ID.06-09-0111 Vendor: Package: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: REV. B TSSOP ASSEMBLY FLOWCHART ASSEMBLY FLOWCHART TSSOP /TSSOP (EXPOSED) PACKAGE Updated 03/01/2013 Linear Technology Corporation TSSOP /TSSOP (EXPOSED) package Carsem - Malaysia, UTAC Thailand, LTC Penang Linear Technology Corp., Milpitas, CA.,& Singapore Linear Technology Corp., Milpitas, CA.,& Singapore Linear Technology Corp., Milpitas, CA.,& Singapore Naib Girn, LTC Milpitas, CA (408) 432-1900 Ext. 2519 INCOMING QUALITY INSPECTION AND GATE MANUFACTURING PROCESS QUALITY MONITOR / SURVEILLANCE REWORK FLOW CHART INCOMING ASSY REWORK PROCESS STEP WAFER SORT WAFER SORT MONITOR KIT FOR OVERSEAS ASSEMBLY (N/A FOR PENANG) WAFER MOUNT DESCRIPTION 100% DIE LEVEL ELECTRICAL TEST REJECTS ARE INKED INSPECTION/TEST CRITERIA PROBE DEFECTS 2 OPTICAL DEFECTS METHOD & EQUIPMENT SAMPLING PLAN SPC TECHNIQUE ND WAFER PROBER 75X MICROSCOPE MINIMUM OF 1 TIME PER SHIFT. S/S=1, ACC= 0 LOG VISUAL INSPECTION UNAIDED EYE 3 WAFERS/SHIFT Ø PPM TARGET GO/NO GO INSPECTION ALIGGNMENT ACCURACY TV ALIGNMENT MICRO AUTOMATION OR DISCO SAW 10X TO 30X MICROSCOPE EVERY WAFER LOT/ MACHINE. LOG MONITOR ND PROBING AND 2 OPTICAL QUALITY WAFERS ARE KITTED WITH LTC BONDING DIAGRAM AND LTC ASSEMBLY TRAVELER PREPARATION FOR DIE WAFER MOUNT MONITOR SEPERATION WAFER SAW DIE SEPERATION Ø PPM TARGET BACTERIA COUNT BACTERIA CULTURE 10 COL/100CC BACTERIA CULTURE 1X PER WEEK LOG SET-UP CHECK INSPECTION PER SPEC VISUAL EA WAFER LOT LOG BLADE LIFE 45K IN SAW LIFE COUNT USAGE N/A LOG SAW KERF 1.0 TO 2.2 MILS TM MICROSCOPE OR EQUIVALENT ONCE PER SHIFT 4 CUTS PER MACHINE NP CHART PARAMETERS PRESSURE, SPEED, CUT, COUNT PER SPEC VISUAL 1X PER SHIFT LOG PARAMETERS PRESSURE, SPEED, CUT, COUNT PER SPEC VISUAL 1X PER SHIFT LOG DI WATER QUALITY RESISTIVITY 12M OHM MIN RESISTIVITY METER 1X PER SHIFT LOG LINEAR TECHNOLOGY CORPORATION PAGE 1 OF 4 ID.06-09-0111 REV. B TSSOP ASSEMBLY FLOWCHART Pg 2 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP DIE SORT ND 2 OPT DIE SORT BUY OFF DESCRIPTION YIELD TRIGGER 93.0% LOG VISUAL INSPECTION PER SPEC 75X MICROSCOPE 32/LOT ACC= Ø, REJ= 1 LOG PER SPEC AUTO DIE ATTACHER 20X MICRO SCOPE 1 STRIP/MAG ACC= Ø, REJ= 1 LOG PER SPEC 20X TO 40X MICROSCOPE 1 STRIP/WAFER LOT ACC= Ø, REJ= 1 LOG PER SPEC 75X TO 200X MICROSCOPE 4 UNITS/WAFER LOT CHIPS, CRACKS LOG DIE SHEAR TESTER 30X TO 60X MICROSCOPE 3 UNITS PER OVEN LOAD NP CHART 20X TO 40X 2 STRIPS/OVEN/DAY ZERO BLEED PYROMETER 