88030

REVISIONS
LT
DESCRIPTION
DATE
APPROVED
A
Add new paragraph on resistance. Editorial changes
throughout.
7 JUL 1989
D. MOORE
B
Breakout RTC into specific resistance ranges; change
voltage rating to 75 volts; change power conditioning
to allow for mounting on a test fixture. Editorial
changes throughout.
3 DEC 1990
D. MOORE
C
Increase resistance range. Breakout characteristics
for power conditioning and have individual resistance
change limits. Editorial changes throughout.
13 DEC 1991
D. MOORE
D
Add new source of supply; add resistance
tolerances 0.1 percent and 5.0 percent; add
characteristic E; dimension changes in accordance
with MIL-PRF-55342/3. Editorial changes
throughout.
5 APR 1999
J. CRUM
E
Add new source of supply. Lower resistance value to
1 ohm for characteristics K and M. Editorial changes
throughout.
5 MAY 2000
K. COTTONGIM
F
Table 1 correction. 5 year review cycle. Editorial
and procedural changes throughout.
6 APR 2005
K. COTTONGIM
G
Additional vendor part number. Editorial and
procedural changes throughout.
17 Aug 2007
M. RADECKI
CURRENT DESIGN ACTIVITY CAGE CODE 037Z3
DEFENSE LOGISTICS AGENCY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.100
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PREPARED BY
ALLAN R. KNOX
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OH
Original date of
drawing
CHECKED BY
DAVID E. MOORE
TITLE
20 May 1988
APPROVED BY
DAVID E. MOORE
PMIC N/A
SIZE
A
REV
AMSC N/A
RESISTORS, CHIP, FIXED, FILM, STYLE 1005
CODE IDENT. NO.
14933
DWG NO.
G
PAGE
88030
1
OF
9
5905-E668
1. SCOPE
1.1 Scope. This drawing describes the requirements for a fixed, film, 0.100 X 0.050 chip resistor.
1.2 Part or Identifying Number (PIN) The complete PIN is as follows:
88030
⏐
⏐
Drawing
number
-
*
⏐
⏐
Characteristic
(see 3.3.6)
****
⏐
⏐
Resistance and resistance
tolerance (see 3.3.1 and 3.3.3)
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the cited in
the solicitation or contract (see 6.2).
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-55342
-
Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level,
General Specification For
DEPARTMENT OF DEFENSE STANDARD
MIL-STD-202
MIL-STD-790
-
MIL-STD-1285
-
Test Method Standard Electronic and Electrical Component Parts.
Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL)
Systems for Electrical, Electronic, and Fiber Optic Parts Specifications.
Marking of Electrical and Electronic Parts.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil/ or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein,
the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and
regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified
herein.
3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and
herein (see figure 1).
DEFENSE ELECTRONICS SUPPLY CENTER
SIZE
CODE IDENT NO.
DWG NO.
DAYTON, OHIO
A
14933
88030
REV G
PAGE
2
Inches
.005
.007
.015
.033
.050
.105
A
0.105
±0.007
B
.050
±.005
C
D
.015
±.005
.015/.033
mm
0.13
0.18
0.38
0.84
1.27
2.67
E
.015
±.005
NOTES:
1. Dimensions are in inches. Metric equivalents are given for general information only.
2. The pictorial view is representative of the envelope of the item. Slight deviations from the outline shown, which are
contained within the envelope, and do not alter the functional aspect of the device are acceptable.
FIGURE 1. Chip resistor.
DEFENSE ELECTRONICS SUPPLY CENTER
SIZE
CODE IDENT NO.
DWG NO.
DAYTON, OHIO
A
14933
88030
REV G
PAGE
3
3.3 Electrical characteristics.
3.3.1 Resistance and resistance tolerance. The nominal resistance expressed in ohms is identified by four characters
consisting of three digits and a letter. The letter is used simultaneously as a decimal point, multiplier, and resistance tolerance
designator in accordance with MIL-PRF-55342 and herein (see table I). Minimum and maximum resistance values available
shall be as specified in 3.3.2, 3.3.6, and 6.6. Resistance values not listed in the "10 to 100" decade table of MIL-PRF-55342 for
the appropriate resistance tolerance shall be considered as not conforming to this drawing. The standard values for every
decade shall follow the sequence demonstrated for the "10 to 100" decade table specified in MIL-PRF-55342.
TABLE I. Designator of resistance values for resistance tolerances.
