[ /Title (CDP1 802A, CDP18 02AC, CDP18 02BC) /Subject (CMO S 8Bit Microprocessors) /Autho r () /Keywords (Intersil Corporation, 8-bit microprocessors, 8 bit microprocessors, peripherals) /Creator () /DOCI NFO pdfmark CDP1802A, CDP1802AC, CDP1802BC CMOS 8-Bit Microprocessors March 1997 Features Description • Maximum Input Clock Maximum Frequency Options At VDD = 5V - CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . 3.2MHz - CDP1802BC. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0MHz • Maximum Input Clock Maximum Frequency Options At VDD = 10V - CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . 6.4MHz • Minimum Instruction Fetch-Execute Times At VDD = 5V - CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0µs - CDP1802BC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2µs The CDP1802 family of CMOS microprocessors are 8-bit register oriented central processing units (CPUs) designed for use as general purpose computing or control elements in a wide range of stored program systems or products. • Any Combination of Standard RAM and ROM Up to 65,536 Bytes • 8-Bit Parallel Organization With Bidirectional Data Bus and Multiplexed Address Bus • 16 x 16 Matrix of Registers for Use as Multiple Program Counters, Data Pointers, or Data Registers The CDP1802 types include all of the circuits required for fetching, interpreting, and executing instructions which have been stored in standard types of memories. Extensive input/output (I/O) control features are also provided to facilitate system design. The 1800 series architecture is designed with emphasis on the total microcomputer system as an integral entity so that systems having maximum flexibility and minimum cost can be realized. The 1800 series CPU also provides a synchronous interface to memories and external controllers for I/O devices, and minimizes the cost of interface controllers. Further, the I/O interface is capable of supporting devices operating in polled, interrupt driven, or direct memory access modes. The CDP1802A and CDP1802AC have a maximum input clock frequency of 3.2MHz at VDD = 5V. The CDP1802A and CDP1802AC are functionally identical. They differ in that the CDP1802A has a recommended operating voltage range of 4V to 10.5V, and the CDP1802AC a recommended operating voltage range of 4V to 6.5V. • On-Chip DMA, Interrupt, and Flag Inputs • Programmable Single-Bit Output Port • 91 Easy-to-Use Instructions The CDP1802BC is a higher speed version of the CDP1802AC, having a maximum input clock frequency of 5.0MHz at VDD = 5V, and a recommended operating voltage range of 4V to 6.5V. Ordering Information PART NUMBER 5V - 3.2MHz CDP1802ACE 5V - 5MHz CDP1802BCE CDP1802ACEX CDP1802BCEX CDP1802ACQ CDP1802BCQ CDP1802ACD CDP1802ACDX - TEMPERATURE RANGE -40oC to +85oC PACKAGE PDIP Burn-In PKG. NO. E40.6 E40.6 -40oC to +85oC PLCC N44.65 -40oC SBDIP D40.6 to +85oC CDP1802BCDX Burn-In CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 3-3 D40.6 File Number 1305.2 CDP1802A, CDP1802AC, CDP1802BC Pinouts 36 INTERRUPT SC0 6 35 MWR MRD 7 34 TPA BUS 7 8 33 TPB BUS 6 9 32 MA7 BUS 5 10 31 MA6 BUS 4 11 6 5 4 INTERRUPT 5 DMA-OUT 37 DMA OUT SC1 DMA-IN 38 DMA IN 4 3 2 1 44 43 42 41 40 XTAL 3 Q VDD CLEAR NC 39 XTAL WAIT 40 VDD 2 CLOCK 1 WAIT CLEAR CLOCK Q 44 LEAD PLCC (PACKAGE TYPE Q) TOP VIEW SC1 40 LEAD PDIP (PACKAGE SUFFIX E) 40 LEAD SBDIP (PACKAGE SUFFIX D) TOP VIEW SC0 7 39 MWR MRD 8 38 TPA BUS 7 9 37 TPB BUS 6 10 36 MA7 30 MA5 BUS 5 11 35 MA6 BUS 3 12 29 MA4 NC 12 34 NC BUS 2 13 28 MA3 BUS 4 13 33 MA5 BUS 1 14 27 MA2 BUS 3 14 32 MA4 BUS 0 15 26 MA1 BUS 2 15 31 MA3 BUS 1 16 30 MA2 BUS 0 17 29 MA1 25 MA0 MA0 EF1 EF2 EF3 21 EF4 NC 22 EF3 EF4 N0 19 VSS 20 18 19 20 21 22 23 24 25 26 27 28 VSS 23 EF2 N0 N1 18 N1 24 EF1 VCC N2 17 N2 VCC 16 ADDRESS BUS CDP1852 INPUT PORT CS2 CS1 N0 MA0-7 MRD CDP1802 8-BIT CPU MA0-7 MRD CDP1833 1K-ROM MWR DATA N1 CS1 CDP1852 CS2 OUTPUT PORT CLOCK TPA TPB DATA MRD CDP1824 32 BYTE RAM MWR CEO TPA DATA FIGURE 1. TYPICAL CDP1802 SMALL MICROPROCESSOR SYSTEM 3-4 MA0-4 CS CDP1802A, CDP1802AC, CDP1802BC Block Diagram I/O REQUESTS MEMORY ADDRESS LINES I/O FLAGS DMA OUT MA6 MA4 MA2 MA0 EF1 EF3 EF2 EF4 MA7 MA5 MA3 MA1 MUX DMA IN INT CONTROL CLEAR WAIT CLOCK LOGIC CLOCK XTAL SCO SCI Q LOGIC TPA TPB MWR MRD CONTROL AND TIMING LOGIC TO INSTRUCTION DECODE STATE CODES SYSTEM TIMING A B ALU DF D INCR/ DECR REGISTER R(0).1 R(0).0 ARRAY R(1).1 R(1).0 R R(2).1 R(2).0 R(9).1 R(9).0 R(A).1 R(A).0 LATCH AND DECODE R(E).1 R(E).0 R(F).1 R(F).0 N0 X T P I N N1 N2 BUS 0 BUS 1 8-BIT BIDIRECTIONAL DATA BUS BUS 2 BUS 3 BUS 4 BUS 5 BUS 6 BUS 7 FIGURE 2. 3-5 I/O COMMANDS CDP1802A, CDP1802AC, CDP1802BC Absolute Maximum Ratings Thermal Information DC Supply Voltage Range, (VDD) (All Voltages Referenced to VSS Terminal) CDP1802A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +11V CDP1802AC, CDP1802BC . . . . . . . . . . . . . . . . . . . . -0.5V to +7V Input Voltage Range, All Inputs . . . . . . . . . . . . . .-0.5V to VDD +0.5V DC Input Current, any One Input . . . . . . . . . . . . . . . . . . . . . . . . .±10mA Thermal Resistance (Typical, Note 4) θJA (oC/W) θJC (oC/W) PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . 50 N/A PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . 46 N/A SBDIP . . . . . . . . . . . . . . . . . . . . . . . . . 55 15 Device Dissipation Per Output Transistor TA = Full Package Temperature Range . . . . . . . . . . . . . . . 100mW Operating Temperature Range (TA) Package Type D . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC Package Type E and Q . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC Storage Temperature Range (TSTG) . . . . . . . . . . . . -65oC to +150oC Lead Temperature (During Soldering) At distance 1/16 ±1/32 In. (1.59 ± 0.79mm) from case for 10s max . . . . . . . . . . . . . . . . . . . . . . . . . . . +265oC Lead Tips Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Recommended Operating Conditions TA = -40oC to +85oC. For maximum reliability, operating conditions should be selected so that operation is always within the following ranges: TEST CONDITIONS CDP1802A CDP1802AC CDP1802BC (NOTE 2) VCC (V) VDD (V) MIN MAX MIN MAX MIN MAX UNITS DC Operating Voltage Range - - 4 10.5 4 6.5 4 6.5 V Input Voltage Range - - VSS VDD VSS VDD VSS VDD V 4 to 6.5 4 to 6.5 - - - 1 - 1 µs 4 to 10.5 4 to 10.5 - 1 - - - - µs 5 5 5 - 5 - 3.2 - µs 5 10 4 - - - - - µs 10 10 2.5 - - - - - µs 5 5 - 400 - 400 - 667 KBytes/s 5 10 - 500 - - - - 10 10 - 800 - - - - 5 5 DC 3.2 DC 3.2 DC 5 MHz 5 10 DC 4 - - - - MHz 10 10 DC 6.4 - - - - MHz PARAMETER Maximum Clock Input Rise or Fall Time Minimum Instruction Time (Note 3) Maximum DMA Transfer Rate Maximum Clock Input Frequency, fCL, Load Capacitance (CL) = 50pF NOTES: 1. Printed circuit board mount: 57mm x 57mm minimum area x 1.6mm thick G10 epoxy glass, or equivalent. 