F2MC-8FX FAMILY LQFP-64P(0.5mm Pitch) HEADER BOARD MB2146-220 OPERATION MANUAL

The following document contains information on Cypress products.
FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-26002-1E
F2MC-8FX Family
LQFP-64P(0.5mm Pitch) HEADER BOARD
MB2146-220
OPERATION MANUAL
PREFACE
Thank you for purchasing the LQFP-64P (0.5 mm pitch) *1 header board (MB2146-220) for the
F2MC *2 -8FX family.
The LQFP-64P header board is used in the header board unit to connect the MCU board (MB21463xx) which mounted F2MC-8FX family evaluation MCU board to a user system.
This manual explains the handling of the MB2146-220 header board for the F2MC-8FX family. Before using the MB2146-220 header board, be sure to read this manual.
Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-produced MCUs and evaluation MCUs which correspond on a MB2146-220 header board.
*1 : The lead pitch of PACKAGE (FPT-64P-M03) is 0.5 mm and the body size is 10 mm × 10
F2MC is the abbreviation used for FUJITSU Flexible Micro Controller.
*2 : mm.Using the product safely.
■■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
CAUTION
The wrong use of a device will give an injury and may cause malfunction on customers system.
Cuts
This product has parts with sharp points that are exposed.
Do not touch edge of the product with your bare hands.
Damage
When connect the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)
on the header board, otherwise the MCU bord and user system might be damaged.
Damage
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
©2004 FUJITSU LIMITED Printed in Japan
ii
1. Product outline
■■ Product outline
This product is a header board used to connect the MCU board (Part number : MB2146-3xx) carrying an evaluation MCU in the F2MC-8FX Family of Fujitsu 8-bit microcontrollers to a user system.
To build an F2MC-8FX evaluation environment, combine three products: the header board, MCU
board, and BGM adapter (Part number : MB2146-09).
MB2146-09
MCU board
BGM adapter
Header board
Figure 1 system-configuration
■■ Product configuration
Tables 1, and Table 2. list the product configuration in the header board package and options.
Table 1 product cofiguration
Name
Description
Remarks
F2MC-8FX
LQFP-64P (0.5 mm pitch)
Header board
[Part number:MB2146-220]
Connector/LQFP64pin
(0.5 mm pitch) Package conversion
[Part number :
YQPACK064SD]
(Tokyo Eletech Corporation)
Header board-I/F between NQPACK
Include
(Finishing connection)
[Part number :
NQPACK064SD]
(Tokyo Eletech Corporation)
User system mounting
Include
[Part number :
HQPACK064SD]
(Tokyo Eletech Corporation)
It is used at the time of mass-production
Include
MCU mounting to NQPACK.

Table 2 option (sold separately)
Name
Description
BGM adapter
[Part number : MB2146-09]
The ICE unit for F2MC-8FX
MCU board
[Part number : MB2146-3xx]
MB95FV100-xxx Built in
Remarks

F2MC-8FX evaluation
MCU Built in *
* : Several types of evaluation MCUs are available depending on their applications. Purchase the
one that satisfy the service conditions.
1
2. Checking the Delivered Product
Before using the LQFP-64P header board, confirm that the following components are included
in the box:
• LQFP-64P (0.5 mm pitch) Header board *1
:1
• Screws for securing Header board (M2 × 10 mm, 0.4 mm pitch)
:4
2
• NQPACK064SD *
:1
• HQPACK064SD *3
:1
• Operation manual (English version, this manual)
:1
*1 : Referred to as “header board”. Header board is mounted on YQPACK064SD (Tokyo Eletech
Corporation), referred to as “YQPACK”.
*2 : IC socket manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”, and supplied with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK064SD-SL (Tokyo Eletech Corporation, sold separately), can be used by making an
IC socket mounting hole on the user system board.For more information,contact Tokyo
Eletech Corporation.
*3 : IC socket cover manufactured by Tokyo Eletech Corporation,referred to as “HQPACK”, with
4 screws for securing HQPACK( M2 × 6 mm, 0.4 mm pitch).