1X/DAY AUTO THERMOSONIC BALL BONDER 20X TO 40X 10 UNITS/LOT ACC= Ø , REJ= 1 VISUAL DIE BACK CRACK VISUAL DIE ATTACH MONITOR VISUAL QUALITY RESIN BLEED VISUAL EPOXY CURE CURE TEMP CAPILLARY LIFE SET-UP WIRE BOND MONITOR SPC TECHNIQUE 75X MICROSCOPE DIE PLACEMENT PARAMETERS SAMPLING PLAN PER SPEC DIE BONDED WITH EPOXY SURVEILLANCE METHOD & EQUIPMENT VISUAL INSPECTION DIE ATTACH WIRE BOND INSPECTION/TEST CRITERIA BALL BONDS VISUAL VISUAL VISUAL EPOXY CURE +175°C +/-5°C GOLD WIRE PER SPEC LOG LOG LOG 10 UNITS/MAG ACC= Ø , REJ= 1 PER SPEC LOG 1X PER LOT COUNT USAGE EVERY 6 SHIFTS 20X TO 40X MICROSCOPE VISUAL WIRE PULL 20X TO 40X MICROSCOPE LOG 5GM(1MIL), 7GM (1.3MIL), 8GM (1.5MIL), 12GM (2MIL), 15GM (3MIL) LOG 10 UNITS/LOT ACC= Ø, REJ= 1 BOND PULL TESTER X BAR R CHART EACH LOT/CAP CHANGE (ALL WIRES) BALL SHEAR TESTER BALL SHEAR VISUAL 36GM (1ML); 40GM (OTHER SIZES) GND BOND 60GM (1ML) 80GM (1.3MIL), 120GM (1.5MIL) PARAMETERS VISUAL (POWER FORCE TIME, TEMP) BOND PEEL TEST VISUAL >25% AU REMAINING BOND CRATER VISUAL NO CRATERING VISUAL INSPECTION PER SPEC 20X TO 40X MICROSCOPE YIELD TRIGGER 95% LOG PER SPEC MIN 30X MICROSCOPE 125 PER LOT ACC= Ø, REJ= 1 (MRB>10%, 3X REJ) LOG EACH LOT/CAP CHANGE (5 WIRES INCLUDING GND BONDS) 1X / DAY RD 3 OPTICAL INSPECTION RD QA 3 OPTICAL INSPECTION CHECK FOR WORKMANSHIP QUALITY LINEAR TECHNOLOGY CORPORATION 75X MICROSCOPE 75X MICROSCOPE X BAR R CHART LOG 1 WIRE/MACH/DAY LOG LOG 1X/MACH/DAY (10 UNITS) PAGE 2 OF 4 ID.06-09-0111 REV. B TSSOP ASSEMBLY FLOWCHART Pg 3 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP DESCRIPTION INSPECTION/TEST CRITERIA METHOD & EQUIPMENT SAMPLING PLAN SPC TECHNIQUE CHECKLIST MOLD-EPOXY NOVOLAC SURVEILANCE ENCAPSULATION PARAMETERS PER SPEC VISUAL 1X/SHIFT VISUAL PER SPEC MIN 3X 1 SHOT/LOT ACC= Ø, REJ = 1 CHECKLIST X BAR R CHART +175°C +/- 5°C TEMPERATURE MOLD TEMP PYROMETER 1X/SHIFT/MACH/ MOLD CHANGE CHECKLIST SURVEILLANCE VISUAL PER SPEC MIN 3X 1 SHOT/LOT ACC= Ø, REJ= 1 MOLD TEMP +175°C +/- 5°C PYROMETER 1X/SHIFT/MATCH/ MOLD CHANGE VISUAL PER SPEC 30X TO 40X MICROSCOPE 6 STRIPS/MATCH/ SHIFT/CONVERSION VISUAL AGE LIFE VISUAL 1X/SHIFT OFFSET <2.5MIL (SSOP) TOOLMAKER’S 1X/DAY/MC 4 UNITS/SHOT PRESS PER SPEC VISUAL 1X / MACH / DAY/ 1X/ DAY XRAY VISUAL SWEEP, VOIDS, WIRE DEFECTS SOFT XRAY EVERY LOT 20 UNITE ACC= Ø, REJ = 1 X BAR R CHART TEMPERATURE SURVEILLANCE COMPOUND AGEING CHECK MISMATCH LOG LOG PARAMETERS MOLD QUALITY LOG POST MOLD CURE TEMPERATURE +175°C +/- 5°C 6HOURS PYROMETER