.2 Date code format (Fujitsu-legacy product)
mat used for Fujitsu-legacy prodY WW A M 123
uct.
where:
Figure 1.3 shows mark date code Y =
Last digit of the year in which the product is marked.
format for products marked from WW = Work week in which the product is marked.
third quarter 2007 and beyond. A =
Alphanumeric character for the assembly location.
This mark date code is used by M =
Alphanumeric character for the mark and pack location.
Spansion to trace manufacturing 123 = Alphanumeric running sequence (automatically assigned by
records associated with the prodthe system).
uct. Mark date code information Figure 1.3 Date code format or mark date code (for third quarter 2007 & beyond)
is available on manufacturing
intermediate packing labels and shipping documents (Packing List/Certificate of Conformance).
The mark date code is primarily used for manufacturing traceability purposes. It does not specify
product aging. Product aging is controlled by the Spansion manufacturing enterprise system
using the seal date code and is maintained as is. Customers can refer to the seal date code
printed on the packing label to see product aging.
FLAMMABILITY RATING
The UL Rating for all Spansion products is 94 V-0. The flammability rating is determined by
Underwriters Laboratories (UL) Standard 94, "Test for Flammability of Plastic Materials for Parts
in Devices and Applications."
OXYGEN INDEX
The oxygen index for all Spansion products is greater than or equal to 28%. The mold compound
is tested according ASTM Standard D2863-77, "Standard Method for Measuring Oxygen Concentration to support Candle-Like Combustion of Plastics (Oxygen Index)." The weight of epoxy
resin for each package is listed in the individual material data sheet found in Chapter 2 Package
Materials.
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
BALL GRID ARRAY
The basic construction of the ball grid array (BGA) is that of wirebonded die on a substrate that is
overmolded with encapsulant. Because the die is attached to a substrate, the package size is
determined by the dimensions of the substrate instead of the die. This allows smaller, lower cost
die, such as die shrinks, to be placed in the same BGA package without impacting the package
dimensions or footprint.
For board assembly, BGA packages may be handled using standard surface-mount technology
(SMT) equipment. No special handling or oven reflow profiles are required, and BGA packages
may be mixed with other SMT components on the same board.
BGA packages are available with solder
spheres composed of either SAC 105
(98.5% Sn, 1.0% Ag, 0.5% Cu) or SAC 305
(96.5% Sn, 3.0% Ag, 0.5% Cu). Other metal
compositions may be available. Please contact your Spansion representative.
Spansion BGA packages are offered with
both single-chip configurations as well as
multi-chip configurations. See Figure 1.4 for
an example of the basic single-chip BGA
package.
Bond Wire
Mold Compound
Die Attach
Epoxy
Substrate
Solder
Mask
Plated Via
Solder Ball Pad
Solder Ball Pitch
g1028
Figure 1.4 An example of single-chip BGA construction.
With multi-chip packages (MCPs), the die, which are stacked one on top of the other on a substrate, are wirebonded to the top of the substrate and overmolded with encapsulant. If the die are
of similar size, a spacer die is placed between the two die so that there is adequate space for the
bond wire of the bottom die. See Figure 1.5 for examples of MCP construction.
Mold Compound
(standard)
Mold Compound
(standard)
Bond Wire
(standard)
DI
E -1
DIE-1
DI
E -2
DIE-2
BT Re Substrate
sin S ubs trate
Die Attach
(standard)
DI
E -1
DIE-1
Si SpSpacer
acer
Solder
Mask
Substrate
Resin
Substrate
BTBT
Resin
Substrate
Bond Wire
(standard)
Die Attach
(standard)
DI
E -2
DIE-2
Solder
Mask
Plated Via
Plated Via
Solder
Ball Pad
Solder Ball Pitch
Solder Ball Pitch
2-Die MCP Construction
Figure 1.5 Examples of construction of Spansion multi-chip packages.
Solder
Ball Pad
Same-Die Stack MCP Construction
g1027
The table below provides an overview of each product offering within the BGA package families.
More detailed information can be found on the datasheets, which can be obtained from the Spansion website or your Spansion sales representative.
For details on the material content, as well as weight and moisture sensitivy level, of each individual package, see Chapter 2 Package Materials.