3.Handling Precautions
The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header
in the proper environment, observe the following points regarding its insertion and removal:
• To avoid placing stress on the NQPACK mounted on the user system board during connecting
the header board.
2
4. Notes on Designing
■■ Restrictions of PC board for the user system
If a tall component is mounted around the NQPACK mounted on the user system, the header board
connected to the user system touches the component. To prevent this, design the pc board of the user
system such that the height specified in Figure 2 is not exceeded. Figure 2 shows dimension figure
of the header board.
13.0 mm
40.0 mm
30.0 mm
32
U1
64
17
16
WR-120SB-VF-1 : JAE
119
119
1
120
CN1
33
120
40.0 mm
CN2
48
49
1
2
1
2
CN3
18.0 mm
PCW-1-1PW
:MAC EIGHT
4-R5.0
YQSOCKET064SDF
:Tokyo Eletech Corporation
YQPACK064SD
:Tokyo Eletech Corporation
1.6 mm
4.85 mm
Approximately
15.85 mm *
WR-120SB-VF-1 : JAE
NQPACK064SD
:Tokyo Eletech Corporation
User system
U1:User system I/F connector
CN3:Incorrect insertion preventive socket
CN1/CN2:MCU board I/F connector
* : The height differs slightly depending on how the socket are engaged.
Figure 2 Header board dimensions
3
■■ MCU footprint design notes
0.5 mm
0.25 mm
2.0 mm
Figure 3 shows the recommended dimensions of the NQPACK footprint mounted on the PC board
of the user system.
The PC board of the user system must be designed with due consideration given to this footprint as
well as to the mass production MCU.
To follow updated information, be sure to contact Tokyo Eletech Corporation whenever designing
the PC board.
2.0 mm
Figure 3 Recommended dimensions of the footprint for mounting the NQPACK
4
14 mm
10 mm
No.1 Pin
5. Procedure for Connecting the User System
■■ Connecting
Before using the LQFP-64P (0.5 mm pitch) header board, mount the supplied NQPACK on the user
system.
17
64
1
48
33
16
32
49
1. To connect the header board to the user system, match the index mark (▲) on the NQPACK
mounted on the user system with the index mark (the notched corner of silk-screen printing) on
the header board and then insert it (See Figure 4) . The pin of YQPACK is thin and easy to bent.
Insert NQPACK after confirm that the pin of YQPACK is not bent.
NQPACK Index
Header board Index
Figure 4 Index Position
2. Insert each screw for securing header board in each of the four drilled holes on the header board,
and then first tighten the screws in opposing corners followed by the two remaining screws (See
Figure 4) . The center screw hole is not used.
To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten
the four screws in sequence. Tightening the screws too tight might result in a defective contact.
3. Connect the MCU board to the header board while being careful not to excessively force the NQPACK. The MCU board can be connected to the header board only in the correct orientation as
they have a Incorrect insertion header socket to prevent reverse connection. Figure 5 illustrates
how the MCU board, header board, NQPACK, and user system are connected together.
5
MCU board
Evaluation
MCU
MCU board
Screws for securing YQPACK
Header board
YQSOCKET
Connection at the time of
shipment
YQPACK
NQPACK
User system
Figure 5 MCU board / header board Connection
■■ Disconnection
1. Remove the MCU board from the header board. Detach the four corners slowly in sequence not
to excessively force the junction with the NQPACK.
2. Remove all of the four screws from the header board.
3. Pull out the header board vertically from the NQPACK. Remove the header board slowly not to
excessively force the junction with the NQPACK.
6
6. Mounting Mass Production MCUs
To mount a mass production MCU on the user system, use the supplied HQPACK (See Figure 6).
■■ Mounting
1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, insert the
HQPACK into a NQPACK.
The pin of HQPACK is thin and easy to bent. Insert NQPACK after confirm that the pin of HQPACK is not bent.
3. Insert each screw for securing HQPACK in each of four drilled holes on the HQPACK, and then
first tighten the screws in opposing corners followed by the two remaining screws.
To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten
the four screws in sequence. Tightening the screws too tight might result in a defective contact.