2. VCC must never exceed VDD. 3. Equals 2 machine cycles - one Fetch and one Execute operation for all instructions except Long Branch and Long Skip, which require 3 machine cycles - one Fetch and two Execute operations. 4. θJA is measured with component mounted on an evaluation board in free air. 3-6 CDP1802A, CDP1802AC, CDP1802BC Static Electrical Specifications at TA = -40oC to +85oC, Except as Noted TEST CONDITIONS CDP1802AC, CDP1802BC CDP1802A SYMBOL VOUT (V) VIN (V) VCC, VDD (V) MIN (NOTE 1) TYP MAX MIN (NOTE 1) TYP MAX UNITS IDD - - 5 - 0.1 50 - 1 200 µA - - 10 - 1 200 - - - µA 0.4 0, 5 5 1.1 2.2 - 1.1 2.2 - mA (Except XTAL) 0.5 0, 10 10 2.2 4.4 - - - - mA XTAL 0.4 5 5 170 350 - 170 350 - µA 4.6 0, 5 5 -0.27 -0.55 - -0.27 -0.55 - mA (Except XTAL) 9.5 0, 10 10 -0.55 -1.1 - - - - mA XTAL 4.6 0 5 -125 -250 - -125 -250 - µA - 0, 5 5 - 0 0.1 - 0 0.1 V - 0, 10 10 - 0 0.1 - - - V - 0, 5 5 4.9 5 - 4.9 5 - V PARAMETER Quiescent Device Current Output Low Drive (Sink) Current IOL Output High Drive (Source) Current IOH Output Voltage Low Level VOL Output Voltage High Level VOH - 0, 10 10 9.9 10 - - - - V Input Low Voltage VIL 0.5, 4.5 - 5 - - 1.5 - - 1.5 V 0.5, 4.5 - 5, 10 - - 1 - - - V 1, 9 - 10 - - 3 - - - V 0.5, 4.5 - 5 3.5 - - 3.5 - - V 0.5, 4.5 - 5, 10 4 - - - - - V 1, 9 - 10 7 - - - - - V - - 5 0.4 0.5 - 0.4 0.5 - V - - 5, 10 0.3 0.4 - - - - V - - 10 1.5 2 - - - - V Any Input 0, 5 5 - ±10-4 ±1 - ±10-4 ±1 µA 0, 10 10 - ±10-4 ±1 - - - µA 0, 5 0, 5 5 - ±10-4 ±1 - ±10-4 ±1 µA 0, 10 0, 10 10 - ±10-4 ±1 - - - µA - - 5 - 2 4 - 2 4 mA - - 5 - - - - 3 6 mA Input High Voltage CLEAR Input Voltage VIH VH Schmitt Hysteresis Input Leakage Current Three-State Output Leakage IIN IOUT Current Operating Current CDP1802A, AC at f = 3.2MHz IDDI (Note 2) CDP1802BC at f = 5.0MHz Minimum Data Retention Voltage VDR VDD = VDR - 2 2.4 - 2 2.4 V Data Retention Current IDR VDD = 2.4V - 0.05 - - 0.5 - µA 3-7 CDP1802A, CDP1802AC, CDP1802BC Static Electrical Specifications at TA = -40oC to +85oC, Except as Noted (Continued) TEST CONDITIONS PARAMETER Input Capacitance Output Capacitance VCC, VDD (V) MIN (NOTE 1) TYP MAX MIN (NOTE 1) TYP MAX UNITS CIN - 5 7.5 - 5 7.5 pF COUT - 10 15 - 10 15 pF SYMBOL VOUT (V) VIN (V) CDP1802AC, CDP1802BC CDP1802A NOTES: 1. Typical values are for TA = +25oC and nominal VDD. 2. Idle “00” at M(0000), CL = 50pF. Dynamic Electrical Specifications TA = -40oC to +85oC, CL = 50pF, VDD ±5%, Except as Noted TEST CONDITIONS PARAMETER CDP1802A, CDP1802AC CDP1802BC SYMBOL VCC (V) VDD (V) (NOTE 1) TYP MAX (NOTE 1) TYP MAX UNITS tPLH, tPHL 5 5 200 300 200 300 ns 5 10 150 250 - - ns 10 10 100 150 - - ns 5 5 600 850 475 525 ns 5 10 400 600 - - ns 10 10 300 400 - - ns 5 5 250 350 175 250 ns 5 10 150 250 - - ns 10 10 100 150 - - ns 5 5 200 300 175 275 ns 5 10 150 250 - - ns 10 10 100 150 - - ns 5 5 200 350 175 275 ns 5 10 150 290 - - ns 10 10 100 175 - - ns 5 5 200 300 175 225 ns 5 10 150 250 - - ns 10 10 100 150 - - ns 5 5 300 450 250 375 ns 5 10 250 350 - - ns 10 10 100 200 - - ns PROPAGATION DELAY TIMES Clock to TPA, TPB Clock-to-Memory High-Address Byte Clock-to-Memory Low-Address Byte Valid Clock to MRD Clock to MRD Clock to MWR Clock to (CPU DATA to BUS) Valid tPLH, tPHL tPLH, tPHL tPHL tPLH tPLH, tPHL tPLH, tPHL 3-8 CDP1802A, CDP1802AC, CDP1802BC Dynamic Electrical Specifications TA = -40oC to +85oC, CL = 50pF, VDD ±5%, Except as Noted (Continued) TEST CONDITIONS PARAMETER Clock to State Code Clock to Q Clock to N (0 - 2) CDP1802A, CDP1802AC CDP1802BC SYMBOL VCC (V) VDD (V) (NOTE 1) TYP MAX (NOTE 1) TYP MAX UNITS tPLH, tPHL 5 5 300 450 250 400 ns 5 10 250 350 - - ns 10 10 150 250 - - ns 5 5 250 400 200 300 ns 5 10 150 250 - - ns 10 10 100 150 - - ns 5 5 300 550 275 350 ns 5 10 200 350 - - ns 10 10 150 250 - - ns 5 5 -20 25 -20 0 ns 5 10 0 50 - - ns 10 10 -10 40 - - ns 5 5 150 200 125 150 ns 5 10 100 125 - - ns 10 10 75 100 - - ns 5 5 0 30 0 30 ns 5 10 0 20 - - ns 10 10 0 10 - - ns 5 5 150 250 100 150 ns 5 10 100 200 - - ns 10 10 75 125 - - ns 5 5 -75 0 -75 0 ns 5 10 -50 0 - - ns 10 10 -25 0 - - ns 5 5 100 150 75 125 ns 5 10 75 100 - - ns 10 10 50 75 - - ns 5 5 10 50 20 40 ns 5 10 -10 15 - - ns 10 10 0 25 - - ns tPLH, tPHL tPLH, tPHL MINIMUM SET UP AND HOLD TIMES Data Bus Input Set Up Data Bus Input Hold DMA Set Up DMA Hold Interrupt Set Up Interrupt Hold WAIT Set Up tSU tH (Note 2) tSU tH (Note 2) tSU tH (Note 2) tSU 3-9 CDP1802A, CDP1802AC, CDP1802BC Dynamic Electrical Specifications TA = -40oC to +85oC, CL = 50pF, VDD ±5%, Except as Noted (Continued) TEST CONDITIONS PARAMETER CDP1802BC SYMBOL VCC (V) VDD (V) (NOTE 1) TYP MAX (NOTE 1) TYP MAX UNITS tSU 5 5 -30 20 -30 0 ns 5 10 -20 30 - - ns 10 10 -10 40 - - ns 5 5 150 200 100 150 ns 5 10 100 150 - - ns 10 10 75 100 - - ns 5 5 150 300 100 150 ns 5 10 100 200 - - ns 10 10 75 150 - - ns 5 5 125 150 90 100 ns 5 10 100 125 - - ns 10 10 60 75 - - ns EF1-4 Set Up EF1-4 Hold CDP1802A, CDP1802AC tH (Note 2) Minimum Pulse Width Times CLEAR Pulse Width tWL (Note 2) CLOCK Pulse Width tWL NOTES: 1. Typical values are for TA = +25oC and nominal VDD. 2. Maximum limits of minimum characteristics are the values above which all devices function. Timing Specifications as a function of T(T = 1/fCLOCK) at TA = -40 to +85oC, Except as Noted TEST CONDITIONS CDP1802A, CDP1802AC CDP1802BC PARAMETERS SYMBOL VCC (V) VDD (V) MIN (NOTE 1) TYP MIN (NOTE 1) TYP UNITS High-Order Memory-Address Byte Set Up to TPA Time tSU 5 5 2T-550 2T-400 2T-325 2T-275 ns 5 10 2T-350 2T250 - - ns 10 10 2T-250 2T-200 - - ns 5 5 t/2-25 T/2-15 T/2-25 T/2-15 ns 5 10 T/2-35 T/2-25 - - ns 10 10 T/2-10 T/2-+0 - - ns 5 5 T-30 T+0 T-30 T+0 ns 5 10 T-20 T+0 - - ns 10 10 T-10 T+0 - - ns 5 5 T-200 T-150 T-175 T-125 ns 5 10 T-150 T-100 - - ns 10 10 T-100 T-50 - - ns High-Order Memory-Address Byte Hold After TPA Time Low-Order Memory-Address Byte Hold After WR Time CPU Data to Bus Hold After WR Time tH tH tH 3-10 CDP1802A, CDP1802AC, CDP1802BC Timing Specifications as a function of T(T = 1/fCLOCK) at TA = -40 to +85oC, Except as Noted TEST CONDITIONS PARAMETERS Required Memory Access Time Address to Data MRD to TPA CDP1802A, CDP1802AC CDP1802BC SYMBOL VCC (V) VDD (V) MIN (NOTE 1) TYP MIN (NOTE 1) TYP UNITS tACC 5 5 5T-375 5T-250 5T-225 5T-175 ns 5 10 5T-250 5T-150 - - ns 10 10 5T-190 5T-100 - - ns 5 5 T/2-25 T/2-18 T/2-20 T/2-15 ns 5 10 T/2-20 T/2-15 - - ns 10 10 T/2-15 T/2-10 - - ns tSU NOTE: 1. Typical values are for TA = +25oC and nominal VDD. Timing Waveforms FETCH (READ) CLOCK ADDRESS EXECUTE (WRITE) 00 01 10 11 20 21 30 31 40 41 50 51 60 61 70 71 00 01 10 11 20 21 30 31 40 41 50 51 60 61 70 71 00 HI BYTE LOW BYTE HI BYTE LOW BYTE TPA TPB MRD MWR DATA VALID OUTPUT DATA VALID INPUT DATA FIGURE 3. BASIC DC TIMING WAVEFORM, ONE INSTRUCTION CYCLE 3-11 CDP1802A, CDP1802AC, CDP1802BC Timing Waveforms tW CLOCK (Continued) 0 00 1 01 10 2 11 tPLH TPA 3 20 21 30 4 31 40 5 41 50 6 51 60 70 tPLH tSU MRD (MEMORY READ CYCLE) 61 tPLH, tPHL tPHL MWR (MEMORY WRITE CYCLE) tPLH, tPHL tH tSU tPLH tPLH tPHL tPLH tPHL tH tPLH, tPHL tPLH tPLH, tPHL tPHL tPLH, tPHL tPLH tPLH DATA LATCHED IN CPU tH tSU DATA FROM BUS TO CPU DMA SAMPLED (S1, S2, S3) tSU tH tSU tH DMA REQUEST INTERRUPT SAMPLED (S1, S2) INTERRUPT REQUEST EF 1-4 01 tPLH, tPHL LOW ORDER ADDRESS BYTE Q N0, N1, N2 (I/O EXECUTION CYCLE) 00 tPHL DATA FROM CPU TO BUS STATE CODES 71 tH HIGH ORDER ADDRESS BYTE tPLH 0 tPHL TPB MEMORY ADDRESS 7 FLAG LINES SAMPLED (IN S1) tSU tH tSU WAIT ANY NEGATIVE TRANSITION tW CLEAR NOTES: 1. This timing diagram is used to show signal relationships only and does not represent any specific machine cycle. 2. All measurements are referenced to 50% point of the waveforms. 3. Shaded areas indicate “Don’t Care” or undefined state. Multiple transitions may occur during this period. FIGURE 4. TIMING WAVEFORM 3-12 CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms 0 1 2 3 4 5 6 7 (Propagation Delays Not Shown) 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 CLOCK TPA TPB MACHINE CYCLE CYCLE n MA HIGH ADD CYCLE (n + 1) LOW ADDRESS HIGH ADD CYCLE (n + 2) LOW ADDRESS HIGH ADD LOW ADDRESS FIGURE 5. GENERAL TIMING WAVEFORMS INSTRUCTION FETCH (S0) MEMORY READ CYCLE EXECUTE (S1) NON MEMORY CYCLE FETCH (S0) EXECUTE MEMORY READ CYCLE MRD MWR (HIGH) MEMORY OUTPUT ALLOWABLE MEMORY ACCESS VALID OUTPUT “DON’T CARE” OR INTERNAL DELAYS VALID OUTPUT HIGH IMPEDANCE STATE FIGURE 6. NON-MEMORY CYCLE TIMING WAVEFORMS INSTRUCTION FETCH (S0) MEMORY READ CYCLE EXECUTE (S1) FETCH (S0) MEMORY WRITE CYCLE MEMORY READ CYCLE EXECUTE MRD MWR MEMORY OUTPUT ALLOWABLE MEMORY ACCESS CPU OUTPUT TO MEMORY OFF VALID OUTPUT VALID OUTPUT VALID DATA “DON’T CARE” OR INTERNAL DELAYS OFF HIGH IMPEDANCE STATE FIGURE 7. MEMORY WRITE CYCLE TIMING WAVEFORMS 3-13 VALID CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms INSTRUCTION FETCH (S0) MEMORY READ CYCLE (Propagation Delays Not Shown) (Continued) EXECUTE (S1) MEMORY READ CYCLE FETCH (S0) EXECUTE MEMORY READ CYCLE MRD MWR (HIGH) MEMORY OUTPUT ALLOWABLE MEMORY ACCESS VALID OUTPUT “DON’T CARE” OR INTERNAL DELAYS VALID OUTPUT VALID OUTPUT HIGH IMPEDANCE STATE FIGURE 8. MEMORY READ CYCLE TIMING WAVEFORMS INSTRUCTION FETCH (S0) MEMORY READ CYCLE EXECUTE (S1) MEMORY READ CYCLE EXECUTE (S1) FETCH (S0) MEMORY READ CYCLE MRD MWR (HIGH) MEMORY OUTPUT ALLOWABLE MEMORY ACCESS VALID OUTPUT “DON’T CARE” OR INTERNAL DELAYS VALID OUTPUT HIGH IMPEDANCE STATE FIGURE 9. LONG BRANCH OR LONG SKIP CYCLE TIMING WAVEFORMS 3-14 VALID OUTPUT CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms 0 1 2 3 4 (Propagation Delays Not Shown) 5 6 7 0 1 (Continued) 2 3 4 5 6 7 0 CLOCK TPA TPB MACHINE CYCLE INSTRUCTION CYCLE n CYCLE (n + 1) FETCH (S0) EXECUTE (S1) MRD N0 - N2 N=9-F MWR MEMORY OUTPUT VALID OUTPUT ALLOWABLE MEMORY ACCESS DATA BUS (NOTE 1) VALID DATA FROM INPUT DEVICE MEMORY READ CYCLE NOTE 1 USER GENERATED SIGNAL MEMORY WRITE CYCLE HIGH IMPEDANCE STATE “DON’T CARE” OR INTERNAL DELAYS FIGURE 10. INPUT CYCLE TIMING WAVEFORMS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 CLOCK TPA TPB MACHINE CYCLE CYCLE n CYCLE (n + 1) FETCH (S0) EXECUTE (S1) INSTRUCTION MRD N=1-9 ALLOWABLE MEMORY ACCESS N0 - N2 DATA BUS ALLOWABLE MEMORY ACCESS VALID OUTPUT VALID DATA FROM MEMORY DATA STROBE (MRD • TPB • N) (NOTE 1) MEMORY READ CYCLE NOTE 1 USER GENERATED SIGNAL MEMORY READ CYCLE “DON’T CARE” OR INTERNAL DELAYS FIGURE 11. OUTPUT CYCLE TIMING WAVEFORMS 3-15 HIGH IMPEDANCE STATE 0 CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms 0 1 2 3 4 5 6 7 (Propagation Delays Not Shown) 0 1 2 3 4 5 (Continued) 6 7 0 1 2 3 4 5 6 7 CLOCK TPA TPB MACHINE CYCLE CYCLE n INSTRUCTION CYCLE (n+1) FETCH (S0) CYCLE (n+2) EXECUTE (S1) DMA (S2) DMA-IN MRD MWR MEMORY OUTPUT VALID OUTPUT VALID DATA FROM INPUT DEVICE DATA BUS (NOTE 1) MEMORY READ CYCLE MEMORY READ, WRITE OR NON-MEMORY CYCLE NOTE 1 USER GENERATED SIGNAL MEMORY WRITE CYCLE HIGH IMPEDANCE STATE “DON’T CARE” OR INTERNAL DELAYS FIGURE 12. DMA IN CYCLE TIMING WAVEFORMS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 CLOCK TPA TPB MACHINE CYCLE INSTRUCTION CYCLE n CYCLE (n + 1) CYCLE (n + 2) FETCH (S0) EXECUTE (S1) DMA (S2) DMA OUT (NOTE 1) MRD MWR MEMORY OUTPUT DATA STROBE (S2 • TPB) (NOTE 1) VALID OUTPUT MEMORY READ CYCLE NOTE 1 USER GENERATED SIGNAL MEMORY READ, WRITE OR NON-MEMORY CYCLE “DON’T CARE” OR INTERNAL DELAYS FIGURE 13. DMA OUT CYCLE TIMING WAVEFORMS 3-16 VALID DATA FROM MEMORY MEMORY READ CYCLE HIGH IMPEDANCE STATE CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms 0 1 2 3 4 5 6 7 (Propagation Delays Not Shown) 0 1 2 3 4 5 (Continued) 6 7 0 1 2 3 4 5 6 CLOCK TPA TPB MACHINE CYCLE INSTRUCTION CYCLE n CYCLE (n + 1) CYCLE (n + 2) FETCH (S0) EXECUTE (S1) INTERRUPT (S3) MRD MWR INTERRUPT (NOTE 1) (INTERNAL) IE MEMORY OUTPUT MEMORY READ CYCLE VALID OUTPUT MEMORY READ, WRITE OR NON-MEMORY CYCLE NOTE 1 USER GENERATED SIGNAL “DON’T CARE” OR INTERNAL DELAYS NON-MEMORY CYCLE HIGH IMPEDANCE STATE FIGURE 14. INTERRUPT CYCLE TIMING WAVEFORMS Performance Curves 8 8 CL, LOAD CAPACITANCE = 50pF CL, LOAD CAPACITANCE = 50pF 7 VCC = VDD = 10V fCL, SYSTEM MAXIMUM CLOCK FREQUENCY (MHz) fCL, SYSTEM MAXIMUM CLOCK FREQUENCY (MHz) 7 6 5 VCC = 5V, VDD = 10V 4 VCC = VDD = 5V 3 2 1 0 25 35 45 55 65 75 85 95 105 TA, AMBIENT TEMPERATURE (oC) 115 6 5 VCC = VDD = 5V 4 3 2 1 0 125 25 FIGURE 15. CDP1802A, AC TYPICAL MAXIMUM CLOCK FREQUENCY AS A FUNCTION OF TEMPERATURE 35 45 55 65 75 85 95 105 TA, AMBIENT TEMPERATURE (oC) 115 125 FIGURE 16. CDP1802BC TYPICAL MAXIMUM CLOCK FREQUENCY AS A FUNCTION OF TEMPERATURE 3-17 CDP1802A, CDP1802AC, CDP1802BC TA = 25oC -10 VCC = VDD = 5V VDS, DRAIN-TO-SOURCE VOLTAGE (V) -8 -7 -6 -5 -4 -3 -2 -9 350 -1 0 VGS, GATE-TO-VOLTAGE = -5V 1 300 2 250 3 VCC = VDD = 10V 200 -10V 4 tTLH 150 5 VCC = VDD = 5V 100 tTHL 6 50 VCC = VDD = 10V 7 0 0 25 50 TA, AMBIENT TEMPERATURE = -40oC TO +85oC 75 100 125 150 175 200 CL, LOAD CAPACITANCE (pF) IOL, OUTPUT LOW (SINK) CURRENT (mA) FIGURE 17. TYPICAL TRANSITION TIME vs LOAD CAPACITANCE FOR ALL TYPES FIGURE 18. CDP1802A, AC MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS TA = -40oC TO +85oC VDS, DRAIN-TO-SOURCE VOLTAGE (V) -4 -3 -2 -1 -5 30 1 25 VGS, GATE-TO-SOURCE = 10V 20 VGS, GATE-TO-VOLTAGE = -5V 2 15 10 5V 0 1 2 3 4 5 3 6 7 8 9 10 4 VDS, DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 19. CDP1802A, AC MINIMUM OUTPUT LOW (SINK) CURRENT CHARACTERISTICS FIGURE 20. CDP1802BC MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS 150 TA = -40oC TO +85oC ∆tPLH, ∆tPHL, ∆ PROPAGATION DELAY TIME (ns) IOL, OUTPUT LOW (SINK) CURRENT (mA) 0 35 5 IOH, OUTPUT HIGH (SOURCE) CURRENT (mA) tTHL, tTLH, TRANSITION TIME (ns) 400 (Continued) IOH, OUTPUT HIGH (SOURCE) CURRENT (mA) Performance Curves TA = 25oC VCC = VDD = 5V 125 20 100 10 VGS, GATE-TO-SOURCE = 5V 5 75 50 ∆tPLH VCC = VDD = 10V ∆tPHL VCC = VDD = 5V 25 VCC = VDD = 10V 0 0 1 2 3 4 25 5 VDS, DRAIN-TO-SOURCE VOLTAGE (V) 50 100 150 ∆CL, ∆ LOAD CAPACITANCE (pF) 200 NOTE: ANY OUTPUT EXCEPT XTAL FIGURE 21. CDP1802BC MINIMUM OUTPUT LOW (SINK) CURRENT CHARACTERISTICS FIGURE 22. TYPICAL CHANGE IN PROPAGATION DELAY AS A FUNCTION OF A CHANGE IN LOAD CAPACITANCE FOR ALL TYPES 3-18 CDP1802A, CDP1802AC, CDP1802BC Performance Curves (Continued) PD, TYPICAL POWER DISSIPATION FOR CDP1802D (mW) 1000 TA = 25oC VCC = VDD = 10V 100 10 BRANCH IDLE 1 VCC = VDD = 5V 0.1 0.01 0.1 1 fCL, CLOCK INPUT FREQUENCY (MHz) 10 NOTE: IDLE = “00” AT M(0000), BRANCH = “3707” AT M(8107), CL = 50pF FIGURE 23. TYPICAL POWER DISSIPATION AS A FUNCTION OF CLOCK FREQUENCY FOR BRANCH INSTRUCTION AND IDLE INSTRUCTION FOR ALL TYPES Signal Descriptions Bus 0 to Bus 7 (Data Bus) 8-bit bidirectional DATA BUS lines. These lines are used for transferring data between the memory, the microprocessor, and I/O devices. N0 to N2 (I/O Control Lines) Activated by an I/O instruction to signal the I/O control logic of a data transfer between memory and I/O interface. These lines can be used to issue command codes or device selection codes to the I/O devices (independently or combined with the memory byte on the data bus when an I/O instruction is being executed). The N bits are low at all times except when an I/O instruction is being executed. During this time their state is the same as the corresponding bits in the N register. The direction of data flow is defined in the I/O instruction by bit N3 (internally) and is indicated by the level of the MRD signal. MRD = VCC: Data from I/O to CPU and Memory Interrupt Action - X and P are stored in T after executing current instruction; designator X is set to 2; designator P is set to 1; interrupt enable is reset to 0 (inhibit); and instruction execution is resumed. The interrupt action requires one machine cycle (S3). DMA Action - Finish executing current instruction; R(0) points to memory area for data transfer; data is loaded into or read out of memory; and increment R(0). NOTE: In the event of concurrent DMA and Interrupt requests, DMA-lN has priority followed by DMA-OUT and then Interrupt. SC0, SC1, (2 State Code Lines) These outputs indicate that the CPU is: 1) fetching an instruction, or 2) executing an instruction, or 3) processing a DMA request, or 4) acknowledging an interrupt request. The levels of state code are tabulated below. All states are valid at TPA. H = VCC, L = VSS. STATE CODE LINES MRD = VSS: Data from Memory to I/O STATE TYPE EF1 to EF4 (4 Flags) These inputs enable the I/O controllers to transfer status information to the processor. The levels can be tested by the conditional branch instructions. They can be used in conjunction with the INTERRUPT request line to establish interrupt priorities. These flags can also be used by I/O devices to “call the attention” of the processor, in which case the program must routinely test the status of these flag(s). The flag(s) are sampled at the beginning of every S1 cycle. INTERRUPT, DMA-lN, DMA-OUT (3 I/O Requests) These inputs are sampled by the CPU during the interval between the leading edge of TPB and the leading edge of TPA. SC1 SC0 S0 (Fetch) L L S1 (Execute) L H S2 (DMA) H L S3 (Interrupt) H H TPA, TPB (2 Timing Pulses) Positive pulses that occur once in each machine cycle (TPB follows TPA). They are used by I/O controllers to interpret codes and to time interaction with the data bus. The trailing edge of TPA is used by the memory system to latch the higher-order byte of the 16-bit memory address. TPA is suppressed in IDLE when the CPU is in the load mode. 3-19 CDP1802A, CDP1802AC, CDP1802BC MA0 to MA7 (8 Memory Address Lines) Architecture In each cycle, the higher-order byte of a 16-bit CPU memory address appears on the memory address lines MA0-7 first. Those bits required by the memory system can be strobed into external address latches by timing pulse TPA. The low order byte of the 16-bit address appears on the address lines after the termination of TPA. Latching of all 8 higher-order address bits would permit a memory system of 64K bytes. The CPU block diagram is shown in Figure 2. The principal feature of this system is a register array (R) consisting of sixteen 16-bit scratchpad registers. Individual registers in the array (R) are designated (selected) by a 4-bit binary code from one of the 4-bit registers labeled N, P and X. The contents of any register can be directed to any one of the following three paths: MWR (Write Pulse) 1. The external memory (multiplexed, higher-order byte first, on to 8 memory address lines). A negative pulse appearing in a memory-write cycle, after the address lines have stabilized. MRD (Read Level) A low level on MRD indicates a memory read cycle. It can be used to control three-state outputs from the addressed memory which may have a common data input and output bus. If a memory does not have a three-state high-impedance output, MRD is useful for driving memory/bus separator gates. It is also used to indicate the direction of data transfer during an I/O instruction. For additional information see Table 1. Q Single bit output from the CPU which can be set or reset under program control. During SEQ or REQ instruction execution, Q is set or reset between the trailing edge of TPA and the leading edge of TPB. CLOCK Input for externally generated single-phase clock. The clock is counted down internally to 8 clock pulses per machine cycle. XTAL Connection to be used with clock input terminal, for an external crystal, if the on-chip oscillator is utilized. The crystal is connected between terminals 1 and 39 (CLOCK and XTAL) in parallel with a resistance (10MΩ typ). Frequency trimming capacitors may be required at terminals 1 and 39. For additional information, see Application Note AN6565. 