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
Package Attribute Data: BGA Packages
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
ALD 128
12.00 x 12.00
1.10
0.65
ALF 128
12.00 x 12.00
1.05
0.65
ALG 128
12.00 x 12.00
1.10
0.65
ALH 160
15.00 x 15.00
1.10
0.65
ALJ 128
12.00 x 12.00
1.15
0.65
ALK 202
13.00 x 11.50
1.20
0.65
AMA 160
15.00 x 15.00
1.20
0.65
AMB 128
12.00 x 12.00
2.25
0.65
ASA 137
11.00 x 8.00
1.20
0.65
ASB 220
12.00 x 12.00
1.20
0.65
ASC 128
12.00 x 12.00
1.10
0.65
ASD 188
13.00 x 8.00
1.20
0.65
ASE 160
15.00 x 15.00
1.20
0.65
ASF 128
12.00 x 12.00
1.15
0.65
ASH 165
11.00 x 9.00
1.20
0.65
ATA 160
15.00 x 15.00
1.20
0.65
BEA 188
13.00 x 8.00
1.40
0.65
BFA 188
13.00 x 9.00
1.40
0.65
BNA 202
13.00 x 11.50
1.40
0.65
BNB 188
13.00 x 9.00
1.40
0.65
BTA 160
15.00 x 15.00
1.30
0.65
BWA 160
15.00 x 15.00
1.25
0.65
BWB 160
15.00 x 15.00
1.30
0.65
FAA 064
13.00 x 16.00
1.20
1.00
FAB 024
8.00 x 6.00
1.20
1.00
FAC 024
8.00 x 6.00
1.20
1.00
FBA 048
8.15 x 6.15
1.20
0.80
FBB 048
9.00 x 6.00
1.20
0.80
FBC 048
9.00 x 8.00
1.20
0.80
FBD 048
12.00 x 6.00
1.20
0.80
FBD 063
14.00 x 8.00
1.20
0.80
FBE 040
15.00 x 8.00
1.20
0.80
FBE 063
12.00 x 11.00
1.20
0.80
Packages and Packing Methodologies Handbook
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 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
FBE 080
11.95 x 10.95
1.20
0.80
FBF 084
12.00 x 11.00
1.20
0.80
FDD 047
10.00 x 7.00
1.20
0.50
FDE 048
10.00 x 11.00
1.20
0.50
FEA 084
12.00 X 9.00
1.40
0.80
FEA 104
12.00 x 9.00
1.40
0.80
FEA 137
12.00 X 9.00
1.40
0.80
FEB 084
11.60 x 8.00
1.40
0.80
FEC 088
11.00 x 8.00
1.30
0.80
FED 084
12.00 X 9.00
1.40
0.80
FEE 088
11.00 X 8.00
1.30
0.80
FEF 103
11.00 x 9.00
1.40
0.80
FFA 084
12.00 x 9.00
1.40
0.80
FFA 115
12.00 x 9.00
1.40
0.80
FFB 084
11.60 x 9.00
1.40
0.80
FFC 115
13.00 x 9.00
1.55
0.80
FFD 115
13.00 x 9.00
1.55
0.80
FIA 084
12.00 x 9.00
1.40
0.80
FIB 137
13.00 x 11.00
1.60
0.80
FJA 137
13.00 x 11.00
1.60
0.80
FLA 069
11.00 x 8.00
1.40
0.80
FLB 073
11.60 x 8.00
1.40
0.80
FLB 093
11.60 x 8.00
1.40
0.80
FLG 103
11.00 x 9.00
1.40
0.80
FLJ 073
11.60 x 8.00
1.40
0.80
FLK 073
11.00 x 9.00
1.40
0.80
FMB 073
13.00 x 9.00
1.40
0.80
FBM 104
13.00 x 9.00
1.40
0.80
FMB 115
13.00 x 9.00
1.40
0.80
FMC 084
12.00 x 9.00
1.40
0.80
FMC 104
12.00 x 9.00
1.40
0.80
FMC 107
12.00 x 9.00
1.40
0.80
FMC 115
12.00 x 9.00
1.40
0.80
Packages and Packing Methodologies Handbook
23 August 2013
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 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
FMC 137
12.00 x 9.00
1.40
0.80
FMD 073
11.60 x 8.00
1.40
0.80
FME 103
11.00 x 9.00
1.40
0.80
FMH 107
12.00 x 9.00
1.40
0.80
FMI 137
13.00 x 11.00
1.40
0.80
FND 115
13.00 x 11.00
1.40
0.80
FND 137
