ID 06-09-0103 REV 0 WAFER FABRICATION FLOWCHART – GENERIC BIPOLAR PROCESS WAFER FABRICATION FLOWCHART INCOMING QUALITY INSPECTION AND GATE Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: Linear Technology Corporation Generic Bipolar Process All Package Types Linear Technology Corp., Milpitas, CA./ Camas, WA Linear Technology Corporation Penang, Malaysia, or any approved assembly Linear Technology Corp., Milpitas, CA., Singapore Linear Technology Corp., Milpitas, CA., Singapore Linear Technology Corp., Milpitas, CA., Singapore Naib Girn, LTC Milpitas, CA (408) 432-1900 Ext. 2519 FLOW CHART PROCESS STEP INCOMING RAW MATERIAL INSPECTION INSPECTION/TEST CRITERIA DESCRIPTION WAFERS MANUFACTURING PROCESS QUALITY MONITOR / SURVEILLANCE REWORK METHOD & EQUIPMENT SAMPLING PLAN VISUAL: SCRATCHES, PITS, 1X INSPECTION HAZE, CRATERS, DIMPLES, CONTAMINATION 1.0% AQL TO 2.5% AQL LEVEL 1 OXYGEN/CARBON MEASUREMENT INFRARED SPECTROMETER S/S = 2, ACC = 0 RESISTIVITY / CONDUCTIVITY MAGNETRON V/I METER S/S = 2, ACC = 0 DIMENSIONAL CALIPERS 2.5% AQL LEVEL 1 THICKNESS AND TAPER / BOW DIAL THICKNESS GAGE 2.5% AQL LEVEL 1 ORIENTATION BREAK TEST S/S = 1, ACC = 0 SPC TECHNIQUE LOGBOOK C OF C VERIFICATION AGAINST “MPS” REQUIREMENTS EACH BATCH RETICLE VISUAL C.D. MEASUREMENT EACH PLATE CHEMICALS C OF C VERIFICATION AGAINST “”MPS” REQUIREMENTS EACH BATCH GASES C OF C VERIFICATION AGAINST “”MPS” REQUIREMENTS TARGETS C OF C VERIFICATION INITIAL OXIDATION OXIDATION FURNACE VISUAL OXIDE THICKNESS NANOSPEC 3 WAFERS / CYCLE COLLECTOR MASK RESIST MASK HF ETCHANT BATH FINAL INSPECT OPTICAL MICROSCOPE INSPECTION “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG COLLECTOR IMPLANT IMPLANT DOSE CHECK THERMAWAVE 2 WAFERS/LOT LOGBOOK COLLECTOR DIFFUSION OXIDATION AND DIFFUSION VISUAL UV LAMP MICROSCOPE INSPECTION 2 WAFERS/RUN < 2 DEFECTS PER FIELD OF VIEW LOGBOOK FURNACE OXIDE THICKNESS R□ XJ LINEAR TECHNOLOGY CORPORATION EACH TARGET UV LAMP MICROSCOPE INSPECTION 2 WAFERS/RUN < 2 DEFECTS PER FIELD OF VIEW NANOSPEC 2 WAFERS / RUN 4 POINT PROBE 1 TEST WAFER / RUN LOGBOOK 1 TEST WAFER / CYCLE PAGE 1 OF 4 ID 06-09-0103 REV 0 FLOW CHART PROCESS STEP EPI DESCRIPTION DEPOSIT EPI ASM WAFER FABRICATION FLOWCHART – GENERIC BIPOLAR PROCESS INSPECTION/TEST CRITERIA VISUAL METHOD & EQUIPMENT UV LAMP SAMPLING PLAN SPC TECHNIQUE INSPECT 2 WAFERS / RUN INTERFERENCE CONTRAST MICROSCOPE EPI RE-OX OXIDATION FURNACE R□ 4 POINT PROBE 2 READING/PASS X Bar & MOVING R EPI THICKNESS FTIR 1 WAFER/LOT RUN CHART VISUAL UV LAMP UV INSPECTION LOGBOOK 20X MICROSCOPE 2 WAFERS/RUN < 2 DEFECTS PER FIELD OF VIEW OXIDE THICKNESS NANOSPEC 2 WAFERS/RUN < 2 DEFECTS PER FIELD OF VIEW ISOLATION MASK RESIST MASK HF ETCHANT BATH FINAL INSPECTION OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG ISOLATION PREDEPOSITION BORON DEPOSITION FURNACE VISUAL UV LAMP WAFER INSPECTION TREND CHART 20X MICROSCOPE 2 WAFERS/RUN <4 DEFECTS/PER FIELD OF VIEW R□ 4 POINT PROBE 2 TEST WAFERS/RUN VISUAL UV LAMP WAFER INSPECTION 20X MICROSCOPE 2 WAFERS/RUN < 2 DEFECTS PER FIELD OF VIEW R□ 4 POINT PROBE 2 TEST WAFERS/RUN TOX NANOSPEC 2 PRODUCTION WAFERS / RUN ISOLATION DIFFUSION DIFFUSION FURNACE SINKER MASK RESIST MASK HF ETCHANT BATH FINAL INSPECT OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS SINKER PREDEP