LQFP Package

ID.06-09-0127
Vendor:
Package:
Assembly:
Final Test:
Q.C. Test:
Source Accept Test:
Quality Contact:
REV. Ø
LQFP/EXPOSED PAD LQFP ASSEMBLY FLOWCHART
ASSEMBLY FLOWCHART
LQFP/EXPOSED PAD LQFP PACKAGE
Updated 05/23/2011
Linear Technology Corporation
LQFP/Exposed Pad LQFP package
ASE Malaysia
Linear Technology Corp., Milpitas, CA.,& Singapore
Linear Technology Corp., Milpitas, CA.,& Singapore
Linear Technology Corp., Milpitas, CA.,& Singapore
Naib Girn, LTC Milpitas, CA
(408) 432-1900 Ext. 2519
INCOMING
QUALITY INSPECTION AND GATE
MANUFACTURING PROCESS
QUALITY MONITOR / SURVEILLANCE
REWORK
FLOW CHART
INCOMING ASSY
REWORK
PROCESS
STEP
WAFER SORT
WAFER SORT
MONITOR
KIT FOR
OVERSEAS
ASSEMBLY (N/A
FOR PENANG)
WAFER MOUNT
DESCRIPTION
100% DIE LEVEL
ELECTRICAL TEST
REJECTS ARE
INKED
INSPECTION/TEST
CRITERIA
PROBE DEFECTS 2
OPTICAL DEFECTS
METHOD &
EQUIPMENT
SAMPLING PLAN
SPC TECHNIQUE
ND
WAFER PROBER
75X
MICROSCOPE
MINIMUM OF 1 TIME
PER SHIFT.
S/S=1, ACC= 0
LOG
VISUAL
INSPECTION
UNAIDED
EYE
3 WAFERS/SHIFT
Ø PPM TARGET
GO/NO GO
INSPECTION
ALIGGNMENT
ACCURACY
TV ALIGNMENT MICRO
AUTOMATION OR
DISCO SAW 10X TO
30X MICROSCOPE
EVERY WAFER LOT/
MACHINE.
LOG
MONITOR
ND
PROBING AND 2
OPTICAL QUALITY
WAFERS ARE
KITTED WITH LTC
BONDING
DIAGRAM AND LTC
ASSEMBLY
TRAVELER
PREPARATION
FOR DIE
WAFER MOUNT
MONITOR
SEPERATION
WAFER SAW
DIE SEPERATION
Ø PPM TARGET
BACTERIA
COUNT
BACTERIA
CULTURE
10 COL/100CC
BACTERIA CULTURE
1X PER WEEK
LOG
SET-UP CHECK
INSPECTION
PER SPEC
VISUAL
EA WAFER LOT
LOG
BLADE LIFE
45K IN SAW LIFE
COUNT USAGE
N/A
LOG
SAW KERF
1.0 TO 2.2 MILS
TM MICROSCOPE OR
EQUIVALENT
ONCE PER SHIFT 4
CUTS PER MACHINE
NP CHART
PARAMETERS
PRESSURE,
SPEED, CUT,
COUNT
PER SPEC
VISUAL
1X PER SHIFT
LOG
PARAMETERS
PRESSURE,
SPEED, CUT,
COUNT
PER SPEC
VISUAL
1X PER SHIFT
LOG
DI WATER
QUALITY
RESISTIVITY
12M OHM MIN
RESISTIVITY METER
1X PER SHIFT
LOG
Revision Ø.
LINEAR TECHNOLOGY CORPORATION
PAGE 1 OF 4
ID.06-09-0127
REV. Ø
LQFP/EXPOSED PAD LQFP ASSEMBLY FLOWCHART
Pg 2 of 4
FLOW CHART
INCOMING ASSY
REWORK
PROCESS
STEP
DIE SORT
ND
2 OPT
DIE SORT
BUY OFF
DESCRIPTION
YIELD TRIGGER
93.0%
LOG
VISUAL
INSPECTION
PER SPEC
75X
MICROSCOPE
32/LOT
ACC= Ø, REJ= 1
LOG
PER SPEC
AUTO DIE ATTACHER
20X MICRO SCOPE
1 STRIP/MAG
ACC= Ø, REJ= 1
LOG
PER SPEC
20X TO 40X
MICROSCOPE
1 STRIP/WAFER LOT
ACC= Ø, REJ= 1
LOG
PER SPEC
75X TO 200X
MICROSCOPE
4 UNITS/WAFER LOT
CHIPS, CRACKS
LOG
DIE SHEAR
TESTER
30X TO 60X
MICROSCOPE
3 UNITS PER OVEN
LOAD
NP CHART
20X TO 40X
2 STRIPS/OVEN/DAY
ZERO BLEED
PYROMETER