2. The D register (either of the two bytes can be gated to D). 3. The increment/decrement circuit where it is increased or decreased by one and stored back in the selected 16-bit register. The three paths, depending on the nature of the instruction, may operate independently or in various combinations in the same machine cycle. With two exceptions, CPU instruction consists of two 8clock-pulse machine cycles. The first cycle is the fetch cycle, and the second - and third if necessary - are execute cycles. During the fetch cycle the four bits in the P designator select one of the 16 registers R(P) as the current program counter. The selected register R(P) contains the address of the memory location from which the instruction is to be fetched. When the instruction is read out from the memory, the higher order 4 bits of the instruction byte are loaded into the register and the lower order 4 bits into the N register. The content of the program counter is automatically incremented by one so that R(P) is now “pointing” to the next byte in the memory. The X designator selects one of the 16 registers R(X) to “point” to the memory for an operand (or data) in certain ALU or I/O operations. The N designator can perform the following five functions depending on the type of instruction fetched: 1. Designate one of the 16 registers in R to be acted upon during register operations. 2. Indicate to the I/O devices a command code or device selection code for peripherals. WAIT, CLEAR (2 Control Lines) Provide four control modes as listed in the following truth table: CLEAR WAIT MODE L L LOAD L H RESET H L PAUSE H H RUN 3. Indicate the specific operation to be executed during the ALU instructions, types of test to be performed during the Branch instruction, or the specific operation required in a class of miscellaneous instructions (70 - 73 and 78 - 7B). 4. Indicate the value to be loaded into P to designate a new register to be used as the program counter R(P). 5. Indicate the value to be loaded into X to designate a new register to be used as data pointer R(X). VDD, VSS, VCC (Power Levels) The internal voltage supply VDD is isolated from the Input/Output voltage supply VCC so that the processor may operate at maximum speed while interfacing with peripheral devices operating at lower voltage. VCC must be less than or equal to VDD. All outputs swing from VSS to VCC. The recommended input voltage swing is VSS to VCC. The registers in R can be assigned by a programmer in three different ways: as program counters, as data pointers, or as scratchpad locations (data registers) to hold two bytes of data. Program Counters Any register can be the main program counter; the address of the selected register is held in the P designator. Other reg- 3-20 CDP1802A, CDP1802AC, CDP1802BC isters in R can be used as subroutine program counters. By single instruction the contents of the P register can be changed to effect a “call” to a subroutine. When interrupts are being serviced, register R(1) is used as the program counter for the user's interrupt servicing routine. After reset, and during a DMA operation, R(0) is used as the program counter. At all other times the register designated as program counter is at the discretion of the user. Interrupt Servicing 2. Output instructions 61 through 67 Register R(1) is always used as the program counter whenever interrupt servicing is initiated. When an interrupt request occurs and the interrupt is allowed by the program (again, nothing takes place until the completion of the current instruction), the contents of the X and P registers are stored in the temporary register T, and X and P are set to new values; hex digit 2 in X and hex digit 1 in P. Interrupt Enable is automatically deactivated to inhibit further interrupts. The user's interrupt routine is now in control; the contents of T may be saved by means of a single instruction (78) in the memory location pointed to by R(X). At the conclusion of the interrupt, the user's routine may restore the pre-interrupted value of X and P with a single instruction (70 or 71). The Interrupt Enable flip-flop can be activated to permit further interrupts or can be disabled to prevent them. 3. Input instructions 69 through 6F CPU Register Summary Data Pointers The registers in R may be used as data pointers to indicate a location in memory. The register designated by X (i.e., R(X)) points to memory for the following instructions (see Table 1). 1. ALU operations F1 - F5, F7, 74, 75, 77 4. Certain miscellaneous instructions - 70 - 73, 78, 60, F0 D 8 Bits Data Register (Accumulator) The register designated by N (i.e., R(N)) points to memory for the “load D from memory” instructions 0N and 4N and the “Store D” instruction 5N. The register designated by P (i.e., the program counter) is used as the data pointer for ALU instructions F8 - FD, FF, 7C, 7D, 7F. During these instruction executions, the operation is referred to as “data immediate”. DF 1-Bit Data Flag (ALU Carry) B 8 Bits Auxiliary Holding Register R 16 Bits 1 of 16 Scratchpad Registers P 4 Bits Designates which register is Program Counter X 4 Bits Designates which register is Data Pointer Another important use of R as a data pointer supports the built-in Direct-Memory-Access (DMA) function. When a DMA-ln or DMA-Out request is received, one machine cycle is “stolen”. This operation occurs at the end of the execute machine cycle in the current instruction. Register R(0) is always used as the data pointer during the DMA operation. The data is read from (DMA-Out) or written into (DMA-ln) the memory location pointed to by the R(0) register. At the end of the transfer, R(0) is incremented by one so that the processor is ready to act upon the next DMA byte transfer request. This feature in the 1800-series architecture saves a substantial amount of logic when fast exchanges of blocks of data are required, such as with magnetic discs or during CRT-display-refresh cycles. N 4 Bits Holds Low-Order Instruction Digit I 4 Bits Holds