Data Sheet - AH351B_W

Da
ata
a S he et
AH3
351B
B_W
Partt Numbe
er : SPHW
WHTL3D
D3A2
S
SPHWHT
TL3D3A2
2
Introd
duction
n
Part Numberr : SPHW
WHTL3D
D3A2
omotive lighting
g, Traffic
c lighting etc.
Exterrior auto
Featu
ures
age : Cera
amic Subs
strate LED
D Package
 Packa
‧ View
w Angle : 135 ˚
‧ Optiical Efficie
ency : 110 lm/W at 350 mA
ondition : JEDEC
J
Le
evel 2a
 Preco
nsion : 3.5
5 x 3.5 mm
m
 Dimen
nous Flux : Typ. 12
20 lm at 3
350 mA
 Lumin
8KV [HBM]]
 ESD withstand Voltage : up to ±8
‧ Reliiability Tesst : AEC Q-101
Q
qua
alified
Appliications
s
 Trafficc lights
L
switc
ches, keyss, displays
s, illuminatted adverttising )
 Backlighting ( LCD,
or automotive lightin
ng
 Interio
andescentt lamps
 Substtitution of micro inca
er lights ( e.g. steps
s, exit wa
ays, etc. )
 Marke
al and sym
mbol lumin
naire
 Signa
Envirronmental Com
mplianc
ce
Samssung ELEC
CTRONICS is comp
pliant to th
he restrictions of haazardous
substan
nces in ele
ectronic equipment, namely, the
t
RoHS, ELV, ISO
O14001 an
nd
REACH
H directive
es. Samsung ELECT
TRONICS will not in
ntentionallyy supplem
ment the
6+
restricte
ed materia
als to the LED prod
duct : Cd,P
Pb,Hg,PBB
Bs,PBDEs and Cr
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Table
T
o
of Co
ontentts

Part Numberr Descrip
ption
-----------------------
3
-----------------------
4
-----------------------
5
pical Cha
aracterist ic
Typ
-----------------------
5
Lum
minous Flux
F
Bin
-----------------------
5
Forrward Vo
oltage Bin
n
-----------------------
5
Collor Bin Definition
D
-----------------------
6
Ord
dering infformation
n