Screws for securing HQPACK
HQPACK
Mass production MCU
NQPACK
User system
Figure 6 Mounting a mass production MCU
■■ Disconnection
To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from
the NQPACK. If you take out an Mass production MCU, use a dropper jig dedicated to IC removal
to remove the Mass production MCU by suction force. Do not attempt to remove the Mass production MCU forcibly, for example, using a screwdriver as doing so can bend the Mass production MCU
leads or break the NQPACK.
7
7. Product specification
■■ General specification
The general specification of a header board is shown in Table 3.
Table 3 General specification
Item
Description
Operating/storage temperature
5 °C to 35 °C (At the time of operation)
0 °C to 40 °C (At the time of storage)
Operating/storage humidity
20% to 80% (At the time of operation)
20% to 80% (At the time of storage)
Dimensions
40 mm × 40 mm × 16 mm
(Height contains YQPACK and NQPACK)
Weight
Header board : About 11g
■■ main composition
The main composition component of a header board is shown in Table 4.
Table 4 main composition
Item
Description
120 pins 0.5 mm pitch 2 piece connector
(straight) × 2
[Model number: WR-120SB-VF-1 (JAE)]
MCU board I/F connector
2 pins 2.54 mm pitch 1 piece socket
Incorrect insertion preventive socket (Straight)
[Model number:PCW-3-1-1PW (MAC EIGHT)]
User target system I/F connector
socket
64 pin 0.5 mm pitch
[Model number:YQSOCKET064SDF (Tokyo Eletech
Corporation)]
■■ Functional block diagram
A header board performs socket conversion between the I/F connector of a MCU board, and YQPACK. Parts, such as IC, are not in an inside. A block diagram is shown in Figure 7.
MCU board I/F connector
USER target system I/F connector
(Package correspondence socket)
Figure 7 Functional block diagram
8
■■ MCU board I/F connector(CN1/CN2/CN3)
CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a
MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the
pin assignment of the MCU board I/F connector CN2 is shown in Table 6.
Table 5 Pin assignment of the MCU board I/F connector CN1
Connector Pin
Numbers
Evaluation
MCU
Pin Numbers
Signal
name
Connector Pin
Numbers
Evaluation
MCU
Pin Numbers
Signal
name
1
A9
PC4
41
E2
LVR3
2
B9
PC1
42
E1
LVSS
3
C9
PC2
43
F4
LVDREXT
4
D9
PC3
44
F3
LVDBGR
5
A8
PC0
45
F2
LVDENX
6
B8
PB4
46
F1
7
C8
PB5
47
−
8
D8
PB6
48
9
A7
PB7
10
B7
11
C7
12
13
ConnecEvaluation
tor Pin
MCU
Numbers. Pin Numbers
81
Signal
name
P3
BSOUT
82
P4
BDBMX
83
R1
P83
84
R2
BRSTX
85
R3
X0A
P22A
86
R4
RSTX
GND
87
T1
ROMS1
−
GND
88
T2
BSIN
49
G4
P20A
89
T3
Vss
PB2
50
G3
NC1
90
T4
X0
PB0
51
G2
P21A
91
U1
BEXCK
D7
PB1
52
G1
P23A
92
U2
X1
A6
PB3
53
H4
P24A
93
U3
MOD
14
B6
PA2
54
H3