High-Order Instruction Digit T 8 Bits Holds old X, P after Interrupt (X is high nibble) lE 1-Bit Interrupt Enable Q 1-Bit Output Flip-Flop CDP1802 Control Modes The WAIT and CLEAR lines provide four control modes as listed in the following truth table: CLEAR WAIT MODE L L LOAD L H RESET Data Registers H L PAUSE When registers in R are used to store bytes of data, four instructions are provided which allow D to receive from or write into either the higher-order or lower-order byte portions of the register designated by N. By this mechanism (together with loading by data immediate) program pointer and data pointer designations are initialized. Also, this technique allows scratchpad registers in R to be used to hold general data. By employing increment or decrement instructions, such registers may be used as loop counters. H H RUN The function of the modes are defined as follows: Load Holds the CPU in the IDLE execution state and allows an I/O device to load the memory without the need for a “bootstrap” loader. It modifies the IDLE condition so that DMA-lN operation does not force execution of the next instruction. The Q Flip-Flop Reset An internal flip-flop, Q, can be set or reset by instruction and can be sensed by conditional branch instructions. The output of Q is also available as a microprocessor output. Registers l, N, Q are reset, lE is set and 0’s (VSS) are placed on the data bus. TPA and TPB are suppressed while reset is held and the CPU is placed in S1. The first machine cycle after termination of reset is an initialization cycle which requires 9 clock pulses. During this cycle the CPU remains in S1 and register X, P, and R(0) are reset. Interrupt and DMA servicing are 3-21 CDP1802A, CDP1802AC, CDP1802BC Run-Mode State Transitions suppressed during the initialization cycle. The next cycle is an S0, S1, or an S2 but never an S3. With the use of a 71 instruction followed by 00 at memory locations 0000 and 0001, this feature may be used to reset IE, so as to preclude interrupts until ready for them. Power-up reset can be realized by connecting an RC network directly to the CLEAR pin, since it has a Schmitt triggered input, see Figure 24. The CPU state transitions when in the RUN and RESET modes are shown in Figure 25. Each machine cycle requires the same period of time, 8 clock pulses, except the initialization cycle, which requires 9 clock pulses. The execution of an instruction requires either two or three machine cycles, S0 followed by a single S1 cycle or two S1 cycles. S2 is the response to a DMA request and S3 is the interrupt response. Table 2 shows the conditions on Data Bus and Memory Address lines during all machine states. VCC CDP1802 RS THE RC TIME CONSTANT SHOULD BE GREATER THAN THE OSCILLATOR START-UP TIME (TYPICALLY 20ms) CLEAR 3 C Instruction Set The CPU instruction summary is given in Table 1. Hexadecimal notation is used to refer to the 4-bit binary codes. In all registers bits are numbered from the least significant bit (LSB) to the most significant bit (MSB) starting with 0. FIGURE 24. RESET DIAGRAM Pause R(W): Register designated by W, where Stops the internal CPU timing generator on the first negative high-to-low transition of the input clock. The oscillator continues to operate, but subsequent clock transitions are ignored. W = N or X, or P Run R(W).1: Higher order byte of R(W) May be initiated from the Pause or Reset mode functions. If initiated from Pause, the CPU resumes operation on the first negative high-to-low transition of the input clock. When initiated from the Reset operation, the first machine cycle following Reset is always the initialization cycle. The initialization cycle is then followed by a DMA (S2) cycle or fetch (S0) from location 0000 in memory. Operation Notation R(W).0: Lower order byte of R(W) M(R(N)) → D; R(N) + 1 → R(N) This notation means: The memory byte pointed to by R(N) is loaded into D, and R(N) is incremented by 1. IDLE • DMA • INT FORCE S1 S1 RESET (LONG BRANCH, LONG SKIP, NOP, ETC.) DMA S1 EXECUTE S1 INIT DMA INT • DMA DMA DMA • IDLE • INT DMA S2 DMA DMA DMA • INT S0 FETCH DMA PRIORITY: FORCE S0, S1 DMA IN DMA OUT INT INT • DMA FIGURE 25. STATE TRANSITION DIAGRAM 3-22 S3 INT CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) MNEMONIC OP CODE LOAD VIA N LDN 0N M(R(N)) → D; FOR N not 0 LOAD ADVANCE LDA 4N M(R(N)) → D; R(N) + 1 → R(N) LOAD VIA X LDX F0 M(R(X)) → D LDXA 72 M(R(X)) → D; R(X) + 1 → R(X) LOAD IMMEDIATE LDl F8 M(R(P)) → D; R(P) + 1 → R(P) STORE VIA N STR 5N D → M(R(N)) STXD 73 D → M(R(X)); R(X) - 1 → R(X) INCREMENT REG N INC 1N R(N) + 1 → R(N) DECREMENT REG N DEC 2N R(N) - 1 → R(N) INCREMENT REG X IRX 60 R(X) + 1 → R(X) GET LOW REG N GLO 8N R(N).0 → D PUT LOW REG N PLO AN D → R(N).0 GET HIGH REG N GHl 9N R(N).1 → D PUT HIGH REG N PHI BN D → R(N).1 OR OR F1 M(R(X)) OR D → D OR IMMEDIATE ORl F9 M(R(P)) OR D → D; R(P) + 1 → R(P) EXCLUSIVE OR XOR F3 M(R(X)) XOR D → D EXCLUSIVE OR IMMEDIATE XRI FB M(R(P)) XOR D → D; R(P) + 1 → R(P) AND AND F2 M(R(X)) AND D → D AND IMMEDIATE ANl FA M(R(P)) AND D → D; R(P) + 1 → R(P) SHIFT RIGHT SHR F6 SHIFT D RIGHT, LSB(D) → DF, 0 → MSB(D) SHIFT RIGHT WITH CARRY SHRC 76 (Note 2) SHIFT D RIGHT, LSB(D) → DF, DF → MSB(D) RING SHIFT RIGHT RSHR 76 (Note 2) SHIFT D RIGHT, LSB(D) → DF, DF → MSB(D) SHL FE SHIFT LEFT WITH CARRY SHLC 7E (Note 2) SHIFT D LEFT, MSB(D) → DF, DF → LSB(D) RING SHIFT LEFT RSHL 7E (Note 2) SHIFT D LEFT, MSB(D) → DF, DF → LSB(D) ADD ADD F4 M(R(X)) + D → DF, D ADD IMMEDIATE ADl FC M(R(P)) + D → DF, D; R(P) + 1 → R(P) ADD WITH CARRY ADC 74 M(R(X)) + D + DF → DF, D ADD WITH CARRY, IMMEDIATE ADCl 7C M(R(P)) + D + DF → DF, D; R(P) + 1 → R(P) SUBTRACT D SD F5 M(R(X)) - D → DF, D SUBTRACT D IMMEDIATE SDl FD M(R(P)) - D → DF, D; R(P) + 1 → R(P) SUBTRACT D WITH BORROW SDB 75 M(R(X)) - D - (NOT DF) → DF, D INSTRUCTION OPERATION MEMORY REFERENCE LOAD VIA X AND ADVANCE STORE VIA X AND DECREMENT REGISTER OPERATIONS LOGIC OPERATIONS (Note 1) SHIFT LEFT SHIFT D LEFT, MSB(D) → DF, 0 → LSB(D) ARITHMETIC OPERATIONS (Note 1) 3-23 CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) MNEMONIC OP CODE SDBl 7D M(R(P)) - D - (Not DF) → DF, D; R(P) + 1 → R(P) SUBTRACT MEMORY SM F7 D-M(R(X)) → DF, D SUBTRACT MEMORY IMMEDIATE SMl FF D-M(R(P)) → DF, D; R(P) + 1 → R(P) SUBTRACT MEMORY WITH BORROW SMB 77 D-M(R(X))-(NOT DF) → DF, D SUBTRACT MEMORY WITH BORROW, IMMEDIATE SMBl 7F D-M(R(P))-(NOT DF) → DF, D; R(P) + 1 → R(P) BR 30 M(R(P)) → R(P).0 NBR 38 (Note 2) BZ 32 IF D = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF D NOT 0 BNZ 3A IF D NOT 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF DF = 1 BDF IF DF = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF POS OR ZERO BPZ 33 (Note 2) SHORT BRANCH IF EQUAL OR GREATER BGE SHORT BRANCH IF DF = 0 BNF IF DF = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF MINUS BM 3B (Note 2) SHORT BRANCH IF LESS BL SHORT BRANCH IF Q = 1 BQ 31 IF Q = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF Q = 0 BNQ 39 IF Q = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF1 = 1 (EF1 = VSS) B1 34 IF EF1 =1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF1 = 0 (EF1 = VCC) BN1 3C IF EF1 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) INSTRUCTION SUBTRACT D WITH BORROW, IMMEDIATE OPERATION BRANCH INSTRUCTIONS - SHORT BRANCH SHORT BRANCH NO SHORT BRANCH (See SKP) SHORT BRANCH IF D = 0 R(P) + 1 → R(P) SHORT BRANCH IF EF2 = 1 (EF2 = VSS) B2 35 IF EF2 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF2 = 0 (EF2 = VCC) BN2 3D IF EF2 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF3 = 1 (EF3 = VSS) B3 36 IF EF3 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF3 = 0 (EF3 = VCC) BN3 3E IF EF3 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF4 = 1 (EF4 = VSS) B4 37 IF EF4 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) SHORT BRANCH IF EF4 = 0 (EF4 = VCC) BN4 3F IF EF4 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P) LBR C0 M(R(P)) → R(P). 1, M(R(P) + 1) → R(P).0 NLBR C8 (Note 2) LBZ C2 lF D = 0, M(R(P)) → R(P).1, M(R(P) +1) → R(P).0, ELSE R(P) + 2 → R(P) LONG BRANCH IF D NOT 0 LBNZ CA IF D Not 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSE R(P) + 2 → R(P) LONG BRANCH IF DF = 1 LBDF C3 lF DF = 1, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSE R(P) + 2 → R(P) LONG BRANCH IF DF = 0 LBNF CB IF DF = 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSE R(P) + 2 → R(P) LONG BRANCH IF Q = 1 LBQ C1 IF Q = 1, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSE R(P) + 2 → R(P) BRANCH INSTRUCTIONS - LONG BRANCH LONG BRANCH NO LONG BRANCH (See LSKP) LONG BRANCH IF D = 0 3-24 R(P) = 2 → R(P) CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) MNEMONIC OP CODE LBNQ C9 SHORT SKIP (See NBR) SKP 38 (Note 2) R(P) + 1 → R(P) LONG SKIP (See NLBR) LSKP C8 (Note 2) R(P) + 2 → R(P) LSZ CE IF D = 0, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP IF D NOT 0 LSNZ C6 IF D Not 0, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP IF DF = 1 LSDF CF IF DF = 1, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP IF DF = 0 LSNF C7 IF DF = 0, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP lF Q = 1 LSQ CD IF Q = 1, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP IF Q = 0 LSNQ C5 IF Q = 0, R(P) + 2 → R(P), ELSE CONTINUE LONG SKIP IF lE = 1 LSlE CC IF IE = 1, R(P) + 2 → R(P), ELSE CONTINUE lDL 00 (Note 3) NO OPERATION NOP C4 CONTINUE SET P SEP DN N→P SET X SEX EN N→X SET Q SEQ 7B 1→Q RESET Q REQ 7A 0→Q SAVE SAV 78 T → M(R(X)) MARK 79 (X, P) → T; (X, P) → M(R(2)), THEN P → X; R(2) - 1 → R(2) INSTRUCTION LONG BRANCH lF Q = 0 OPERATION lF Q = 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0 EISE R(P) + 2 → R(P) SKIP INSTRUCTIONS LONG SKIP IF D = 0 CONTROL INSTRUCTIONS IDLE PUSH X, P TO STACK WAIT FOR DMA OR INTERRUPT; M(R(0)) → BUS RETURN RET 70 M(R(X)) → (X, P); R(X) + 1 → R(X), 1 → lE DISABLE DlS 71 M(R(X)) → (X, P); R(X) + 1 → R(X), 0 → lE OUTPUT 1 OUT 1 61 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 1 OUTPUT 2 OUT 2 62 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 2 OUTPUT 3 OUT 3 63 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 3 OUTPUT 4 OUT 4 64 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 4 OUTPUT 5 OUT 5 65 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 5 OUTPUT 6 OUT 6 66 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 6 OUTPUT 7 OUT 7 67 M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 7 INPUT 1 INP 1 69 BUS → M(R(X)); BUS → D; N LINES = 1 INPUT 2 INP 2 6A BUS → M(R(X)); BUS → D; N LINES = 2 INPUT 3 INP 3 6B BUS → M(R(X)); BUS → D; N LINES = 3 INPUT 4 INP 4 6C BUS → M(R(X)); BUS → D; N LINES = 4 INPUT 5 INP 5 6D BUS → M(R(X)); BUS → D; N LINES = 5 INPUT 6 INP 6 6E BUS → M(R(X)); BUS → D; N LINES = 6 INPUT 7 INP 7 6F BUS → M(R(X)); BUS → D; N LINES = 7 INPUT - OUTPUT BYTE TRANSFER 3-25 CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) INSTRUCTION MNEMONIC OP CODE OPERATION NOTES: (For Table 1) 1. The arithmetic operations and the shift instructions are the only instructions that can alter the DF. After an add instruction: DF = 1 denotes a carry has occurred DF = 0 Denotes a carry has not occurred After a subtract instruction: DF = 1 denotes no borrow. D is a true positive number DF = 0 denotes a borrow. D is two’s complement The syntax “-(not DF)” denotes the subtraction of the borrow. 2. This instruction is associated with more than one mnemonic. Each mnemonic is individually listed. 3. An idle instruction initiates a repeating S1 cycle. The processor will continue to idle until an I/O request (INTERRUPT, DMA-lN, or DMA- OUT) is activated. When the request is acknowledged, the idle cycle is terminated and the I/O request is serviced, and then normal operation is resumed. 4. Long-Branch, Long-Skip and No Op instructions require three cycles to complete (1 fetch + 2 execute). Long-Branch instructions are three bytes long. The first byte specifies the condition to be tested; and the second and third byte, the branching address. The long-branch instructions can: a. Branch unconditionally b. Test for D = 0 or D ≠ 0 c. Test for DF = 0 or DF = 1 d. Test for Q = 0 or Q = 1 e. Effect an unconditional no branch If the tested condition is met, then branching takes place; the branching address bytes are loaded in the high-and-low order bytes of the current program counter, respectively. This operation effects a branch to any memory location. If the tested condition is not met, the branching address bytes are skipped over, and the next instruction in sequence is fetched and executed. This operation is taken for the case of unconditional no branch (NLBR). 