1X/DAY
AUTO THERMOSONIC
BALL BONDER
20X TO 40X
10 UNITS/LOT
ACC= Ø , REJ= 1
VISUAL
DIE BACK
CRACK
VISUAL
DIE ATTACH
MONITOR
VISUAL
QUALITY
RESIN BLEED
VISUAL
EPOXY CURE
CURE TEMP
CAPILLARY LIFE
SET-UP
WIRE BOND
MONITOR
SPC TECHNIQUE
75X
MICROSCOPE
DIE PLACEMENT
PARAMETERS
SAMPLING PLAN
PER SPEC
DIE BONDED
WITH EPOXY
SURVEILLANCE
METHOD &
EQUIPMENT
VISUAL
INSPECTION
DIE ATTACH
WIRE BOND
INSPECTION/TEST
CRITERIA
BALL BONDS
VISUAL
VISUAL
VISUAL
EPOXY CURE
+175°C +/-5°C
GOLD WIRE
PER SPEC
LOG
LOG
LOG
10 UNITS/MAG
ACC= Ø , REJ= 1
PER SPEC
LOG
1X PER LOT
COUNT USAGE
EVERY 6 SHIFTS
20X TO 40X
MICROSCOPE
VISUAL
WIRE PULL
20X TO 40X
MICROSCOPE
LOG
5GM(1MIL), 7GM
(1.3MIL), 8GM (1.5MIL),
12GM (2MIL), 15GM
(3MIL)
LOG
10 UNITS/LOT
ACC= Ø, REJ= 1
BOND PULL TESTER
X BAR R CHART
EACH LOT/CAP
CHANGE (ALL
WIRES)
BALL SHEAR TESTER
BALL SHEAR
VISUAL
36GM (1ML); 40GM
(OTHER SIZES) GND
BOND 60GM (1ML)
80GM (1.3MIL), 120GM
(1.5MIL)
PARAMETERS
VISUAL
(POWER FORCE TIME,
TEMP)
BOND PEEL
TEST
VISUAL
>25% AU REMAINING
BOND CRATER
VISUAL
NO CRATERING
VISUAL
INSPECTION
PER SPEC
20X TO 40X
MICROSCOPE
YIELD TRIGGER 95%
LOG
PER SPEC
MIN 30X MICROSCOPE
125 PER LOT
ACC= Ø, REJ= 1
(MRB>10%, 3X REJ)
LOG
EACH LOT/CAP
CHANGE (5 WIRES
INCLUDING GND
BONDS)
1X / DAY
RD
3 OPTICAL
INSPECTION
RD
QA 3 OPTICAL
INSPECTION
CHECK FOR
WORKMANSHIP
QUALITY
75X MICROSCOPE
75X MICROSCOPE
X BAR R CHART
LOG
1 WIRE/MACH/DAY
LOG
LOG
1X/MACH/DAY
(10 UNITS)
Revision Ø.
LINEAR TECHNOLOGY CORPORATION
PAGE 2 OF 4
ID.06-09-0127
REV. Ø
LQFP/EXPOSED PAD LQFP ASSEMBLY FLOWCHART
Pg 3 of 4
FLOW CHART
INCOMING ASSY
REWORK
PROCESS
STEP
DESCRIPTION
INSPECTION/TEST
CRITERIA
METHOD &
EQUIPMENT
SAMPLING PLAN
SPC TECHNIQUE
CHECKLIST
MOLD-EPOXY
NOVOLAC
SURVEILANCE
ENCAPSULATION
PARAMETERS
PER SPEC
VISUAL
1X/SHIFT
VISUAL
PER SPEC
MIN 3X
1 SHOT/LOT
ACC= Ø, REJ = 1
CHECKLIST
X BAR R CHART
+175°C +/- 5°C
TEMPERATURE
MOLD TEMP
PYROMETER
1X/SHIFT/MACH/
MOLD CHANGE
CHECKLIST
SURVEILLANCE
VISUAL
PER SPEC
MIN 3X
1 SHOT/LOT
ACC= Ø, REJ= 1
MOLD TEMP
+175°C +/- 5°C
PYROMETER
1X/SHIFT/MATCH/
MOLD CHANGE
VISUAL
PER SPEC
30X TO 40X
MICROSCOPE
6 STRIPS/MATCH/
SHIFT/CONVERSION
VISUAL
AGE LIFE
VISUAL
1X/SHIFT
OFFSET
<2.5MIL (SSOP)
TOOLMAKER’S
1X/DAY/MC
4 UNITS/SHOT
PRESS
PER SPEC
VISUAL
1X / MACH / DAY/
1X/ DAY
XRAY VISUAL
SWEEP, VOIDS,
WIRE DEFECTS
SOFT XRAY
EVERY LOT 20 UNITE
ACC= Ø, REJ = 1
X BAR R CHART
TEMPERATURE
SURVEILLANCE
COMPOUND
AGEING CHECK
MISMATCH
LOG
LOG
PARAMETERS
MOLD QUALITY
LOG
POST MOLD
CURE
TEMPERATURE
+175°C +/- 5°C
6HOURS
PYROMETER