13.00 x 11.00
1.40
0.80
FOA 115
12.00 x 9.00
1.55
0.80
FPB 115
13.00 x 9.00
1.40
0.80
FSA 063
12.00 x 11.00
1.70
0.80
FSB 073
11.60 x 8.00
1.55
0.80
FSC 073
11.60 x 8.00
1.40
0.80
FSD 063
12.00 x 11.00
1.40
0.80
FTA 073
11.60 x 8.00
1.40
0.80
FTA 084
11.60 x 8.00
1.40
0.80
FTA 088
11.60 x 8.00
1.40
0.80
FTD 088
11.50 x 9.00
1.40
0.80
FTE 073
13.00 x 9.00
1.40
0.80
FTE 115
13.00 x 9.00
1.40
0.80
FTF 084
12.00 x 9.00
1.40
0.80
FTF 115
12.00 x 9.00
1.40
0.80
FTF 137
12.00 x 9.00
1.40
0.80
FTG 115
12.00 x 9.00
1.40
0.80
FTI 084
12.00 x 9.00
1.40
0.80
FTJ 103
11.00 x 9.00
1.40
0.80
FTK 107
13.00 x 10.50
1.40
0.80
FTL 115
13.00 x 9.00
1.40
0.80
FTM 115
13.00 x 11.00
1.40
0.80
FTM 137
13.00 x 11.00
1.40
0.80
FUB 115
12.00 x 9.00
1.40
0.80
FVC 093
13.00 x 9.00
1.60
0.80
FVE 137
13.00 x 11.00
1.55
0.80
FWA 084
12.00 x 9.00
1.40
0.80
Packages and Packing Methodologies Handbook
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1-15
 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
FWA 115
12.00 x 9.00
1.40
0.80
FWC 137
13.00 x 11.00
1.40
0.80
FWD 137
13.00 x 11.00
1.40
0.80
LAA 064
13.00 x 11.00
1.40
1.00
LAA 080
13.00 x 11.00
1.40
1.00
LAB 080
15.00 x 10.00
1.40
1.00
LAC 064
18.00 x 12.00
1.40
1.00
LAD 080
11.00 x 9.00
1.40
1.00
LAE 064
9.00 x 9.00
1.40
1.00
LIA 064
13.00 x 11.00
1.60
1.00
LSA 064
13.00 x 11.00
1.70
1.00
LSB 080
13.00 x 11.00
1.60
1.00
LSC 080
18.00 x 12.00
1.60
1.00
LSE 064
13.00 x 11.00
1.40
1.00
LSF 064
13.00 x 11.00
1.60
1.00
LSG 064
13.00 x 11.00
1.40
1.00
LSH 064
13.00 x 11.00
1.40
1.00
MMB 112
13.00 x 11.00
1.40
0.50
MTA 133
11.00 x 10.00
1.30
0.50
NLA 048
10.95 x 9.95
1.20
0.50
NLA 060
10.95 x 9.95
1.20
0.50
NLB 044
8.00 x 9.20
1.20
0.50
NLB 056
9.20 x 8.00
1.20
0.50
NLC 133
11.00 x 10.00
1.10
0.50
NLD 044
7.70 x 6.20
1.20
0.50
NLD 056
7.70 x 6.20
1.20
0.50
NLE 133
8.00 x 8.00
1.10
0.50
NSA 048
9.95 x 10.95
1.20
0.50
NSB 044
8.00 x 9.20
1.20
0.50
NSB 056
9.20 x 8.00
1.20
0.50
NSC 133
8.00 x 8.00
1.10
0.50
NSD 056
7.70 x 6.20
1.20
0.50
NSE 056
10.00 x 8.00
1.20
0.50
Packages and Packing Methodologies Handbook
23 August 2013
1-16
 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
PIA 107
18.00 x 14.00
1.80
1.00
PNA 107
18.00 x 14.00
1.80
1.00
RLA 044
7.70 x 6.20
1.00
0.50
RLA 056
7.70 x 6.20
1.00
0.50
RLB 133
8.00 x 8.00
1.00
0.50
RLD 133
11.00 x 10.00
1.00
0.50
RLE 133
11.00 x 10.00
1.00
0.50
RLF 052
7.50 x 5.00
1.00
0.50
RLG 052
6.0 x 5.00
1.00
0.50
RSB 044
7.50 x 5.00
1.00
0.50
RSB 052
7.50 x 5.00
1.00
0.50
RSC 133
8.00 x 8.00
1.00
0.50
RSD 056
7.70 x 6.20
1.00
0.50
RSE 052
6.0 x 5.00
1.00
0.50
TLA 064
11.60 x 8.00
1.20
0.80
TLA 067
11.60 x 8.00
1.20
0.80
TLA 073
11.60 x 8.00
1.20
0.80
TLA 084
11.60 x 8.00
1.20
0.80
TLA 093
11.60 x 8.00
1.20
0.80
TLB 069
10.00 x 8.00
