REVISIONS LT DESCRIPTION DATE APPROVED A Add new paragraph on resistance. Editorial changes throughout. 7 JUL 1989 D. MOORE B Breakout RTC into specific resistance ranges; change voltage rating to 75 volts; change power conditioning to allow for mounting on a test fixture. Editorial changes throughout. 3 DEC 1990 D. MOORE C Increase resistance range. Breakout characteristics for power conditioning and have individual resistance change limits. Editorial changes throughout. 13 DEC 1991 D. MOORE D Add new source of supply; add resistance tolerances 0.1 percent and 5.0 percent; add characteristic E; dimension changes in accordance with MIL-PRF-55342/3. Editorial changes throughout. 5 APR 1999 J. CRUM E Add new source of supply. Lower resistance value to 1 ohm for characteristics K and M. Editorial changes throughout. 5 MAY 2000 K. COTTONGIM F Table 1 correction. 5 year review cycle. Editorial and procedural changes throughout. 6 APR 2005 K. COTTONGIM G Additional vendor part number. Editorial and procedural changes throughout. 17 Aug 2007 M. RADECKI CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 REV STATUS G G REV OF PAGES PAGES 1 2 Selected item drawing G G G G G G G 3 4 5 6 7 8 9 PREPARED BY ALLAN R. KNOX DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH Original date of drawing CHECKED BY DAVID E. MOORE TITLE 20 May 1988 APPROVED BY DAVID E. MOORE PMIC N/A SIZE A REV AMSC N/A RESISTORS, CHIP, FIXED, FILM, STYLE 1005 CODE IDENT. NO. 14933 DWG NO. G PAGE 88030 1 OF 9 5905-E668 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, film, 0.100 X 0.050 chip resistor. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: 88030 ⏐ ⏐ Drawing number - * ⏐ ⏐ Characteristic (see 3.3.6) **** ⏐ ⏐ Resistance and resistance tolerance (see 3.3.1 and 3.3.3) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification For DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 MIL-STD-790 - MIL-STD-1285 - Test Method Standard Electronic and Electrical Component Parts. Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 2 Inches .005 .007 .015 .033 .050 .105 A 0.105 ±0.007 B .050 ±.005 C D .015 ±.005 .015/.033 mm 0.13 0.18 0.38 0.84 1.27 2.67 E .015 ±.005 NOTES: 1. Dimensions are in inches. Metric equivalents are given for general information only. 2. The pictorial view is representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspect of the device are acceptable. FIGURE 1. Chip resistor. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 3 3.3 Electrical characteristics. 3.3.1 Resistance and resistance tolerance. The nominal resistance expressed in ohms is identified by four characters consisting of three digits and a letter. The letter is used simultaneously as a decimal point, multiplier, and resistance tolerance designator in accordance with MIL-PRF-55342 and herein (see table I). Minimum and maximum resistance values available shall be as specified in 3.3.2, 3.3.6, and 6.6. Resistance values not listed in the "10 to 100" decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered as not conforming to this drawing. The standard values for every decade shall follow the sequence demonstrated for the "10 to 100" decade table specified in MIL-PRF-55342. TABLE I. Designator of resistance values for resistance tolerances. Designator for 0.1 percent tolerance Resistance (ohms) 1A00 to 9A88 inclusive 10A0 to 98A8 inclusive 100A to 988A inclusive 1B00 to 9B88 inclusive 10B0 to 98B8 inclusive 100B to 988B inclusive 1C00 inclusive Designator for 1.0 percent tolerance 1.00 to 9.88 10.0 to 98.8 100 to 988 1,000 to 9,880 10,000 to 98,800 100,000 to 988,000 1,000,000 Resistance (ohms) inclusive inclusive inclusive inclusive inclusive inclusive inclusive 1D00 to 9D76 inclusive 10D0 to 97D6 inclusive 100D to 976D inclusive 1E00 to 9E76 inclusive 10E0 to 97E6 inclusive 100E to 976E inclusive 1F00 to 9F76 inclusive 10F0 to 25F0 inclusive Designator for 5.0 percent tolerance 1.00 to 9.76 10.0 to 97.6 100 to 976 1,000 to 9,760 10,000 to 97,600 100,000 to 976,000 1,000,000 to 9,760,000 10,000,000 to 25,000,000 Resistance (ohms) inclusive inclusive inclusive inclusive inclusive inclusive inclusive inclusive 1.00 10.0 100 1,000 10,000 100,000 1,000,000 10,000,000 inclusive inclusive inclusive inclusive inclusive inclusive inclusive inclusive 1J00 10J0 100J 1K00 10K0 100K 1L00 10L0 to to to to to to to to 9J10 91J0 910J 9K10 91K1 910K 9L10 25L0 inclusive inclusive inclusive inclusive inclusive inclusive inclusive inclusive to to to to to to to to 9.10 91.0 910 9,100 91,000 910,000 9,100,000 25,000,000 3.3.2 Resistance range. The resistance range shall be from 1 ohm to 25 megohms. 3.3.3 Resistance tolerances. The resistance tolerances for chip resistors shall be ±0.1 percent, ±1 percent, and ±5 percent in accordance with MIL-PRF-55342 and table I herein. 