POST MOLD
CURE MONITOR
TEMPERATURE
+175°C +/- 5°C
6HOURS
PYROMETER
DEFLASH
VISUAL
REMOVE MOLD
FLASH FROM
PACAKGE
DEFLASH
MONITOR
PRESSURE
MARKING
VISUAL
INSPECTION
SET-UP CHECK
VISUAL
PERMANENCY
MARK
PERMANENCY
PER SPEC
PER SPEC
PER SPEC
1X/OVEN/DAY
UNAIDED EYE
2X/SHIFT/PKG
CHANGE-5 STRIPS
ACC= Ø, REJ = 1
LOG
PRESSURE GAGE
2X/SHIFT/MACH
LOG
UNAIDED EYE
2 STRIPS/3X/SHIFT
ACC= Ø, REJ= 1
LOG
1X/ SHIFT
CHECKLIST
1 LOT/MACH/SHIFT
11 UNITS
ACC= Ø, REJ =1
LOG
PER SPEC
1 SOLUTION
CONTINUOUS
UNAIDED EYE
3 SOLUTIONS
UNAIDED EYE
IR, VISCOSITY
VISUAL
SOLDER
PLATE
INSPECTION
PARAMETERS
PER SPEC
UNAIDED EYE
THICKNESS AND
COMPOSITION
300-800 u INCH
85% ±10%
XRF
SOLDERABILITY
(W & WO AGING)
95% COVERAGE
PACKAGE
CLEANLINESS
1.7µG/INCH SQUARED
PER SPEC
1X/WEEK (11 UNITS/
SOLUTION
ACC = Ø, REJ = 1
1X/SHIFT
Np CHART
1X/PKG/ SHIFT
LOG
1X/SHIFT/MACH/
CHANGE OF SOLDER
BATH-MIN OF 10
READINGS
Np CHART
20X TO 40X
MICROSCOPE
1X/SHIFT
10 UNITS
LOG
IONOGRAPH
3 LOTS/SHIFT
3 TESTS/ LOT
LOG
Revision Ø.
LINEAR TECHNOLOGY CORPORATION
PAGE 3 OF 4
ID.06-09-0127
REV. Ø
LQFP/EXPOSED PAD LQFP ASSEMBLY FLOWCHART
Pg 4 of 4
FLOW CHART
INCOMING
ASSY REWORK
PROCESS STEP
DESCRIPTION
INSPECTION/
TEST
CRITERIA
METHOD &
EQUIPMENT
SAMPLING PLAN
SPC
TECHNIQUE
SOLDER
PLATE
BUYOFF
VISUAL
SOLDER
QUALITY
ETC.
3X TO 10X
MICROSCOPE
TRIM & FORM
SINGULATION
SET-UP CHECK
PER SPEC
UNAIDED EYE
COPPLANARITY
LEAD SPREAD
STANDOFF
PER SPEC
COMPARATOR
LEAD FATIGUE
PER SPEC
LEAD TESTER
1X/ WK/ MACH
2 LEADS
LOG
CRACK/GAP
BUYOFF
VISUAL
PER SPEC
30X TO 45X
MICROSCOPE
(SINGULATED)
45/LOT/ CONVERSION
ST
200/1 LOT OF SHIFT
ACC= Ø, REJ= 1
LOG
DELAMINATION/C
CRACK
VISUAL
PER SPEC
SCANNING ACOUSTIC
MICROSCOPE
(STRIP FORM)
MIN 2 LOTS/SHIFT/
MACHINE
ACC= Ø, REJ= 1
LOG
SET-UP CHECK
PER SPEC
VISUAL
PER SPEC
30X TO 40X
MICROSCOPE
FINAL VISUAL
INSPECTION
VISUAL
QUALITY
PER SPEC
UNAIDED EYE
100%-YIELD
TRIGGER 95.0%
LOG
QA FINAL VISUAL
INSPECTION
CORRECT MARK PER SPEC
MARKING
PERMANENCY
TEST (IF INK
MARKED)
VISUAL BENT
LEADS MOLD
FLASH, SOLDER
QUALITY ETC.
UNAIDED EYE
S/S= 125
ACC= Ø, REJ= 1
LOG
QA PACK &
DOCUMENTATIO
N CHECK
PACKING &
PREPERATION
FOR DELIVERY
UNAIDED EYE
5 TUBES
ACC= Ø, REJ= 1
LOG
SHIP TO LTC
ANTISTATIC
TUBES
DEJUNK
S/S=125
ACC= Ø, REJ= 1
LOG
CHECKLIST
5 UNITS/SHIFT
2 UNITS/LOT
ACC= Ø, REJ= 1
nP CHART
1X/ DAY/ MACH/ 5UNITS
PER SPEC
UNAIDED EYE
5 UNITS/SHIFT
2 UNITS/ LOT
ACC= Ø, REJ= 1
LOG
45 UNITS HOURLY/
CONVERSION 100
ST
UNITS/1 LOT OF SHIFT
ACC= Ø, REJ= 1
EVERY LOT 100% BASIS
Revision Ø.
LINEAR TECHNOLOGY CORPORATION
PAGE 4 OF 4