1.20
0.80
TLB 088
10.00 x 8.00
1.20
0.80
TLB 089
10.00 x 8.00
1.20
0.80
TLB 107
10.00 x 8.00
1.20
0.80
TLC 056
9.00 x 7.00
1.20
0.80
TLC 080
9.00 x 7.00
1.20
0.80
TLD 064
12.00 x 9.00
1.20
0.80
TLD 084
12.00 x 9.00
1.20
0.80
TLD 137
12.00 x 9.00
1.20
0.80
TLE 088
11.00 x 8.00
1.20
0.80
TLF 048
8.15 x 6.15
1.20
0.80
TLH 107
13.00 x 10.50
1.20
0.80
TLI 103
11.00 x 9.00
1.20
0.80
TLJ 138
10.00 x 10.00
1.20
0.80
Packages and Packing Methodologies Handbook
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 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
TLK 137
13.00 x 11.00
1.20
0.80
TLM 137
11.50 x 9.00
1.20
0.80
TMA 084
12.00 x 9.00
1.20
0.80
TMB 115
13.00 x 11.00
1.20
0.80
TMB 137
13.00 x 11.00
1.20
0.80
TSA 088
11.00 x 8.00
1.20
0.80
TSB 064
11.60 x 8.00
1.20
0.80
TSB 084
11.60 x 8.00
1.20
0.80
TSC 056
9.00 x 7.00
1.20
0.80
TSC 080
9.00 x 7.00
1.20
0.80
TSD 084
12.00 X 9.00
1.20
0.80
TSD 137
12.00 x 9.00
1.20
0.80
TSE 064
10.00 x 8.00
1.20
0.80
TSE 088
10.00 x 8.00
1.20
0.80
TSE 107
10.00 x 8.00
1.20
0.80
TSF 107
13.00 x 10.50
1.20
0.80
TSG 103
11.00 x 9.00
1.20
0.80
TSH 137
11.50 x 9.00
1.20
0.80
TTA 084
11.60 x 8.00
1.20
0.80
T3A 137
13.00 x 11.00
1.20
0.80
UDA 048
6.00 x 5.00
0.52
0.50
VBB 080
11.50 x 9.00
1.00
0.80
VBB 088
11.50 x 9.00
1.00
0.80
VBC 080
11.95 x 10.95
1.00
0.80
VBD 064
8.95 x 7.95
1.00
0.80
VBE 088
11.95 x 9.65
1.00
0.80
VBF 048
8.15 x 6.15
1.00
0.80
VBG 080
11.00 x 8.00
1.00
0.80
VBG 088
11.00 x 8.00
1.00
0.80
VBH 064
11.60 x 8.00
1.00
0.80
VBH 084
11.60 x 8.00
1.00
0.80
VBJ 064
8.95 x 7.95
1.00
0.80
VBK 048
8.15 x 6.15
1.00
0.80
Packages and Packing Methodologies Handbook
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 Chapter 1 Package Design
Package Attribute Data: BGA Packages (Continued)
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Ball
Pitch
(mm)
VBL 088
11.00 x 8.00
1.00
0.80
VBM 063
11.00 x 9.00
1.00
0.80
VBN 048
10.00 x 6.00
1.00
0.80
VBP 137
13.00 x 11.00
1.00
0.80
VBR 080
9.00 x 7.00
1.00
0.80
VBS 088
11.95 x 9.65
1.00
0.80
VBU 056
9.00 x 7.00
1.00
0.80
VBV 138
10.00 x 10.00
1.00
0.80
VBW 055
10.00 x 8.00
1.00
0,.80
VBY 181
12.00 x 12.00
1.00
0.80
VCA 056
9.30 x 7.70
1.00
0.75
VCB 048
9.00 x 7.80
1.00
0.75
VCC 056
11.00 x 9.00
1.00
0.75
VCD 056
9.00 x 7.70
1.00
0.75
VCE 056
9.00 x 7.70
1.00
0.75
VDA 044
8.00 x 9.20
1.00
0.50
VDC 048
9.95 x 10.95
1.00
0.50
VDD 044
8.00 x 9.20
1.00
0.50
VDD 064
8.00 x 9.20
1.00
0.50
VDE 044
7.70 x 6.20
1.00
0.50
VDF 048
6.00 x 4.00
1.00
0.50
VDG 048
6.00 x 5.00
1.00
0.50
VDH 064
8.00 x 9.20
1.00
0.50
VDJ 044
7.70 x 6.20
1.00
0.50
VDL 044
7.50 x 5.00
1.00
0.50
VLB 107
10.00 x 8.00
1.00
0.80
VLD 063
11.00 x 9.00
1.00
0.80
VSA 084
11.60 x 8.00
1.00
0.80
VSB 107
10.00 x 8.00
1.00
0.80
WZA 052