Characteristic
cs

Abso
olute Maximum R
Rating
-----------------------
7

Typical Charracteristicc Graph
-----------------------
8

Mecchanical Dimensio
D
on
-----------------------
12
1

Sold
dering Co
ondition
----------------------
13
1

Packking Information
------------------------ 14
1

Prod
duct Labe
eling Info
ormation
-----------------------
16
1

Relia
ability Te
est Cond ition
-----------------------
17
1

Preccaution fo
or Use
-----------------------
18
1

Revision His
story
-----------------------
20
2

Com
mpany Infformation
n
-----------------------
20
2
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Part Nu
umber Descriptio
on
gnation is explained as follows :
The Part number desig
SP H W
WH T L3 D 3 A 2 A B C D E F
AB C DE F GH I J K L MN O
OP QR
Where:
AB - desig
gnates comp
pany name and
a
Samsun
ng LED PKG
G (SP for Samsung
S
LE
ED PKG)
C - designa
ates power variant (H for
f automotivve High Pow
wer)
DE - designates color variant (WH
H for automo
otive White color)
F - designa
ates LED PKG version (T for initia l version)
GH - desig
gnates produ
uct configura
ation and ty pe (L3 for 3535
3
Ceram
mic type)
I - designates lens con
nfiguration (D for lens)
J - designa
ates Max po
ower (3 for 3 +0.5W)
K - designa
ates specificc property (A
A for Revisi on symbol)
L - designa
ates CRI va
ariant (2 for CRI Max.70
0)
MN - desig
gnates forwa
ard voltage property
property
OP - desig
gnates CIE coordination
c
QR - desig
gnates lumin
nous flux pro
operty
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Charac
cteristic
cs
‧ Typiccal Chara
acteristics
s
[T
Ts = 25℃][1]
Parrameter
Sym
mbol
Valu
ue
Unit
Luminouss Flux (IF = 350 mA
A)
ΦV
Typ. 1120
lm
Forward Voltage (IIF = 350 mA)
m
Vf
Typ. 3.1
V
Reverse Voltage(IR = 5 mA))
VR
Typ. 00.9
V
Viewing A
Angle
φ
Typ. 1135
Deg.
Rthh_J-S
Typ. 7
K/W
Thermal Resistancce
(Junction
n to Solder Point)
ous Flux Bin[2]
 Lumino
Symbo
ol
ΦV
C
Condition
IF = 350 ㎃
[Ts = 25℃][1]
Bin Code
Min.
Typ
Max.
G
G2
100
-
120
JJ2
120
-
140
M
M2
140
-
160
P
P2
160
-
180
ge Bin[2]
 Forwarrd Voltag
Symbo
ol
Condition
Vf
IF = 350 mA
A
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Unit
lm
[T
Ts = 25℃][1]
Bin Code
Min.
Typ.
Max.
F
F3
2.8
-
3.1
JJ3
3.1
-
3.4
- 4 -
Unit
V
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‧ Colorr Bin De
efinition
Symbol
Cx,Cy
[3
3]
[C
Condition : IFF=350 ㎃] [Ts = 25℃][1]
Bin
Code
Cx
Cy
H1
0.3201
0.3
3192
0.3
3283
0.32
284
0.304
44
0.32544
0.3405
0.3169
H2
0.3284
0.3
3283
0.3
3381
0.33
382
0.3169
0.34055
0.3549
0.3323
H3
0.3382
0.3
3381
0.3
3479
0.34
480
0.3323
0.35499
0.3694
0.3476
H4
0.3
3480
0.3479
9
0.3515
0.3577
0.3
3578
0.3476
0.3694
0.3747
0.37
787
0.3635
*Notes
easurement condition me
eans that te
emperature dependence
d
is excludedd by applyin
ng pulse
[1] The me
current for under 25
5 ms.
us flux measuring equip
pment : CAS
S140CT
[2] Luminou
Tolerancce : VF : ±0
0.1V, ΦV : ±7
± %
[3] Chroma
aticity coordinates : Cx, Cy accordin
ng to CIE 1931. Cx and Cy tolerannces are ±0
0.01,
respectivvely.
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aximum Rating
gs
Absolute Ma
Param
meter
Symbo
ol
Value
e
Unit
Operating
g tempera
ature range
e
Top
-45 ~ +1 25
℃
Storage temperature range
Tstg
-45 ~ +1 25
℃
Junction temperatu
ure
Tjmax
+150
℃
IF
1000
mA
IF
100
mA
Maximum
m Forward current[4]
(Ts : 25 ℃)[5]
Minimum
m Forward current[4]
(Ts : 25 ℃)[5]
Do
o not appply for
Maximum
m Reverse
e current
re
everse currrent
Maximum
m Transien
nt Peaked current[6]
(Ts
: 25
5 ℃)[5]
ESD Sen
nsitivity[7]
mA
1000 mA for ≤ 10 ms
-
± 8.0 KV H
HBM
mA
*Note
[4] Unpredictable perfo
ormance may
y be resulte
ed by driving
g the produc
ct at below Min. IF or above
a
Max.
IF. But tthere will be
e no damag
ge to the pro
oduct.
is excludedd by applyin
[5] The me
easurement condition me
eans that te
emperature dependence
d
ng pulse
current for under 25
2 ms.
[6] Duty 1/10 pulse with 10 ms.
[7] It is inccluded the device
d
to pro
otect the pro
oduct from ESD.
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Typica
al Charracteristtics Grraph
um
 Typical Spectru
[ IF = 3
350 mA, Ts = 25 °C
C ][8]
‧ Typiccal Chrom
maticity Coordina
C
ate Shift vs Forwa
ard Currrent
[ IF = 350 mA, Ts = 25 °C
° ][8]
*Notes
easurement condition me
eans that te
emperature dependence
d
is excludedd by applyin
ng pulse
[8] The me
current for under 25
5 ms.
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e Lumino
ous Fluxx & Forw
ward Volta
age vs F
Forward Current
 Typical Relative
[ IF = 3
350 mA, Ts = 25 °C
C ][9]
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‧ Typiccal Relative Lumiinous Flu
ux & Forrward Vo
oltage vs Tempera
ature[9]
Solder Pad
d Temperature (℃)
Solder Pad Tempeerature (℃)
aticity Co
oordinate
e Shift vs
s Temperature
 Typical Chroma
[ IF = 3350 mA, Ts = 25 °C
C ][9]






