TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com SAW Filter 2595 MHz MODEL NO.:TA1391A REV. NO.:1 A. MAXIMUM RATING: 1. Input Power Level: 10 dBm 2. DC Voltage : 3V RoHS Compliant Lead free Lead-free soldering 3. Operating Temperature: -30°C to +85°C 4. Storage Temperature: -40°C to +95°C B. ELECTRICAL CHARACTERISTICS: Item Electrostatic Sensitive Device (ESD) Unit Center Frequency Fc MHz Min. - Insertion Loss (2570~2620 MHz) IL dB - 2.8 3.8 - dB - 1.1 1.8 - - 1.6 2 - Amplitude Ripple (2570~2620 MHz) VSWR (2570~2620 MHz) Typ. 2595 Max. - Note - Attenuation (Reference level from 0 dB) DC ~ 200 MHz dB 40 52 - - 200 ~ 2485 MHz dB 35 39 - - 2485 ~ 2510 MHz dB 20 31 - - 2680 ~ 2705 MHz dB 20 55 - - 2705 ~ 3000 MHz dB 35 55 - - 3000 ~ 4900 MHz dB 20 35 - - 4900 ~ 6000 MHz dB 10 14 - - ppm/℃ - -36 - - Temperature Coefficient of Frequency TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 C.OUTLINE DRAWING: △ B □ 3 2 : Input 5 : Output 1,3,4,6 : Ground Unit : mm △ : Year Code (2009->9, 2010->0,…, 2018->8) □ : Date Code (W01->A,W02->B,…W27->a,…,W52->z) D. MEASUREMENT CIRCUIT: HP Network analyzer 50Ω 2 SAW Filter 5 50Ω 1,3,4,6 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 E. PCB Footprint: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 F. Frequency Characteristics : TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Reflection Functions : S11 S22 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 G. PACKING: 1. REEL DIMENSION (Reel Count : 7”=1000 ; 13”=3000 ) 2.TAPE DIMENSION B 3 △ TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7 H. RECOMMENDED REFLOW PROFILE : 1. 2. 3. 4. Preheating shall be fixed at 150~180℃ for 60~90 seconds. Ascending time to preheating temperature 150℃ shall be 30 seconds min. Heating shall be fixed at 220℃ for 50~80 seconds and at 245~260℃ peak (min. 10sec). Time : 2 times. TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 8