P25A
94
U4
PF2
15
C6
P95
55
H2
P26A
95
V1
X1A
16
D6
PA0
56
H1
P27A
96
V2
Vcc53
17
A5
PA3
57
J4
P24B
97
−
GND
18
B5
P94
58
J3
P50
98
−
GND
19
C5
P90
59
J2
P23B
99
V3
PINT0
20
D5
P91
60
J1
P51
100
V4
PSEL_EXT
21
A4
PA1
61
K1
P52
101
R5
PF1
22
A3
P93
62
K2
P55
102
T5
PF0
23
−
GND
63
K3
P54
103
U5
NC2
24
−
GND
64
K4
P53
104
V5
PENABLE
25
A2
CSVENX
65
L1
P70
105
R6
APBENX
26
A1
Vss
66
L2
P74
106
T6
PINT1
27
B4
P92
67
L3
P73
107
U6
PCLK
28
B3
TCLK
68
L4
P72
108
V6
PADDR0
29
B2
LVCC
69
M1
P71
109
R7
PACTIVE
30
B1
LVDIN
70
M2
P76
110
T7
PLOCK
31
C4
Cpin
71
M3
P80
111
U7
PWRITE
32
C3
Vcc51
72
M4
P77
112
V7
PADDR1
33
C2
LVDENX2
73
−
GND
113
R8
PADDR2
34
C1
LVR4
74
−
GND
114
T8
PADDR3
35
D4
TESTO
75
N1
P75
115
U8
PADDR4
36
D3
LVDOUT
76
N2
P82
116
V8
PADDR5
37
D2
LVR2
77
N3
PG0
117
R9
PADDR7
38
D1
BGOENX
78
N4
P84
118
T9
PRDATA0
39
E4
LVR1
79
P1
P81
119
U9
PADDR6
40
E3
LVR0
80
P2
ROMS0
120
V9
PRDATA1
9
Table 6 Pin assignment of the MCU board I/F connector CN2
ConnecEvaluation
Connector Pin
MCU
Signal name
tor Pin
Numbers Pin Numbers
Numbers
10
Evaluation
ConnecEvaluation
MCU
Signal name tor Pin
MCU
Pin Numbers
Numbers Pin Numbers
Signal
name
1
A10
PC5
41
E17
NC4
81
P16
P34
2
B10
PD0
42
E18
SEL0
82
P15
P35
3
C10
PC6
43
F15
SEL3
83
R18
P44
4
D10
PC7
44
F16
SEL4
84
R17
P36
5
A11
PD1
45
F17
SEL1
85
R16
P31
6
B11
PD2
46
F18
P04C
86
R15
AVcc3
7
C11
PD3
47
−
GND
87
T18
P40
8
D11
PD4
48
−
GND
88
T17
P32
9
A12
PD5
49
G15
P06C
89
T16
AVss
10
B12
PD7
50
G16
P07C
90
T15
AVR
11
C12
P61
51
G17
P05C
91
U18
P33
12
D12
P60
52
G18
P00C
92
U17
P30
13
A13
PD6
53
H15
P01C
93
U16
AVR3
14
B13
P64
54
H16
P02C
94
U15
P15
15
C13
P66
55
H17
P03C
95
V18
AVcc
16
D13
P65
56
H18
P07A
96
V17
DA0
17
A14
P62
57
J15
P04A
97
−
GND
18
B14
PE0A
58
J16
P05A
98
−
GND
19
C14
PE3A
59
J17
P06A
99
V16
P14
20
D14
PE2A
60
J18
P03A
100
V15
P10
21
A15
P63
61
K18
P02A
101
R14
P16
22
A16
P67
62
K17
P07B
102
T14
DA1
23
−
GND
63
K16
P01A
103
U14
P13
24
−
GND
64
K15
P00A
104
V14
PWDATA7
25
A17
PE4A
65
L18
P06B
105
R13
P11
26
A18
Vcc54
66
L17
P05B
106
T13
P12
27
B15
PE1A
67
L16
P04B
107
U13
NC3
28
B16
PE5A
68
L15
P03B
108
V13
PWDATA3
29
B17
PE7A
69
M18
P02B
109
R12
PWDATA5
30
B18
PE3B
70
M17
P00B
110
T12
PWDATA6
31
C15
PE6A
71
M16
P46
111
U12
PWDATA4
32
C16
Vss
72
M15
P47
112
V12
PRDATA7
33
C17
PE2B
73
−
GND
113
R11
PWDATA0
34
C18
PE7B
74
−
GND
114
T11
PWDATA1
35
D15
PE1B
75
N18
P01B
115
U11
PWDATA2
36
D16
PE0B
76
N17
P43
116
V11
PRDATA6
37
D17
PE6B
77
N16
P41
117
R10
PRDATA3
38
D18
SEL2
78
N15
P42
118
T10
PRDATA4
39
E15
PE5B
79
P18
P45
119
U10
PRDATA5
40
E16
PE4B
80
P17
P37
120
V10
PRDATA2
■■ User system I/F YQPACK (U1)
The user system I/F YQPACK pin assignment of a header board is shown in Table 7.