7.00 x 5.00
0.80
0.65
ZSA 024
8.00 x 6.00
1.20
1.00
Packages and Packing Methodologies Handbook
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1-19
 Chapter 1 Package Design
LAND GRID ARRAY
The land grid array (LGA) is a grid array package with terminal pads on the bottom surface. The
terminal pads are flat (no protruding pins) that touch contacts on a socket or can be soldered
directly onto a printed circuit board (PCB). The following table provides the attribute data for
Spasnion’s LGA package offerings.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: LGA Packages
Package
Package
Body Size
(basic, mm)
Package Height
(includes standoff)
(maximum, mm)
Land
Pitch
(mm)
L1A 140
29.00 x 27.00
1.70
0.8
L2A 140
29.00 x 27.00
1.70
0.8
L3A 140
29.00 x 27.00
1.70
0.8
L4A 140
29.00 x 27.00
1.70
0.8
LEADFRAME
Surface-Mount Leaded Packages. Developed in the late 1970’s in response to the demand for
cost-effective solutions to achieving greater board density without sacrificing reliability or functionality, surface-mount leaded packages are similar to traditional dual-in-line packages except
that the lead tips are designed for surface-mounting. Spansion memory is offered in the following
surface-mount leaded package families:
•
•
•
•
•
Plastic Leaded Chip Carrier (PLCC)—J-Bend (4 sides)
Plastic Quad Flat Package (PQFP)—Gull-wing (4 sides)
Small Outline Package (SOIC)—Gull-wing (2 sides)
Shrink Small Outline Package (SSOP)—Gull-wing (2 sides)
Thin Small Outline Package (TSOP)—Gull-wing (2 sides)
External Lead Designs—The shape of
the leads on surface-mount leaded
packages are formed in either a gullwing or J-bend shape. Both lead
shapes offer the advantage of being
flexible, which allows them to absorb
thermal
expansion
mismatches
between the package and the board.
Package
Lead
Solder
Footprint
Package
Lead
Solder
Fillet
Solder
Footprint
Printed Circuit Board
2970
Figure 1.6 J-bend (left) and gull-wing (right) lead formations allow
• Gull-Wing Lead Design - Gull-wing
components to be mounted onto the surface of the circuit board.
leads are similar to dual-in-line,
through-hole leads except that the leads are bent at the tips to rest flat on the board surface. This
provides a built-in standoff between the package and the board, enabling thorough board cleaning and easy-to-inspect solder joints.
• J-Bend Lead Design - Like the gull-wing design, J-bend leaded packages can be mounted
directly to the board, thus offering a built-in standoff and all the advantages inherent in this. A
strong, inspectable bond is easily attainable provided the solder lands include extensions out
from under the package. The J-bend design also allows easy socketing, which facilitates device
testing and programming.