Solder P ad Tempera
 ature (℃)
* Notes
[9] The me
easurement condition me
eans that te
emperature dependence
d
ng pulse
is excludedd by applyin
current for under 25
5 ms.

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‧ Typiccal Radia
ant Patte
ern
X
‧ Max. Permisssible Forrward Cu
urrent[10]
* Notes
measurementt condition means
m
that ttemperature dependence is excludeed by applying pulse
[10] The m
currentt for under 25
2 ms.
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Mechan
nical Dim
mension
Tolerance : ±0.1mm
[Top View]]
[[Side View]]
Therma
al
Pad
[Bottom View]
[Front View
w]
* Note : Th
he thermal pad
p
is electrically isolatted from the
e anode and
d cathode coontact pads..

‧ Pick and Place
Do not place pre
essure on the resin lens ("A")
It is reccommende
ed to use a pick&p lace nozzle with ins
side diameeter at 3.1
1 mm
‧ Electtric Sche
ematic Diagram
e
Cathode
ESD Protection
e
Diode
[ Circuit ]
‧ Mate
erial Inforrmation
LED Pacckage = Silicon
S
resin covered
d White GaN
G
LED on Ceram
mic Sub.
Electrode
e PAD = Au Plated
d PAD
This LED
D has built--in ESD prrotection de
evice(s) connected in parallel too LED Chip
p(s).
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Solde
ering Co
ondition
ns
Configura
ation & Solder P
Pad Lay
yout
 Pad C
Tolerancee : ±0.1mm
Baree copper pattern
p
Recomm
mended So
older Pad
w Solderring Con
ndition ( Pb Free)
 Reflow
Refflow Freque
ency : 2 times max.
al Solderring Con
ndition
 Manua
Not more than 5 seconds
s @MAX30
00℃, underr soldering iron.(one ttime only)
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Packin
ng Info
ormation
n
‧ Tapin
ng[11]
Use
er feed dire ction →
* Note
aping quantiity : 800EA / Reel.
[11] Unit : mm, LED ta
 Reel
[Unit
[
: mm]
A
180.0
0
B
-3.0
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60.0
C
+1.0
13.0
W1
±0.3
- 13 -
13.0
±0.5
W2
W
15.4
±1.0
S PHWHT
TL3D3A2
2
ng Proce
ess
 Packin
Dimensio
on of Tran
nsportation
n Box in m
mm
W
Width
Length
Height
Rema
ark
2
245
220
182
8 inch
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Produ
uct Labeling In
nformattion
ABCDEF
F3HH3J2
SPHWHTL33D3A2F6HBG4
F33H3G2
Bin code
01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT940001 / 1001 / 800 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ber
Lot Numb
oted rank is the only ex
xample.
N.B) Deno
ode Stru
ucture
 Bin Co
AB : Forward Voltage(VF) Bin (reffer to page
e. 5 )
CD : Color bin
n (Cx,Cy) (refer to p
page. 6)
EF : Luminouss Intensity((IV) Bin (re
efer to pa
age. 5 )
umber Structure
S
e
 Lot Nu
The Lot numb
ber is com
mposed off the follow
wing chara
acters
1234
456789 / 1abc / 80
00 PCS
No.
Inforrmation
1
Production Site : S:SAMS
SUNG LED, G:GOS