POST MOLD CURE MONITOR TEMPERATURE +175°C +/- 5°C 6HOURS PYROMETER DEFLASH VISUAL REMOVE MOLD FLASH FROM PACAKGE DEFLASH MONITOR PRESSURE MARKING VISUAL INSPECTION SET-UP CHECK VISUAL PERMANENCY MARK PERMANENCY PER SPEC PER SPEC PER SPEC 1X/OVEN/DAY UNAIDED EYE 2X/SHIFT/PKG CHANGE-5 STRIPS ACC= Ø, REJ = 1 LOG PRESSURE GAGE 2X/SHIFT/MACH LOG UNAIDED EYE 2 STRIPS/3X/SHIFT ACC= Ø, REJ= 1 LOG 1X/ SHIFT CHECKLIST 1 LOT/MACH/SHIFT 11 UNITS ACC= Ø, REJ =1 LOG PER SPEC 1 SOLUTION CONTINUOUS UNAIDED EYE 3 SOLUTIONS UNAIDED EYE IR, VISCOSITY VISUAL SOLDER PLATE INSPECTION PARAMETERS PER SPEC UNAIDED EYE THICKNESS AND COMPOSITION 300-800 u INCH 85% ±10% XRF SOLDERABILITY (W & WO AGING) 95% COVERAGE PACKAGE CLEANLINESS 1.7µG/INCH SQUARED LINEAR TECHNOLOGY CORPORATION PER SPEC 1X/WEEK (11 UNITS/ SOLUTION ACC = Ø, REJ = 1 1X/SHIFT Np CHART 1X/PKG/ SHIFT LOG 1X/SHIFT/MACH/ CHANGE OF SOLDER BATH-MIN OF 10 READINGS Np CHART 20X TO 40X MICROSCOPE 1X/SHIFT 10 UNITS LOG IONOGRAPH 3 LOTS/SHIFT 3 TESTS/ LOT LOG PAGE 3 OF 4 ID.06-09-0111 REV. B TSSOP ASSEMBLY FLOWCHART Pg 4 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP DESCRIPTION INSPECTION/ TEST CRITERIA METHOD & EQUIPMENT SAMPLING PLAN SPC TECHNIQUE SOLDER PLATE BUYOFF VISUAL SOLDER QUALITY ETC. 3X TO 10X MICROSCOPE TRIM & FORM SINGULATION SET-UP CHECK PER SPEC UNAIDED EYE COPPLANARITY LEAD SPREAD STANDOFF PER SPEC COMPARATOR LEAD FATIGUE PER SPEC LEAD TESTER 1X/ WK/ MACH 2 LEADS LOG CRACK/GAP BUYOFF VISUAL PER SPEC 30X TO 45X MICROSCOPE (SINGULATED) 45/LOT/ CONVERSION ST 200/1 LOT OF SHIFT ACC= Ø, REJ= 1 LOG DELAMINATION/C CRACK VISUAL PER SPEC SCANNING ACOUSTIC MICROSCOPE (STRIP FORM) MIN 2 LOTS/SHIFT/ MACHINE ACC= Ø, REJ= 1 LOG SET-UP CHECK PER SPEC VISUAL PER SPEC 30X TO 40X MICROSCOPE FINAL VISUAL INSPECTION VISUAL QUALITY PER SPEC UNAIDED EYE 100%-YIELD TRIGGER 95.0% LOG QA FINAL VISUAL INSPECTION CORRECT MARK PER SPEC MARKING PERMANENCY TEST (IF INK MARKED) VISUAL BENT LEADS MOLD FLASH, SOLDER QUALITY ETC. UNAIDED EYE S/S= 125 ACC= Ø, REJ= 1 LOG QA PACK & DOCUMENTATIO N CHECK PACKING & PREPERATION FOR DELIVERY UNAIDED EYE 5 TUBES ACC= Ø, REJ= 1 LOG SHIP TO LTC ANTISTATIC TUBES DEJUNK LINEAR TECHNOLOGY CORPORATION S/S=125 ACC= Ø, REJ= 1 LOG CHECKLIST 5 UNITS/SHIFT 2 UNITS/LOT ACC= Ø, REJ= 1 nP CHART 1X/ DAY/ MACH/ 5UNITS PER SPEC UNAIDED EYE 5 UNITS/SHIFT 2 UNITS/ LOT ACC= Ø, REJ= 1 LOG 45 UNITS HOURLY/ CONVERSION 100 ST UNITS/1 LOT OF SHIFT ACC= Ø, REJ= 1 EVERY LOT 100% BASIS PAGE 4 OF 4