Packages and Packing Methodologies Handbook
23 August 2013
1-20
 Chapter 1 Package Design
Leadframe Composition and Plating—The tables below provide details of the leadframe composition and plating of Spansion surface-mount leaded packages.
Leadframe
SnPb Plating
% Sn
Pb-free Plating
% Sn
PLCC (PL)
CDA 194
85
100
PQFP (PQR)
CDA 194
89
100
SOIC (SO)
CDA 194
85
100
C7025
85
100
CDA 194
85
100
CDA 194 or C7025
85
100
Package
SSOP (SSO)
TSOP (TS/TSR, T2/T2R)
TSOP (T2A/T2R 044 (040))
Material Composition: CDA 194
Material
Weight %
Pb-free Plating Composition
Characteristic
Matte Sn on Cu
SnBi on Alloy 421
8-10 µm (nominal)
Copper
97.45
Thickness
12-16 µm (nominal)
Iron
2.40
Grain Size
5 µm (min)
3-5 µm
Zinc
0.10
Carbon Content
< 500 ppm
< 500 ppm
Phosphorus
0.05
Underlayers
None
None
Note
Material Composition: Alloy 42
Material
1 SnBi on Alloy 42 is only available in limited offerings. Contact
your Spansion sales representative for details.
Weight %
Iron
57.15
Nickel
42.0
Manganese
0.50
Silicon
0.25
Carbon
0.10
SnPb Plating Composition
Characteristic
Thickness
Carbon Content
SnPb on Cu
10-12 µm (nominal)
< 500 ppm
Material Composition: C7025
Material
Weight %
Copper
96.20
Nickel
3
Silicon
0.65
Magnesium
0.15
Packages and Packing Methodologies Handbook
23 August 2013
1-21
 Chapter 1 Package Design
Plastic Leaded Chip Carrier—The PLCC package design is an attractive alternative to higher leadcount plastic DIPs because it can accommodate larger die sizes and offer the advantages of
SMT.
The PLCC package construction consists of a device attached to the die pad of a leadframe, the
circuitry of which is wire bonded to the lead fingers. A plastic epoxy material is injection-molded
to encapsulate the device/leadframe configuration. The quad-directional leads are trimmed and
formed to a J-bend formation. The 50-mil lead-pitch of a PLCC package is half the conventional
lead spacing of a PDIP. This, coupled with the PLCC leads being located on all four sides of the
package, greatly reduce the footprint.
As shown in the following table, Spansion memory is offered in a 32 leadcount PLCC package.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: PLCC
Package
PL 032
JEDEC
Drawing #
Package
Body Size
(nominal,
inches)
Package
Body Thickness
(body only,
inches)
Package
Height1
(nominal,
inches)
Lead
Pitch
(inches)
Coplanarity
(inches)
MO-052 (A) AE
0.450 x 0.550
0.1175
0.1325
0.050
0.004
Note:
1 Package height data includes standoff.
Plastic Quad Flat Package—PQFP packages were developed primarily for high-leadcount applications. The finer lead-pitch of a PQFP enables this design to accommodate higher leadcount
devices than desirable in PDIP, PLCC, and SOIC packages. As the benefits of the PQFP package configuration were realized within the industry, the design was extended to lower leadcounts.
The construction of this package consists of a device attached to the die pad of a leadframe, the
circuitry of which is wire bonded to the lead fingers. A plastic epoxy material is injection-molded
to encapsulate the device/leadframe configuration. The quad-directional leads are trimmed and
formed to a gull-wing formation.
Spansion memory is offered in an 80-lead PQFP package, which complies with EIAJ package
versions, as indicated in the package attributes table below.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: PQFP
Package
PQR 080
JEDEC
Drawing #
Package
Body Size
(nominal, mm)
Package
Body
Thickness
(nominal, mm)
Package
Height1
(maximum,
mm)
Lead
Pitch
(mm)
Coplanarity
(mm)
MO-108 (B) CB-1
14.00 x 20.00
2.80
3.35
0.80
0.10
Note:
1 Package height data includes standoff.
Packages and Packing Methodologies Handbook
23 August 2013
1-22
 Chapter 1 Package Design
Shrink Small Outline Package—The SSOP package is a fine-pitch JEDEC version of the SOIC
package. The package construction of the SSOP is the same as that of the SOIC package, both
having gull-wing lead formations extending out from the two long sides of the rectangular package body. The SSOP package is different, however, in that it has a smaller lead pitch and is
slightly shorter and thinner than a comparable SOIC package.