SIN CHINA
A
2
LED
3
Product State
A :Normality, B :Bulk, C :First Prod
duction, R :Reproduuction, S :Sample
:
4
Year : X:2013, Y:2014, Z
Z:2015 ...
5
Month
h : 1 ~ 9, A, B
6
Day : 1 ~ 9, A,
A B ~ V
789
Product numberr : 1 ~ 99
99
abc
Reel Number : 1 ~ 999
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Reliab
bility Te
est Cond
ditions
Fo
or dettailed Inforrmatio
on ple
ease conta
act
your SA
AMSU
UNG S
Sales partn
ner
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Preca
aution for Use
er-current-p
proof functio
on, custom
mers are recommended to apply resistors to
t
1) For ove
preven
nt sudden change of the curren
nt caused by
b slight sh
hift of the vvoltage.
과전류
류 방지를 위해
위
전압의 미세한 이
이동에 의해 야기되는 전류의 순간
간 변화를 방지하기
방
위해 저
저항 등의 설치를 권장
장함.
device shou
uld not be used in an
ny type of fluid such as water, oil, organiic
2) This d
solve
ent, etc. When
W
wash
hing is requ
uired, IPA is recomme
ended to u se.
제품은
은 물, 오일, 유기물과 같은 액체 타입에서의
의 사용은 제한되며,
제
세
세정이 필요할 시에는
IPA 사
사용을 권장함.
ecided afterr considerin
ng the
3) When the LEDs illuminate, operating current should be de
ent maximum tempera
ature.
ambie
LED의
의 발광 시, 동작 전류는
는 주변 최 고온도를 고려하여
고
결정되어야 함
함.
s
in a clean env ironment.
4) LEDs must be stored
months or more
m
after being shippped from
If the LEDs are to be storred for 3 m
onics, they should be
e packed by a sealed container with nitrog
gen gas
ung Electro
Samsu
injecte
ed.(Shelf liffe of sealed
d bags: 12
2 months, te
emp. ~40 ℃,
℃ ~90 % R
RH)
LED의
의 보관은 청정한
청
환경에서 보존되
되어져야 하며,
하
만약 삼성전자로부
삼
부터 공급받
받는 후
3개월 또는 그 이상
이
보관이 필요하다면
면 질소 가스를 동봉한
한 보존용기 에 보관되어
어야 함.
명 : 12 개월
월, 보존 온도
도 ~40 ℃, 습도 ~90 % RH)
(보존 bag의 수명
5) After sstorage bag
g is open, device sub
bjected to soldering, solder refloow, or othe
er
high ttemperature
e processes
s must be::
보존 B
Bag이 개봉
봉된 후에, 납땜이나
납
re
eflow등의 높은
높 온도에 노출되는 제품은 다음의
사항에
에 부합되어야 함.
a. Mo
ounted within 672 hours (28 dayss) at an as
ssembly line with a coondition of no
morre than 30 ℃/60 %RH
H,
a. 제품
품은 30 ℃/60 %RH보다
다 같거나 낮은 조립조
조건에서 67
72시간 (28일
일)이내에
조립
립해야 함.
b. Sto
ored at <10
0 %RH.
b. 10 % 이하의 상대습도에
에서 보관되어
어야 함.
w
anti-mo
oisture pac
cking, fold to
t close anny opening and
6) Repacck unused Products with
then sstore in a dry place.
사용하
하지 않은 제품은
제
방습팩에 넣어 개봉 부위를
를 닫아서 다시 포장한
한 후, 건조한
장소에
에서 보관할 것을 권장
장함.
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7) Device
es require baking beffore mountiing, if humidity card reading
r
is >60 %
at 23±
±5 ℃.
만약 습
습도표시카드의 수치가
가 23±5 ℃에
에서 60 % 이상이라면, 제품 실장
장 전에
baking
g하여야 함.
8) Device
es must be
e baked forr 1 hour at 65±5 ℃, if baking is
s required.
만약 b
baking이 필요하다면,
필
5±5 ℃에서 1시간 정도
도 baking 되
되어야 함.
제품은 65
LEDs are sensitive to the static electricity and
a