Table 7 Pin assignment of the User system I/F YQPACK
Connector Pin
Numbers
Signal name
Connector Pin
Numbers
Signal name
1
AVcc
33
P13/TRG0/ADTG
2
AVR
34
P14/PPG0
3
PE3/INT13
35
P20/PPG00
4
PE2/INT12
36
P21/PPG01
5
PE1/INT11
37
P22/TO00
6
PE0/INT10
38
P23/TO01
7
P83
39
P24/EC0
8
P82
40
P50/SCL0
9
P81
41
P51/SDA0
10
P80
42
P52/PPG1
11
P71/TI0
43
P53/TRG1
12
P70/TO0
44
P60/PPG10
13
MOD
45
P61/PPG11
14
X0
46
P62/TO10
15
X1
47
P63/TO11
16
VSS
48
P64/EC1
17
VCC
49
P65/SCK
18
PG0/(Cpin)
50
P66/SOT
19
X1A/PG2
51
P67/SIN
20
X0A/PG1
52
P43/AN11
21
RSTX/FTEST
53
P42/AN10
22
P00/INT00/HC00
54
P41/AN09
23
P01/INT01/HC01
55
P40/AN08
24
P02/INT02/HC02
56
P37/AN07
25
P03/INT03/HC03
57
P36/AN06
26
P04/INT04/HC04
58
P35/AN05
27
P05/INT05/HC05
59
P34/AN04
28
P06/INT06/HC06
60
P33/AN03
29
P07/INT07/HC07
61
P32/AN02
30
P10/UI0
62
P31/AN01
31
P11/UO0
63
P30/AN00
32
P12/UCK0
64
AVss
11
P12
P10
P30
P32
P43
P42
P37
P35
P36
P07
P00
P02
P04
PE0
PE3
P67
P60
P64
P65
Figure 8 Header board circuit diagram
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
[GND]
TP1
TEST_PIN
VCC
[VCC]
TP2
TEST_PIN
Silk display
WR-120SB-VF-1
VCC
PD0
PC5
PC7
PC6
PD2
PD1
PD4
PD3
PD7
PD5
P60
P61
P64
PD6
P65
P66
PE0A
P62
PE2A
PE3A
P67
P63
GND_2
GND_1
Vcc54
PE4A
PE5A
PE1A
PE3B
PE7A
Vss
PE6A
PE7B
PE2B
PE0B
PE1B
SEL2
PE6B
PE4B
PE5B
SEL0
NC4
SEL4
SEL3
P04C
SEL1
GND_4
GND_3
P07C
P06C
P00C
P05C
P02C
P01C
P07A
P03C
P05A
P04A
P03A
P06A
CONNECTOR B
P07B
P02A
P00A
P01A
P05B
P06B
P03B
P04B
P00B
P02B
P47
P46
GND_6
GND_5
P43
P01B
P42
P41
P37
P45
P35
P34
P36
P44
AVcc3
P31
P32
P40
AVR
AVss
P30
P33
P15
AVR3
DA0
AVcc
GND_8
GND_7
P10
P14
DA1
P16
PWDATA7
P13
P12
P11
PWDATA3
NC3
PWDATA6
PWDATA5
PRDATA7
PWDATA4
PWDATA1
PWDATA0
PRDATA6
PWDATA2
PRDATA4
PRDATA3
PRDATA2
PRDATA5
CN2
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
P13
P11
P14
P33
P31
P40
P34
P41
P06
P05
P01
P03
PE2
PE1
P63
P66
P62
P61
P4[3:0]
P3[7:0]
P1[4:0]
P6[7:0]
P3[7:0]
P4[3:0]
P6[7:0]
AVR
AVcc
P65
P66
P67
P43
P42
P41
P40
P37
P36
P35
P34
P33
P32
P31
P30
AVss
P65/SCK
P66/SOT
P67/SIN
P43/AN11
P42/AN10
P41/AN09
P40/AN08
P37/AN07
P36/AN06
P35/AN05
P34/AN04
P33/AN03
P32/AN02
P31/AN01
P30/AN00
AVss
PE[3:0]
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
U1
P8[3:0]
P7[1:0]
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PG1