Spanison memory is offered in a 56-lead SSOP package, as indicated in the package attributes
table below.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: SSOP
Package
SSO 056
JEDEC
Drawing #
Package
Body Size
(nominal, mm)
Package
Body
Thickness
(nominal, mm)
Package
Height1
(maximum,
mm)
Lead
Pitch
(mm)
Coplanarity
(mm)
MO-180 (A) BA
23.70 x 13.30
1.25
2.00
0.80
0.10
Note:
1 Package height data includes standoff.
Small Outline Package—The SOIC package is a surface-mount alternative for low leadcount
devices. Its design is similar to the conventional dual-in-line (DIP) package.
The 1.27 mm lead pitch of SOIC packages allows for considerable reduction in package size
over comparable PDIPs. Not only are SOIC packages smaller, they are lighter, too. This makes
them ideal for foil/film mounting and virtually all automated board assembly operations.
Like PDIP packages, the SOIC package consists of a device attached to the die pad of a leadframe, the circuitry of which is wire bonded to the lead fingers. A plastic epoxy material is injection-molded to encapsulate the device/leadframe configuration. The leads extending from the two
long sides of the rectangular package body are trimmed and formed to a gull-wing formation.
As shown below, Spansion memory is offered in three SOIC packages.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: SOIC
Package
JEDEC
Drawing #
Package
Package
Body Thickness
Body Size
(nominal, mm) (maximum, mm)
Package
Height1
(maximum, mm)
Lead
Pitch
(mm)
Coplanarity
(mm)
SL3 016
MS-013(E)AA
10.30 x 10.30
2.55
2.65
1.27
0.10
SO 044
MO-180 (A) AA
28.20 x 13.30
2.30
2.80
1.27
0.10
SOA 008
MS-012 (D) AA
4.90 x 6.00
1.55
1.75
1.27
0.10
SOC 008
N/A
5.283 x 5.283
1.91
2.159
1.27
0.10
SO3 016
MS-013(D)AA
10.30 x 10.30
2.55
2.65
1.27
0.10
SS3 016
MS-013(E)AA
10.30 x 10.30
2.55
2.65
1.27
0.10
Note:
1 Package height data includes standoff.
Packages and Packing Methodologies Handbook
23 August 2013
1-23
 Chapter 1 Package Design
Thin Small Outline Package—The thin profile of a TSOP package makes it attractive for memory
devices, especially in portable applications. At 1 mm (40 mil), the package body is one-third to
one-half as thick as an SOIC or PLCC package. This thinner profile, coupled with a 0.5 mm (20mil) lead pitch, allows for considerable savings in the TSOP package volume over comparable
PLCCs. This saves space on the board and between boards, contributing to a smaller, lighter
system design.
Like other plastic encapsulated packages, the TSOP consists of a device attached to the die pad
of a leadframe, the circuitry of which is wire bonded to the lead fingers. A plastic epoxy material is
injection-molded to encapsulate the device/leadframe configuration.
On the Type 1 TSOP, the leads extend out from the two short sides of the rectangular package
and are trimmed and formed to a gull-wing formation. On the Type 2 TSOP, the leads extend out
from the two long sides.
Spansion memory is offered in standard and reverse pin-out 1 versions for both Type I and Type
II TSOP devices. An overview of each TSOP package offering is presented in the table below.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: TSOP
JEDEC
Drawing #
Package
Body Size
(nominal,
mm)
Package
Body
Thickness
(nominal,
mm)
Package
Height1
(nominal,
mm)
Lead
Pitch
(mm)
Coplanarity
(mm)
TS/TSR 032
(Type I)
MO-142 (D) BD
18.40 x 8.00
1.00
1.10
0.50
0.10
TS/TSR 040
(Type I)
MO-142 (D) DD
18.40 x 10.00
1.00
1.10
0.50
0.10
TS/TSR 048
(Type I)
MO-142 (D) DD
18.40 x 12.00
1.00
1.10
0.50
0.10
TS/TSR 056
(Type I)
MO-142 (D) EC
18.40 x 14.00
1.00
1.10
0.50
0.10
TS2 048
MO-142 (D) DD
18.40 x 12.00
1.00
1.10
0.50
0.10
T2A/T2R 044 (040)
(Type II)
MO-024 (C) AC
18.41 x 10.16
1.00
1.20
0.80
0.10
MS-024 BC
18.41 x 10.16
1.00
1.20
0.80
0.10
Package
T2A 050
(Type II)
Note:
1 Package height data includes standoff.
2 Contact your Spansion sales representative for this data.
Packages and Packing Methodologies Handbook
23 August 2013
1-24
 Chapter 1 Package Design
Through-Hole (Leaded) Packages. Developed in the 1960’s, through-hole board mounting
requires that the package leads be inserted into plated through-holes in the circuit board. Once
inserted, the leads are soldered to secure the electrical connection. This mounting technology
ensures a mechanically strong solder bond in which the thermal mismatches of the leads and
board material can be more easily tolerated. Plated through-holes on the circuit board, however,
are costly and require that the component occupy more space on the board than is needed with
surface-mount technology.
Leadframe Composition and Plating—The tables below provide details of the leadframe composition and plating of Spansion through-hole leaded packages.
Package
PDIP
Leadframe
CDA 194
SnPb
Plating
% Sn
Plating
Thickness
(nominal) µm
85
10-12
Material Composition:
CDA 194
Material Composition:
A151
Material
Material
Weight %
Weight %
Copper
97.45
Copper
99.9
Iron
2.40
Zirconium
0.1
Zinc
0.10
Phosphorus
0.05
Plastic Dual-in-Line—The PDIP package design, the long established industry standard, continues to be used in semiconductor technologies such as logic, memory, microcontrollers, and video
controllers.
The PDIP package consists of a device attached to the die pad of a leadframe, the circuitry of
which is wire bonded to the lead fingers. A plastic epoxy material is injection-molded to encapsulate the device/leadframe configuration. The leads are trimmed and formed to a through-hole
lead design, with lead extensions along the two long ends of the rectangular package.
As shown below, Spansion memory is offered in a 32-lead PDIP package.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: PDIP
Package
PD 032
JEDEC
Drawing #
Package
Body Size
(nom, inches)
Package
Body Thickness
(nom, inches)
Package
Height1
(nom, inches)
Lead
Pitch
(inches)
MO-015 (G) AP
1.655 x 0.555
0.1450
0.1825
0.100
Note:
1 Package height data includes standoff.
Packages and Packing Methodologies Handbook
23 August 2013
1-25
 Chapter 1 Package Design
No Lead Packages. Leadless packages have been around for many years. Recently, new thinner designs of these types of packages have been developed.
Very Very Thin Small Outline No Lead Package—The WSON package was developed to be used in
height-sensitive products. The WSON package is significantly thinner than Spansion’s eight-lead
SOIC package.
The following table provides the attribute data for Spasnion’s WSON package offering.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: WSON
Package
Body Size
(nominal, mm)
Package
Body Thickness
(maximum, mm)
Pitch
(mm)
WND 008
5.00 x 6.00
0.80
1.27
WNF 008
6.00 x 8.00
0.80
1.27
WNG 008
6.00 x 8.00
0.80
1.27
WNH 008
6.00 x 8.00
0.80
1.27
Package
Ultra Thin Small Outline No Lead Package—The USON package, like the WSON package, was
developed to be used in height-sensitive products.
The following table provides the attribute data for Spasnion’s USON package offering.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: USON
Package
UNE 008
Package
Body Size
(nominal, mm)
Package
Body Thickness
(maximum, mm)
Pitch
(mm)
5.00 x 6.00
0.55
1.27
Very Thin Quad Flat No Lead Package (VQFN)—Spansion memory is available in a VQFN package design.
The following table provides the attribute data for Spasnion’s USON package offering.
For details on the material content, as well as weight and moisture sensitivy level, see Chapter 2
Package Materials.
Package Attribute Data: VQFN
Package
VQA 024
Package
Body Size
(nominal, mm)
Package
Body Thickness
(maximum, mm)
Pitch
(mm)
10.00 x 10.00
0.90
1.27
Packages and Packing Methodologies Handbook
23 August 2013
1-26
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