2/8 TAI-SAW TECHNOLOGY CO., LTD. Glass SMD 3.2x2.5 12MHz Crystal Unit MODEL NO.: TZ2503A REV. NO.: 1.0 Revise: Rev. Rev. Page Rev. Account Date 1 N/A Initial release 02/06/12’ N/A TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Reviser Ginger Huang TST DCC Release document 3/8 TAI-SAW TECHNOLOGY CO., LTD. Glass SMD 3.2x2.5 12MHz Crystal Unit MODEL NO.: TZ2503A REV. NO.: 1.0 Features: z z z z Surface Mount Hermetic Package Excellent Reliability Performance Good Frequency Perturbation and Stability over temperature Ultra Miniature Package RoHS Exemption Approved Description and Applications: Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility. Electrical Specifications: TZ2503A Specification Nominal Frequency 12.000000 MHz Mode of Oscillation Fundamental Storage Temperature Range -40°C to +85°C Operating Temperature Range -20°C to +70°C Frequency Stability over Operating Temperature Range +/-30 ppm (referred to the value at 25°C) Frequency Make Tolerance (FL) +/-30 ppm @ 25°C +/- 3°C Equivalent Series Resistance (ESR) 80 Ω max Nominal Drive Level 100 uW max. Shunt Capacitance (Co) 3.0 pF max Load Capacitance (CL) 10 pF Insulation Resistance 500 MΩ min./DC 100V Aging +/-1.0 ppm/year Unit Weight 0.017+/-0.005 g Marking Laser Marking TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4/8 Mechanical Dimensions (mm): Recommended Land Pattern: (unit: mm) Marking: Line 1: Frequency (12.00) Line 2: TST Logo + Crystal Product Code + Date Code + Traceability Code (XX) 12.00 T ZDXX ○ TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5/8 Product Code Table Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 A B C D E F G H I J K L M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v w x y z Reel Dimensions (mm): TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6/8 Tape Dimensions (mm): Direction of Feed Packing Quantity/Packing: 3K pcs maximum per reel TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7/8 Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 8/8 Reliability Specifications Test name Reference standard Test process / method Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 10 times 125 ℃ (30min) Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document