5. The short-branch instructions are two bytes long. The first byte specifies the condition to be tested, and the second specifies the branching address. The short branch instruction can: a. Branch unconditionally b. Test for D = 0 or D ≠ 0 c. Test for DF = 0 or DF = 1 d. Test for Q = 0 or Q = 1 e. Test the status (1 or 0) of the four EF flags f. Effect an unconditional no branch If the tested condition is met, then branching takes place; the branching address byte is loaded into the low-order byte position of the current program counter. This effects a branch within the current 256-byte page of the memory, i.e., the page which holds the branching address. If the tested condition is not met, the branching address byte is skipped over, and the next instruction in sequence is fetched and executed. This same action is taken in the case of unconditional no branch (NBR). 6. The skip instructions are one byte long. There is one Unconditional Short-Skip (SKP) and eight Long-Skip instructions. The Unconditional Short-Skip instruction takes 2 cycles to complete (1 fetch + 1 execute). Its action is to skip over the byte following it. Then the next instruction in sequence is fetched and executed. This SKP instruction is identical to the unconditional no-branch instruction (NBR) except that the skipped-over byte is not considered part of the program. The Long-Skip instructions take three cycles to complete (1 fetch + 2 execute). They can: a. Skip unconditionally b. Test for D = 0 or D ≠ 0 c. Test for DF = 0 or DF = 1 d. Test for Q = 0 or Q = 1 e. Test for IE = 1 If the tested condition is met, then Long Skip takes place; the current program counter is incremented twice. Thus two bytes are skipped over, and the next instruction in sequence is fetched and executed. If the tested condition is not met, then no action is taken. Execution is continued by fetching the next instruction in sequence. 3-26 CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES STATE I N S1 DATA BUS MEMORY ADDRESS MRD MWR N LINES NOTES 00 XXXX 1 1 0 1 00 XXXX 1 1 0 2 MRP → l, N; RP + 1 → RP MRP RP 0 1 0 3 SYMBOL OPERATION 0 → I, N, Q, X, P; 1 → lE RESET Initialize, Not Programmer 0000 → R Accessible S0 S1 FETCH 0 0 lDL IDLE MR0 RO 0 1 0 4, Fig. 8 0 1-F LDN MRN → D MRN RN 0 1 0 Fig. 8 1 0-F INC RN + 1 → RN Float RN 1 1 0 Fig. 6 2 0-F DEC RN - 1 → RN Float RN 1 1 0 Fig. 6 3 0-F Short Branch Taken: MRP → RP.0 Not Taken; RP + 1 → RP MRP RP 0 1 0 Fig. 8 4 0-F LDA MRN → D; RN + 1 → RN MRN RN 0 1 0 Fig. 8 5 0-F STR D → MRN D RN 1 0 0 Fig. 7 6 0 IRX RX + 1 → RX MRX RX 0 1 0 Fig. 7 6 1 OUT 1 MRX → BUS; RX + 1 → RX MRX RX 0 1 1 Fig. 11 2 OUT 2 2 Fig. 11 3 OUT 3 3 Fig. 11 4 OUT 4 4 Fig. 11 5 OUT 5 5 Fig. 11 6 OUT 6 6 Fig. 11 7 OUT 7 7 Fig. 11 9 INP 1 1 Fig. 10 A INP 2 2 Fig. 10 B INP 3 3 Fig. 10 C INP 4 4 Fig. 10 D INP5 5 Fig. 10 E INP6 6 Fig. 10 F INP7 7 Fig. 10 0 RET MRX → (X, P); RX + 1 → RX; 1 → lE MRX RX 0 1 0 Fig. 8 1 DlS MRX → (X, P); RX + 1 → RX; 0 → lE MRX RX 0 1 0 Fig. 8 2 LDXA MRX → D; RX + 1 → RX MRX RX 0 1 0 Fig. 8 3 STXD D → MRX; RX - 1 → RX D RX 1 0 0 Fig. 7 4 ADC MRX + D + DF → DF, D MRX RX 0 1 0 Fig. 8 5 SDB MRX - D - DFN → DF, D MRX RX 0 1 0 Fig. 8 6 SHRC LSB(D) → DF; DF → MSB(D) Float RX 1 1 0 Fig. 6 7 SMB D - MRX - DFN → DF, D MRX RX 0 1 0 Fig. 8 8 SAV T → MRX T RX 1 0 0 Fig. 7 7 BUS → MRX, D Data from I/O Device 3-27 RX 1 0 CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES (Continued) DATA BUS MEMORY ADDRESS MRD MWR N LINES NOTES T R2 1 0 0 Fig. 7 0→Q Float RP 1 1 0 Fig. 6 SEQ 1→Q Float RP 1 1 0 Fig. 6 C ADCl MRP + D + DF → DF, D; RP + 1 MRP RP 0 1 0 Fig. 8 D SDBl MRP - D - DFN → DF, D; RP + 1 MRP RP 0 1 0 Fig. 8 E SHLC MSB(D) → DF; DF → LSB(D) Float RP 1 1 0 Fig. 6 F SMBl D - MRP - DFN → DF, D; RP + 1 MRP RP 0 1 0 Fig. 8 8 0-F GLO RN.0 → D RN.0 RN 1 1 0 Fig. 6 9 0-F GHl RN.1 → D RN.1 RN 1 1 0 Fig. 6 A 0-F PLO D → RN.0 D RN 1 1 0 Fig. 6 B 0-F PHI D → RN.1 D RN 1 1 0 Fig. 6 C 0 - 3, 8-B Long Branch MRP RP 0 1 0 Fig. 9 M(RP + 1) RP + 1 0 1 0 Fig. 9 STATE I N SYMBOL S1 7 9 MARK A REQ B S1#1 OPERATION (X, P) → T, MR2; P → X; R2 - 1 → R2 Taken: MRP → B; RP + 1 → RP Taken: B → RP.1; MRP → RP.0 #2 S1#1 Not Taken: RP + 1 → RP MRP RP 0 1 0 Fig. 9 #2 Not Taken: RP + 1 → RP M(RP + 1) RP + 1 0 1 0 Fig. 9 Taken: RP + 1 → RP MRP RP 0 1 0 Fig. 9 Taken: RP + 1 → RP M(RP + 1) RP + 1 0 1 0 Fig. 9 Not Taken: No Operation MRP RP 0 1 0 Fig. 9 Not Taken: No Operation MRP RP 0 1 0 Fig. 9 No Operation MRP RP 0 1 0 Fig. 9 No Operation MRP RP 0 1 0 Fig. 9 S1#1 #2 S1#1 #2 S1#1 5 6 7 C D E F Long Skip 4 NOP #2 S1 S1 D 0-F SEP N→P NN RN 1 1 0 Fig. 6 E 0-F SEX N→X NN RN 1 1 0 Fig. 6 F 0 LDX MRX → D MRX RX 0 1 0 Fig. 8 1 2 3 4 5 7 OR AND XOR ADD SD SM MRX OR D → D MRX AND D → D MRX XOR D → D MRX + D → DF, D MRX - D → DF, D D - MRX → DF, D MRX RX 0 1 0 Fig. 8 6 SHR LSB(D) → DF; 0 → MSB(D) Float RX 1 1 0 Fig. 6 3-28 CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES (Continued) DATA BUS MEMORY ADDRESS MRD MWR N LINES NOTES MRP RP 0 1 0 Fig. 8 MSB(D) → DF; 0 → LSB(D) Float RP 1 1 0 Fig. 6 DMA IN BUS → MR0; R0 + 1 → R0 Data from I/O Device R0 1 0 0 6, Fig. 12 DMAOUT MR0 → BUS; R0 + 1 → R0 MR0 R0 0 1 0 6, Fig. 13 STATE I N SYMBOL S1 F 8 LDl MRP → D; RP + 1 → RP 9 ORl MRP OR D → D; RP + 1 → RP A ANl MRP AND D → D; RP + 1 → RP B XRl MRP XOR D → D; RP + 1 → RP C ADl MRP + D → DF, D; RP + 1 → RP D SDl MRP - D → DF, D; RP + 1 → RP F SMl D - MRP → DF, D; RP +1 → RP E SHL S2 OPERATION S3 INTERRUPT X, P → T; 0 → lE, 1 → P; 2→X Float RN 1 1 0 Fig. 14 S1 LOAD IDLE (CLEAR, WAlT = 0) M(R0 - 1) R0 - 1 0 1 0 5, Fig. 8 NOTES: 1. lE = 1, TPA, TPB suppressed, state = S1. 2. BUS = 0 for entire cycle. 3. Next state always S1. 4. Wait for DMA or INTERRUPT. 5. Suppress TPA, wait for DMA. 6. IN REQUEST has priority over OUT REQUEST. 7. See Timing Waveforms, Figure 5 through Figure 14 for machine cycles. Operating and Handling Considerations Handling All inputs and outputs of Intersil CMOS devices have a network for electrostatic protection during handling. Operating Operating Voltage - During operation near the maximum supply voltage limit care should be taken to avoid or suppress power supply turn-on and turn-off transients, power supply ripple, or ground noise; any of these conditions must not cause VDD - VSS to exceed the absolute maximum rating. Input Signals - To prevent damage to the input protection circuit, input signals should never be greater than VDD nor less than VSS. Input currents must not exceed 10mA even when the power supply is off. Unused Inputs - A connection must be provided at every input terminal. All unused input terminals must be connected to either VDD or VSS, whichever is appropriate. Output Short Circuits - Shorting of outputs to VDD or VSS may damage CMOS devices by exceeding the maximum device dissipation. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 3-29