Designator for 0.1 percent tolerance
Resistance (ohms)
1A00 to 9A88 inclusive
10A0 to 98A8 inclusive
100A to 988A inclusive
1B00 to 9B88 inclusive
10B0 to 98B8 inclusive
100B to 988B inclusive
1C00
inclusive
Designator for 1.0 percent tolerance
1.00 to
9.88
10.0
to
98.8
100
to
988
1,000
to
9,880
10,000
to
98,800
100,000
to
988,000
1,000,000
Resistance (ohms)
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
1D00 to 9D76 inclusive
10D0 to 97D6 inclusive
100D to 976D inclusive
1E00 to 9E76 inclusive
10E0 to 97E6 inclusive
100E to 976E inclusive
1F00 to 9F76 inclusive
10F0 to 25F0 inclusive
Designator for 5.0 percent tolerance
1.00 to
9.76
10.0
to
97.6
100
to
976
1,000
to
9,760
10,000
to
97,600
100,000
to
976,000
1,000,000
to
9,760,000
10,000,000
to 25,000,000
Resistance (ohms)
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
1.00
10.0
100
1,000
10,000
100,000
1,000,000
10,000,000
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
1J00
10J0
100J
1K00
10K0
100K
1L00
10L0
to
to
to
to
to
to
to
to
9J10
91J0
910J
9K10
91K1
910K
9L10
25L0
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
inclusive
to
to
to
to
to
to
to
to
9.10
91.0
910
9,100
91,000
910,000
9,100,000
25,000,000
3.3.2 Resistance range. The resistance range shall be from 1 ohm to 25 megohms.
3.3.3 Resistance tolerances. The resistance tolerances for chip resistors shall be ±0.1 percent, ±1 percent, and ±5 percent in
accordance with MIL-PRF-55342 and table I herein.
3.3.4 Power rating. The power rating for chip resistors shall be 0.250 watt at +70OC derated to zero power at +150OC
(see figure 2).
3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 75 volts.
DEFENSE ELECTRONICS SUPPLY CENTER
SIZE
CODE IDENT NO.
DWG NO.
DAYTON, OHIO
A
14933
88030
REV G
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4
FIGURE 2. Derating curve.
3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be in accordance with
MIL-PRF-55342 and not exceed the values specified in table II.
TABLE II. Resistance temperature coefficient.
Characteristic
E and H
K and M
Resistance range
100Ω - 1MΩ
10Ω - 1MΩ
1Ω - 25MΩ
1Ω - 25MΩ
Resistance
tolerance
0.1 percent
1.0 percent
1.0 percent
5.0 percent
3.3.7 Termination. Termination material shall be in accordance with MIL-PRF-55342, code letter B.
3.3.8 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin
content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.3).
3.3.9 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of
the nominal resistance.
3.3.10 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage.
3.3.11 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage.
The change in resistance between initial and final measurements shall not exceed the values specified in table III.
3.3.12 Solderability. When resistors are tested as specified in 4.9, they shall meet the criteria for surface mount leadless
components in the test method.
3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be marked in
accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturer's name or Commercial and
Government Entity (CAGE) code, and date lot codes.
DEFENSE ELECTRONICS SUPPLY CENTER
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CODE IDENT NO.
DWG NO.
DAYTON, OHIO
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14933
88030
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TABLE III. Power conditioning.
Characteristic
Range
Change in resistance limit
All values
± (0.5 percent ±0.01 ohm)
M (±300 ppm/°C)
≤ 10 mΩ
± (0.5 percent ±0.01 ohm)
M (±300 ppm/°C)
> 10 mΩ
± (0.7 percent ±0.01 ohm)
E (±25 ppm/°C)
H (±50 ppm/°C)
K (±100 ppm/°C)
3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable
materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and
maintenance requirements, and promotes economically advantageous life cycle costs.
3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a
suggested source of supply.
3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or
appearance.
4. VERIFICATION
4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in
accordance with MIL-STD-790 is not applicable to this document.
4.2 Qualification inspection. Qualification inspection is not applicable to this document.
4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document.
4.4 Conformance inspection.
4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections.
4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table IV, and shall be made on
the same set of sample units, in the order shown.
4.4.1.1.1 Subgroup 1. Subgroup 1 tests shall be performed on a production lot basis on 100 percent of the product supplied
under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than
that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to
exceeding the specified resistance tolerance change limit shall not be furnished on contracts.
4.4.1.1.2 Subgroup 2. Subgroup 2 tests shall be performed on an inspection lot basis. A sample of 13 parts shall be
randomly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13
parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall
not be supplied against the document.
4.4.1.1.3 Subgroup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342.
DEFENSE ELECTRONICS SUPPLY CENTER
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CODE IDENT NO.
