datasheet

SEMiX151GB17E4s
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
IGBT
VCES
IC
Tj = 25 °C
Tj = 175 °C
1700
V
Tc = 25 °C
260
A
Tc = 80 °C
198
A
150
A
ICnom
ICRM
SEMiX® 1s
VGES
tpsc
Tj
ICRM = 3xICnom
VCC = 1000 V
VGE ≤ 15 V
VCES ≤ 1700 V
Tj = 150 °C
450
A
-20 ... 20
V
10
µs
-40 ... 175
°C
Inverse diode
SEMiX151GB17E4s
VRRM
IF
Tj = 25 °C
Tj = 175 °C
1700
V
Tc = 25 °C
169
A
Tc = 80 °C
125
A
150
A
IFnom
Features
• Homogeneous Si
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• UL recognized, file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic Welding
Remarks
• Case temperature limited to TC=125 °C
max.
• Product reliability results are valid for
Tj=150 °C
IFRM
IFRM = 2xIFnom
300
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
950
A
-40 ... 175
°C
Tj
Module
It(RMS)
Tstg
Visol
AC sinus 50Hz, t = 1 min
600
A
-40 ... 125
°C
4000
V
Characteristics
Symbol
IGBT
VCE(sat)
VCE0
rCE
Conditions
IC = 150 A
VGE = 15 V
chiplevel
chiplevel
VGE = 15 V
chiplevel
VGE(th)
VGE=VCE, IC = 6 mA
ICES
VGE = 0 V
VCE = 1700 V
Cies
Coes
Cres
VCE = 25 V
VGE = 0 V
min.
typ.
max.
Unit
Tj = 25 °C
1.90
2.20
V
Tj = 150 °C
2.25
2.45
V
Tj = 25 °C
1.1
1.2
V
Tj = 150 °C
1
1.1
V
Tj = 25 °C
5.3
6.7
mΩ
Tj = 150 °C
8.3
9
mΩ
5.8
6.4
V
2
mA
5.2
Tj = 25 °C
mA
f = 1 MHz
12
nF
f = 1 MHz
0.50
nF
f = 1 MHz
0.38
nF
QG
VGE = - 8 V...+ 15 V
1200
nC
RGint
Tj = 25 °C
VCC = 1200 V
IC = 150 A
VGE = +15/-15 V
RG on = 1 Ω
RG off = 1 Ω
di/dton = 6400 A/µs
di/dtoff = 840 A/µs
du/dt = 5000 V/µs
Ls = 30 nH
5.00
Ω
td(on)
tr
Eon
td(off)
tf
Eoff
Tj = 150 °C
210
ns
Tj = 150 °C
28
ns
Tj = 150 °C
52
mJ
Tj = 150 °C
670
ns
Tj = 150 °C
150
ns
Tj = 150 °C
60
mJ
GB
© by SEMIKRON
Rev. 2 – 20.02.2015
1
SEMiX151GB17E4s
Characteristics
Symbol
td(on)
tr
Eon
td(off)
tf
Eoff
SEMiX® 1s
Rth(j-c)
Conditions
VCC = 900 V
IC = 150 A
VGE = +15/-15 V
RG on = 1 Ω
RG off = 1 Ω
di/dton = 3500 A/µs
di/dtoff = 800 A/µs
du/dt = 4400 V/µs
Ls = 80 nH
per IGBT
min.
typ.
max.
Unit
Tj = 150 °C
210
ns
Tj = 150 °C
47
ns
Tj = 150 °C
28
mJ
Tj = 150 °C
620
ns
Tj = 150 °C
160
ns
Tj = 150 °C
49
mJ
0.162
K/W
typ.
max.
Unit
1.98
2.37
V
Characteristics
Symbol
SEMiX151GB17E4s
Features
• Homogeneous Si
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• UL recognized, file no. E63532
Typical Applications*
Conditions
Inverse diode
VF = VEC IF = 150 A
VGE = 0 V
chiplevel
VF0
chiplevel
rF
IRRM
Qrr
Err
IRRM
• AC inverter drives
• UPS
• Electronic Welding
Qrr
Remarks
Rth(j-c)
• Case temperature limited to TC=125 °C
max.
• Product reliability results are valid for
Tj=150 °C
LCE
Err
chiplevel
IF = 150 A
di/dtoff = 5500 A/µs
VGE = -15 V
VR = 1200 V
IF = 150 A
di/dtoff = 3200 A/µs
VGE = -15 V
VR = 900 V
per diode
min.
Tj = 25 °C
Tj = 150 °C
2.11
2.52
V
1.32
1.56
V
1.08
1.22
V
4.4
5.4
mΩ
Tj = 150 °C
6.9
8.7
mΩ
Tj = 150 °C
200
Tj = 150 °C
56
µC
Tj = 150 °C
41
mJ
Tj = 25 °C
1.16
Tj = 150 °C
Tj = 25 °C
3.5
A
Tj = 150 °C
190
A
Tj = 150 °C
54
µC
Tj = 150 °C
34
mJ
0.345
K/W
Module
RCC'+EE'
16
res. terminal-chip
Rth(c-s)
per module
Ms
to heat sink (M5)
TC = 25 °C
0.7
mΩ
TC = 125 °C
1
mΩ
0.075
to terminals (M6)
Mt
nH
K/W
3
5
2.5
5
Nm
Nm
Nm
w
145
g
Temperature Sensor
R100
B100/125
Tc=100°C (R25=5 kΩ)
R(T)=R100exp[B100/125(1/T-1/T100)]; T[K];
493 ± 5%
Ω
3550
±2%
K
GB
2
Rev. 2 – 20.02.2015
© by SEMIKRON
SEMiX151GB17E4s
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 2 – 20.02.2015
3
SEMiX151GB17E4s
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+ EE'
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 2 – 20.02.2015
© by SEMIKRON
SEMiX151GB17E4s
SEMiX 1s
spring configuration
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 2 – 20.02.2015
5