TZ1698A _Rev.1.0_.pdf

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TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 2.0x1.6 40.0MHz
MODEL NO.: TZ1698A
REV. NO.: 1
Revise:
Rev.
Rev. Page
Rev. Account
Date
1
N/A
Initial release
6/19/09’ N/A
TAI-SAW TECHNOLOGY CO., LTD.
Ref. No.
Revised by
Kelly Huang
TST DCC
Release document
3/7
TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 2.0x1.6 40.0MHz
MODEL NO.: TZ1698A
REV. NO.: 1
Features:
RoHS Compliant
Lead free
Lead-free soldering
Surface Mount Hermetic Package
Excellent Reliability Performance
Good Frequency Perturbation and Stability over temperature
Ultra Miniature Package
Description and Applications:
Surface mount 2.0mmx1.6mm crystal unit for use in wireless communications devices,
especially for a need of ultra miniature package for mobility.
Electrical Specifications:
TZ1698A
Specification
Nominal Frequency
40.000000 MHz
Mode of Oscillation
Fundamental
Storage Temperature Range
-40°C to +85°C
Operating Temperature Range
-20°C to +85°C
Frequency Stability over Operating
Temperature Range
+/-15 ppm (referred to the value at 25°C)
Frequency Make Tolerance (FL)
+/-10 ppm @ 25°C +/- 3°C
Equivalent Series Resistance (ESR)
50 Ω max
Nominal Drive Level
100 uW , 300uW max.
Shunt Capacitance (Co)
7.0 pF max
Load Capacitance (CL)
12 pF
Insulation Resistance
500 MΩ min./DC 100V
Aging
+/-1ppm/year
Marking
Laser Marking
Unit Weight
5.7mg+/-0.5mg
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
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Mechanical Dimensions (mm):
Recommended Land Pattern: (unit: mm)
Marking:
Line 1: XX; Frequency (40)
Line 2: T; Traceable Code + D; date Code of Year/Month
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Date Code Table: Year/Month
Year/Month
1
2
3
4
5
6
7
8
9
10
11
12
2009
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2010
A
B
C
D
E
F
G
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J
K
L
M
2011
N
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T
U
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X
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2012
a
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2013
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2014
A
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C
D
E
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2015
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2016
a
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2017
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2018
A
B
C
D
E
F
G
H
J
K
L
M
2019
N
P
Q
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S
T
U
V
W
X
Y
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2020
a
b
c
d
e
f
g
h
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j
k
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2021
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Reel Dimensions (mm):
Tape Dimensions (mm):
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
6/7
[NOTE]:
1. Unless otherwise specified tolerance on dimension +/-0.1 mm.
2. Material: conductive polystyrene with color black.
3. 10 pitch cumulative tolerance +/-0.2 mm.
Packing Quantity/Packing:
3K pcs maximum per reel
Reflow Profile:
Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
2. Temperature: 217+/-5 deg C; Time: 90~100 sec
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
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Reliability Specifications
Test name
Reference
standard
Test process / method
Mechanical characteristics
resistance to
Soldering heat
(IR reflow)
Temp./ Duration : 260°C /10sec ×2 times
Total time : 4min.(IR-reflow)
Vibration
Total peak amplitude : 1.5mm
Vibration frequency
: 10 to 55 Hz
Sweep period
: 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration
: 2 hr / direc.
directions : 3 impacts per axis
Acceleration : 3000g's, +20/-0 %
Duration
: 0.3 ms (total 18 shocks)
Waveform : Half-sine
Solder Temperature:265±5°C
Duration time: 5±0.5 seconds.
Mechanical
Shock
Solderability
EIAJED-4701
-300(301)M(II)
MIL-STD 202F
method 201A
MIL-STD 202F
method 213C
MIL-STD 883G
method 2003
Environmental characteristics
Thermal Shock
Humidity test
Dry heat
( Aging test )
PCT test
Heat cycle conditions
-55 ℃ (30min) ←→
* cycle time : 10 times
125 ℃ (30min)
Temperature : 70 ± 2 °C
Relative humidity : 90~95%
Duration
: 96 hours
Temperature : 125 ± 2 °C
Duration
: 168 hours
2
MIL-STD 883G
method 1010.7
MIL-STD 202F
method 103B
5
Pressure: 2.06kg/cm (2.03*10 pa)
Temperature : 121 ± 2 °C
Relative humidity : 100%
Duration
: 24 hours
TAI-SAW TECHNOLOGY CO., LTD.
MIL-STD 883G
method 1008.2
condition C
EIAJED-4701-3
B-123A
TST DCC
Release document