DEPOSITION FURNACE VISUAL UV LAMP WAFER INSPECTION R□ 4 POINT PROBE 2 TEST WAFERS/RUN VISUAL UV LAMP WAFER INSPECTION 20X MICROSCOPE <3 DEFECTS PER FIELD OF VIEW R□ 4 POINT PROVE 2 TEST WAFERS/RUN TOX NANOSPEC 2 TEST WAFERS/RUN SINKER DIFFUSION DIFFUSION FURNACE LOGBOOK PRODUCTION LOG TREND CHART LOGBOOK BASE MASK RESIST MASK HF ETCHANT BATH FINAL INSPECT OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS X BAR & R ISO DIODE CHECK CURVE TRACER BVCSO BVCSO CURVE TRACER 2 WAFERS/RUN LOGBOOK BASE PREDEP DEPOSITION FURNACE VISUAL UV LAMP 2 WAFERS/RUN X BAR & R 20X MICROSCOPE 2 WAFERS/RUN <4 DEFECTS/PER FIELD OF VIEW 4 POINT PROVE 2 TEST WAFERS/RUN R□ LINEAR TECHNOLOGY CORPORATION PAGE 2 OF 4 ID 06-09-0103 REV 0 FLOW CHART PROCESS STEP BASE DIFFUSION DESCRIPTION DIFFUSION FURNACE WAFER FABRICATION FLOWCHART – GENERIC BIPOLAR PROCESS INSPECTION/TEST CRITERIA VISUAL METHOD & EQUIPMENT SAMPLING PLAN UV LAMP WAFER INSPECTION 20X MICROSCOPE 2 WAFERS PER RUN <4 DEFECTS PER FIELD OF VIEW R□ 4 POINT PROBE 2 TEST WAFERS/RUN TOX NANOSPEC 2 PRODUCTION WAFERS PER RUN SPC TECHNIQUE TREND CHART EMITTER MASK RESIST MASK HF ETCHANT BATH FINAL INSPECT OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG CB DIODE CHECK CURVE TRACER BVCBO CURVE TRACER 2 WAFERS PER LOT LOGBOOK EMITTER DIFFUSION DEPOSITION FURNACE R□ 4 POINT PROBE 2 TEST CHIP/CYCLE LOGBOOK BETA/LV CURVE TRACER 3 SITE PER WAFER EVERY FOURTH WAFER >2 READINGS OUT OF SPEC FINAL INSPECT OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG 1000X CRITICAL DIMENSION MEASURE. 2 WAFERS PER RUN LOT, ACCEPT ON 0 FAILURES TREND CHART UV LAMP <5 DEFECTS/WAFER 100% X BAR & R R□ / THICKNESS 4 POINT PROBE 2 READINGS / PASS FINAL INSPECT OPTICAL MICROSCOPE 200X “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG 1000X CRITICAL DIMENSION MEASURE. 2 WAFERS PER RUN LOT, ACCEPT ON 0 FAILURES CD LOGBOOK UV LAMP 2 WAFERS PER LOT LOGBOOK EVERY WAFER LOGBOOK CONTACT MASK RESIST MASK HF ETCHANT BATH METAL DEPOSITION DEPOSITION VISUAL SPUTTER MACHINE METAL MASK RESIST MASK ETCHANT BATH ALLOY ANNEAL FURNACE ELECTRICAL TEST TO EVALUATE ELECTRICAL PARAMETERS LOMAC LPOM PASSIVATION LPCVD FURNACE PEN PECVD NITRIDE DEPOSITION FURNACE LINEAR TECHNOLOGY CORPORATION VISUAL VISUAL UV LAMP 100%, MORE THAN 2 COLOR CHANGE IS FAIL 10X MICROSCOPE 3 WAFER/CYCLE <3 DEFECTS/PER FIELD OF VIEW TOX NANOSPEC 3 WAFERS/CYCLE PHOSPHOROUS CONCENTRATION 10:1 HP ETCH RATE 3 WAFERS/CYCLE VISUAL UV LAMP 100%, MORE THAN 2 COLOR CHANGE IS FAIL 10X MICROSCOPE 2 WAFERS/RUN <5 DEFECTS PER FIELD OF VIEW THICKNESS NANOSPEC 3 WAFERS/CYCLE INDEX OF REFRACTION ELIPSOMETER 3 WAFERS/CYCLE TREND CHART PAGE 3 OF 4 ID 06-09-0103 REV 0 FLOW CHART PROCESS STEP DESCRIPTION WAFER FABRICATION FLOWCHART – GENERIC BIPOLAR PROCESS INSPECTION/TEST CRITERIA METHOD & EQUIPMENT SAMPLING PLAN SPC TECHNIQUE OPTICAL MICROSCOPE 100X “S” PATTERN SCAN OF THE WAFERS PRODUCTION LOG 100% LOGBOOK PAD MASK RESIST MASK RF PLASMA ETCH & OXIDE WET ETHCANT BATH ELECTRICAL TEST EVALUATE ELECTRICAL PARAMETERS BACKLAP DISCO N/A N/A N/A LOGBOOK BACKSIDE METAL BACKSIDE METALLIZATION VISUAL UN-AIDED EYE 100% LOGBOOK SEM STEP COVERAGE 2 PHOTOS SCANNING ELECTRON MICROSCOPE 1 WAFER PER WEEK LOGBOOK GENERAL METALLIZATION 1 PHOTO LINEAR TECHNOLOGY CORPORATION FINAL INSPECT PAGE 4 OF 4