surge. It is recoommended to
9) The L
d or anti-electrostatic glove whe
en handling
g the LEDss.
use a wrist band
LED는
는 정전기 및 서지에 민감한
민
제품
품이므로, LE
ED 제품을 다룰 시에는
는 정전기
방지장
장갑이나 손목밴드를 사용하기를
사
권장함.
ding the ab
bsolute ma
aximum ratiing is appliied to LED
Ds, it may cause
c
If voltage exceed
ge or even
n destructio
on to LED devices.
damag
만약 절
절대 허용치
치를 초과하
하는 전압이 LED에 가해
해지면, LED
D 소자는 파
파괴되거나
손상될
될 수 있음.
aged LEDs may show
w some unu
usual chara
acteristics such
s
as inccrease in leak
Dama
nt, lowered turn-on vo
oltage, or a
abnormal lig
ghting of LEDs
L
at low
w current.
curren
손상된
된 제품은 누설전류의
누
증가, Turn on 전압의
의 저하, 저 전류에서의
의 점등불량 등의
이상 거
거동을 보일
일 수 있음.
10) VOCs (volatile organic compounds) may be oc
ccurred by adhesives,, flux, hard
dener or
organ
nic additive
es which is
s used in lu
uminaires (fixture)
(
and LED siliccone bags are
perm
meable to itt. It may le
ead a disco
oloration wh
hen LED expose
e
to hheat or ligh
ht.
VOC
Cs (휘발성 유기 화합물
물) 는 등기 구에 사용되
되는 접착제
제, Flux, 경화
화제,
유기물
물 첨가제에
에서 발생하
하여 LED 실
실리콘 봉지제
제를 투과하
하고,
때 변색이 발생 할 수 있음.
빛 또
또는 열에 노출되었을
노
This phenomen
non can giv
ve a signifi cant loss of
o light emitted (outpuut) from the
e
lumin
naires (fixtu
ures).
이러한
한 현상은 등기구로부터 나오는 빛의 중대한
한 손실을 줄 수 있음
음.
In orrder to prevvent these problems, we recom
mmend you to know thhe physical
prope
erties for th
he materials used in luminaires, It requires to selectt carefully.
이러한
한 문제 발생 방지를 위해서, 등 기구에 사용
용되는 자재
재에 대한 물
물성을 알고
주의하
하여 선택 되어야함.
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Revision His
story
Date
Revision
R
H
History
2013.02.25
2015.09.07
Author
Draw
wn
Ap
pproved
Initial Ed ition
H.J Paark
Y.T
Y Kim
Revise
e of Lumino
ous Flux bin
S.Y Hoong
J..G Son
Comp
pany In
nformation
US Sa
amsung Sem
miconductorr Inc.,
3655 N. First Street, San Jose CA
A 95134, USA
A
TEL. +1
1-408-544-400
00
Europe
e
Samsun
ng Electronics
s Germany Gm
mbH, Samsun
ng House,
Am Kro
onberger Hang
g 6, Schwalbaach/Ts,German
ny
TEL. +4
49-6196-66-0
0
Japan
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All rights re
eserved
Samsung
g Electron
nics
Samsun
ng Japan Corporation SLED
D Team 10F, Shinagawa
Grand Central
C
Towerr 2-16-4, Kouunan, Minato-ku, Tokyo
108-824
40, Japan
TEL. +8
81-3-6369-63
327
95, Samsun
ng 2-ro, Giheung-Gu,,
Yongin-Cityy, Gyeonggi--Do 446-711
1 Korea
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w.samsung
g.com/sec/b
business/#
#
China (Tianjin Offfice in Chin
na)
Tianjin Samsung LED
D Co., LTD.
Weisi (6
6th) Rd., Micrro-Electronics Industrial Pa
ark, Xiqing
District, Tianjin 30038
85, China
TEL. +8
86-755-8608-5
5550
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ung.com
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