3.3.4 Power rating. The power rating for chip resistors shall be 0.250 watt at +70OC derated to zero power at +150OC (see figure 2). 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 75 volts. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 4 FIGURE 2. Derating curve. 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be in accordance with MIL-PRF-55342 and not exceed the values specified in table II. TABLE II. Resistance temperature coefficient. Characteristic E and H K and M Resistance range 100Ω - 1MΩ 10Ω - 1MΩ 1Ω - 25MΩ 1Ω - 25MΩ Resistance tolerance 0.1 percent 1.0 percent 1.0 percent 5.0 percent 3.3.7 Termination. Termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.8 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.3.9 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.10 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage. 3.3.11 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed the values specified in table III. 3.3.12 Solderability. When resistors are tested as specified in 4.9, they shall meet the criteria for surface mount leadless components in the test method. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturer's name or Commercial and Government Entity (CAGE) code, and date lot codes. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 5 TABLE III. Power conditioning. Characteristic Range Change in resistance limit All values ± (0.5 percent ±0.01 ohm) M (±300 ppm/°C) ≤ 10 mΩ ± (0.5 percent ±0.01 ohm) M (±300 ppm/°C) > 10 mΩ ± (0.7 percent ±0.01 ohm) E (±25 ppm/°C) H (±50 ppm/°C) K (±100 ppm/°C) 3.5 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table IV, and shall be made on the same set of sample units, in the order shown. 4.4.1.1.1 Subgroup 1. Subgroup 1 tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup 2 tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 6 4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342. TABLE IV. Group A inspection. Inspection Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance Subgroup 2 Visual inspection Subgroup 3 Solderability Requirement Method 3.3.9 3.3.10 3.3.11 3.3.9 4.6 4.7 4.8 4.6 3.2, 3.4, 3.7 4.5 3.3.12 4.9 Sampling procedure 100 percent 13 samples, 0 failures See 4.4.1.1.3 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resistor sample units shall be mounted on a test fixture. b. Test temperature: +70OC ±5OC. c. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied intermittently, 1.5 hours "on", and 0.5 hour "off", for the applicable number of hours and applicable test temperature. "On time" shall be three quarters of the total elapsed time. During the "on" cycle, the voltage shall be regulated and controlled to maintain ±5 percent of the rated continuous working voltage. d. Duration: 100 hours ±4 hours. e. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. f. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 7 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department or Defense Agency, or within the Military Department's Services System Command. Packaging data retrieval is available from the managing Military Department’s or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature, which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Resistors are also for use in surface mount applications. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved on-line at [email protected] or in writing to: DSCC-VAT, P.O. Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-8754 or DSN 850-8754. 6.5 PIN supersession. PIN’s of revision C of this document have been superseded by a new PIN in revision D that includes a combination resistance value and resistance tolerance in accordance with MIL-PRF-55342 and herein. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 8 6.6 Sources of supply. Approved sources of supply are listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained on on-line at [email protected] or contact DSCC-VAT, P.O. Box 3990, Columbus, OH 43218-3990, or by telephone (614) 692-8754 or DSN 850-8754. Characteristic DSCC drawing PIN 88030-***** Resistance Range Tolerance (in percent) K 1Ω to 25MΩ K 49Ω to 10MΩ M 1Ω to 25MΩ 100Ω to 1MΩ 0.1 10Ω to 1MΩ 1.0 K and M 1Ω to 25MΩ 1.0 and 5.0 M 1Ω to 15MΩ 5.0 E and H K and M 10Ω to 1MΩ Vendor similar designation or type number 1/ 1.0 1.0 and 5.0 Vendor CAGE WA83SM-XXXXF-NS62 Vendor name and address 50316 MINI-SYSTEMS, INC. 20 David Road N. Attleboro, MA 02761-0069 H1005CPX******* (DEC 030) H1005CA******B (DEC 030) 56235 State of the Art, Inc. 2470 Foxhill Road State College, PA 16803-1797 RCWP-5100-ARO 91637 Vishay Dale Electronics, Inc. rd 1122 23 Street Post Office Box 609 Columbus, NE 68602-0609 WA83PG-XXXXF-NS62P WA83PG-XXXXF-NS62X WA83PG-XXXXF-NS62 1.0 1/ Parts must be purchased to the DSCC PIN to assure that all performance requirements and tests are met. DEFENSE ELECTRONICS SUPPLY CENTER SIZE CODE IDENT NO. DWG NO. DAYTON, OHIO A 14933 88030 REV G PAGE 9