DWG NO.
DAYTON, OHIO
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14933
88030
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4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342.
4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements
in lieu of performing group B tests (see 6.2d).
4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction,
physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342.
TABLE IV. Group A inspection.
Inspection
Subgroup 1
DC resistance
Thermal shock
Power conditioning
DC resistance
Subgroup 2
Visual inspection
Subgroup 3
Solderability
Requirement
Method
3.3.9
3.3.10
3.3.11
3.3.9
4.6
4.7
4.8
4.6
3.2, 3.4, 3.7
4.5
3.3.12
4.9
Sampling
procedure
100 percent
13 samples,
0 failures
See 4.4.1.1.3
4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342.
4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342.
4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and
exceptions shall apply:
a. Method of mounting: Chip resistor sample units shall be mounted on a test fixture.
b. Test temperature: +70OC ±5OC.
c. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied
intermittently, 1.5 hours "on", and 0.5 hour "off", for the applicable number of hours and applicable test temperature. "On
time" shall be three quarters of the total elapsed time. During the "on" cycle, the voltage shall be regulated and
controlled to maintain ±5 percent of the rated continuous working voltage.
d. Duration: 100 hours ±4 hours.
e. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45
minutes and stabilized prior to final resistance measurement.
f. Examination after test: Resistors shall be examined for evidence of mechanical damage.
4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342.
DEFENSE ELECTRONICS SUPPLY CENTER
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CODE IDENT NO.
DWG NO.
DAYTON, OHIO
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14933
88030
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5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need
to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activity within the Military Department or Defense Agency, or within
the Military Department's Services System Command. Packaging data retrieval is available from the managing Military
Department’s or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature, which may be helpful, but is not mandatory.)
6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Resistors
are also for use in surface mount applications.
6.2 Ordering data. The contract or purchase order should specify the following:
a. Complete PIN (see 1.2).
b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts
have passed conformance inspection with each shipment of parts by the manufacturer.
c. Requirements for packaging and packing.
d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B
requirements.
6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker
growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a
whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to
inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for
Electrodeposited Coatings of Tin).
6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved sources of
supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be
achieved on-line at [email protected] or in writing to: DSCC-VAT, P.O. Box 3990, Columbus, OH 43218-3990 or by
telephone (614) 692-8754 or DSN 850-8754.
6.5 PIN supersession. PIN’s of revision C of this document have been superseded by a new PIN in revision D that
includes a combination resistance value and resistance tolerance in accordance with MIL-PRF-55342 and herein.
DEFENSE ELECTRONICS SUPPLY CENTER
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CODE IDENT NO.
DWG NO.
DAYTON, OHIO
A
14933
88030
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6.6 Sources of supply. Approved sources of supply are listed herein. Additional sources will be added as they become
available. Assistance in the use of this drawing may be obtained on on-line at [email protected] or contact DSCC-VAT,
P.O. Box 3990, Columbus, OH 43218-3990, or by telephone (614) 692-8754 or DSN 850-8754.
Characteristic
DSCC drawing PIN
88030-*****
Resistance
Range
Tolerance
(in percent)
K
1Ω
to
25MΩ
K
49Ω
to
10MΩ
M
1Ω
to
25MΩ
100Ω
to
1MΩ
0.1
10Ω
to
1MΩ
1.0
K and M
1Ω
to
25MΩ
1.0 and 5.0
M
1Ω
to
15MΩ
5.0
E and H
K and M
10Ω
to
1MΩ
Vendor similar
designation or type
number 1/
1.0
1.0 and 5.0
Vendor
CAGE
WA83SM-XXXXF-NS62
Vendor name
and address
50316
MINI-SYSTEMS, INC.
20 David Road
N. Attleboro, MA 02761-0069
H1005CPX******* (DEC 030)
H1005CA******B (DEC 030)
56235
State of the Art, Inc.
2470 Foxhill Road
State College, PA 16803-1797
RCWP-5100-ARO
91637
Vishay Dale Electronics, Inc.
rd
1122 23 Street
Post Office Box 609
Columbus, NE 68602-0609
WA83PG-XXXXF-NS62P
WA83PG-XXXXF-NS62X
WA83PG-XXXXF-NS62
1.0
1/ Parts must be purchased to the DSCC PIN to assure that all performance requirements and tests are met.
DEFENSE ELECTRONICS SUPPLY CENTER
SIZE
CODE IDENT NO.
DWG NO.
DAYTON, OHIO
A
14933
88030
REV G
PAGE
9
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