PG2
PG0
P12
P11
P10
P07
P06
P05
P04
P03
P02
P01
P00
YQSOCKET064SDF
P12/UCK0
P11/UO0
P10/UI0
P07/INT07/HC07
P06/INT06/HC06
P05/INT05/HC05
P04/INT04/HC04
P03/INT03/HC03
P02/INT02/HC02
P01/INT01/HC01
P00/INT00/HC00
RSTX/FTEST
X0A/PG1
X1A/PG2
PG0/(Cpin)
Vcc
PE3
PE2
PE1
PE0
P83
P82
P81
P80
P71
P70
PE[3:0]
P64
P63
P62
P61
P60
P53
P52
P51
P50
P24
P23
P22
P21
P20
P14
P13
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P64/EC1
P63/TO11
P62/TO10
P61/PPG11
P60/PPG10
P53/TRG1
P52/PPG1
P51/SDA0
P50/SCL0
P24/EC0
P23/TO01
P22/TO00
P21/PPG01
P20/PPG00
P14/PPG0
P13/TRG0/ADTG
AVcc
AVR
PE3/INT13
PE2/INT12
PE1/INT11
PE0/INT10
P83
P82
P81
P80
P71/TI0
P70/TO0
MOD
X0
X1
Vss
12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P0[7:0]
Rev.
PG[2:0]
MOD
X0
X1
RSTX
P82
P53
P50
P51
P23
P22
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
WR-120SB-VF-1
PC1
PC4
PC3
PC2
PB4
PC0
PB6
PB5
PB2
PB7
PB1
PB0
PA2
PB3
PA0
P95
P94
PA3
P91
P90
P93
PA1
GND_2
GND_1
Vss_1
CSVENX
TCLK
P92
LVDIN
LVCC
Vcc51
Cpin
LVR4
LVDENX2
LVDOUT
TESTO
BGOENX
LVR2
LVR0
LVR1
LVSS
LVR3
LVDBGR
LVDREXT
P22A
LVDENX
GND_4
GND_3
NC1
P20A
P23A
P21A
P25A
P24A
P27A
P26A
P50
P24B
P51
P23B
CONNECTOR A
P55
P52
P53
P54
P74
P70
P72
P73
P76
P71
P77
P80
GND_6
GND_5
P82
P75
P84
PG0
ROMS0
P81
BDBMX
BSOUT
BRSTX
P83
RSTX
X0A
BSIN
ROMS1
X0
Vss_2
X1
BEXCK
PF2
MOD
Vcc53
X1A
GND_8
GND_7
PSEL_EXT
PINT0
PF0
PF1
PENABLE
NC2
PINT1
APBENX
PADDR0
PCLK
PLOCK
PACTIVE
PADDR1
PWRITE
PADDR3
PADDR2
PADDR5
PADDR4
PRDATA0
PADDR7
PRDATA1
PADDR6
CN1
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
CN3
2
PCW-3-1-1PW
1
Incorrect insertion preventive measures
VCC
Zone
Date
By
DR.
H.Hojo
CH.
H.Hojo
APR.
-
ITF-SUWA
Date.
2004-02-10
Sect.
Sect.
ITF-SUWA
PG2
P83
PG1
P81
P71
P80
P70
P52
P20
P21
P24
PG0
RD1-TCO3Y9BK
Document Number
1
Page
/
F2MC-8FX LQPF64(0.50) Header Board Assy
Title
F2MC-8FX
LQFP64pin(0.50mmPitch) Header board
P7[1:0]
P8[3:0]
PG[2:0]
P2[4:0]
P1[4:0]
P0[7:0]
P5[3:0]
P2[4:0]
P5[3:0]
1
■■ Circuit diagram
The circuit diagram of a header board is shown in Figure 8.
SS01-26002-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
F2MC-8FX Family
LQFP-64P(0.5mm Pitch) HEADER BOARD
MB2146-220
OPERATION MANUAL
July 2004 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited
Business Promotion Dept.