TX0430A _Rev.1.0_.pdf

TAI-SAW TECHNOLOGY CO., LTD.
TCXO 3.2x2.5mm 50.00MHz
MODEL NO.: TX0430A
REV. NO.: 1
Revise:
Rev.
Rev. Page
Rev. Account
Date
1
N/A
Initial release
04/26/12’ N/A
TAI-SAW TECHNOLOGY CO., LTD.
Ref. No.
Revised by
JieAn Huang
TST DCC
Release document
2
TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected]
Web: www.taisaw.com
TCXO 3.2x2.5mm 50.000MHz
MODEL NO.: TX0430A
REV. NO.: 1
Features:
Good Frequency Stability
RoHS Compliant
Lead free
Lead-free soldering
Ultra Miniature SMD Package
Good Phase Noise Response
Description and Applications:
Surface mount 3.2x2.5 mm TCXO for use in wireless communications devices
Electrical Specifications:
TX0430A
Specifications
Nominal Frequency, Fo
50.000000 MHz
Storage Temperature Range
-40°C to +85°C
Operating Temperature Range
-30°C to +80°C
Power Supply Voltage, Vcc
3.0V +/- 5%
Output Voltage with Load 10pF//10KΩ, Vout
0.8 Vp-p min
Output Waveform
Clipped Sinewave
Power Supply Current, Icc
2.0 mA max
Frequency Tolerance as receive (Vcon=1.5V)
+/- 1.0 ppm max @ 25°C +/- 2°C
Frequency Stability
a. Vs. Temperature (-30~80°C)
b. Vs. Load varied 10pF//10KΩ+/-10%
c. Vs. Supply Voltage varied 3.0V+/-5%
+/- 2.5 ppm reference to 25°C
+/- 0.3 ppm
+/- 0.3 ppm
Start Up Time (90% of final RF level in Vp-p)
2.0 msec max.
Aging
+/-1.0 ppm/year @25°C
SSB Phase Noise (@1KHz Carrier Offset)
-130 dBc/Hz max
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
3
Dimensions (mm):
Marking:
Line 1: Customer Frequency (50.00)
Line 2: TST Logo + Crystal Product Code + Date Code +Traceability code
Crystal Product Code Table
Year
Code
2009
2013
2017
X
2010
2014
2018
x
2011
2015
2019
X
TAI-SAW TECHNOLOGY CO., LTD.
2012
2016
2020
x
TST DCC
Release document
4
Date Code Table
week
wk1
wk2
wk3
wk4
wk5
wk6
wk7
wk8
wk9
code
01
02
03
04
05
06
07
08
09
wk10 wk11 wk12 wk13 wk14
10
11
12
13
14
week wk15 wk16 wk17 wk18 wk19 wk20 wk21 wk22 wk23 wk24 wk25 wk26 wk27 wk28
code
15
16
17
18
19
20
21
22
23
24
25
26
27
28
week wk29 wk30 wk31 wk32 wk33 wk34 wk35 wk36 wk37 wk38 wk39 wk40 wk41 wk42
code
29
30
31
32
33
34
35
36
37
38
39
40
41
42
week wk43 wk44 wk45 wk46 wk47 wk48 wk49 wk50 wk51 wk52 wk53
code
43
44
45
46
47
48
49
50
51
52
53
Traceability date code
Month
code
Month
code
Jan
A
July
G
Feb
B
Aug
H
Mar
C
Sep
J
Apr
D
Oct
K
May
E
Nov
L
Jun
F
Dec
M
Recommended Circuit
Packing (mm):
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
5
1. Reel Dimension
A
Dimensions 180
Tolerance
B
C
D
E
F
H
G
T2 T1 T3
60 13.0 2.0
9.1
2.9
3.9
4.9 11.4 9.0
1.2
±1.0 +1.0 ±0.2 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±1.0 ±0.3 ±0.1
2. Tape Dimension
Unit: mm
A0 B0
W
F
Dimension
2.80 3.71
8.00
3.5
Tolerance
±0.1 ±0.1 +0.3/-0.1
±0.05
E
P0 P1
P2
D1
D
K0
t
1.75 4.00 4.00
2
1.50
1.0
1.75
0.25
±0.1 ±0.1 ±0.1
±0.05
+0.1/-0.00 +0.25/-0.00 ±0.1
±0.02
Packing Quantity/Packing:
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
6
Reflow Profile:
300
Reflow Area
Rising Area
Temperature (deg C)
250
Preheat Area
Forced Cooling Area
200
150
100
Max peak temperature: 260 deg C
50
0
0
60
120
180
240
300
360
Time (seconds)
Notes of the Usage:
1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the
solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec.
2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering
terminals, also make some cracks on the soldering termination. Some cracks will cause
open or short circuit and cause of thermal increasing or smoking. Don’t make any excess
mechanical stress to soldering points.
3. In case of giving a heavy shock to the products, it may make an open or short circuit and
cause of thermal increasing and smoking. To avoid heavy shock impact applying to
products is strictly required.
Notes of the Storage:
1. To keep products under the condition at the room temperature (-5~35 deg C) with normal
humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of
characteristics and a short circuit.
2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas
will make a cause of the open or short circuit. Keep it in the clean place where is not in
dusty and no corrosive gas.
3. Use the unti-static material to the storage package.
4. Don’t put any excess weight to the TCXO in the storage process.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
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5. Don’t move the product from the cold place to the hot place in the short time, otherwise it
may make some dew-drop, then a short circuit may happen in case.
6. Storage periods should be maximum 6 months under condition of above item 1 after
delivery from TST factory.
7. Once open the bag, there is possibility of electrical characteristics deterioration due to
absorption of moisture. So, please use parts within 7 days after opening the bag.
8. If you have to keep parts without using after opening the bag, please put the drying agent
in the bag, fold the bag and keep it in the place where temperature and humidity are
controlled (nitrogen atmosphere box etc.)
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
8