Product Family Data Sheet Rev. 1.4 2016.06.01 High Voltage LED Series Chip on Board LC006D High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits • Chip on Board (COB) solution makes it easy to design in • Simple assembly reduces manufacturing cost • Low thermal resistance • InGaN/GaN MQW LED with long time reliability Applications • Spotlight / Downlight • LED Retrofit Bulbs • Outdoor Illumination 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 9 4. Outline Drawing & Dimension ----------------------- 12 5. Reliability Test Items & Conditions ----------------------- 13 6. Label Structure ----------------------- 14 7. Packing Structure ----------------------- 15 8. Precautions in Handling & Use ----------------------- 17 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 ºC - Storage Temperature Tstg -40 ~ +120 ºC - LED Junction Temperature TJ 140 ºC - Case Temperature Tc 105 ºC Forward Current IF 320 mA - Power Dissipation PD 17.2 W - ESD (HBM) - ±2 kV - ESD (MM) - ±0.5 kV - b) Electro-optical Characteristics (IF = 180 mA, TJ = 85 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YZ 31.8 34.6 37.5 5 80 - - Color Rendering Index (Ra) 7 90 Thermal Resistance (junction to chip point) ºC/W - 2.4 - Beam Angle º - 115 - Nominal Power W 6.4 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C) 2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1 3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range. 4 c) Luminous Flux Characteristics CRI (Ra) Min. (IF = 180 mA) Nominal CCT (K) Flux Rank Flux @ TJ = 85 °C (lm) Min. Typ. Max. E9 791 832 - D1 832 874 - F3 831 875 - D1 875 919 - F5 857 902 - D1 902 947 - F8 877 923 - D1 923 969 - F8 882 928 - D1 928 975 - F8 882 928 - D1 928 975 - F8 872 918 - D1 918 964 - 2700 3000 3500 80 4000 5000 5700 6500 CRI (Ra) Min. Nominal CCT (K) Flux Rank Flux @ TJ = 85 °C (lm) Min. Typ. Max. D7 673 709 - D1 709 744 - E9 706 743 - D1 743 780 - E0 730 768 - D1 768 807 - E4 745 784 - D1 784 824 - 2700 3000 90 3500 4000 Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = 85 °C). 2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H A H D N B 2 5 Y Z W 3 E 9 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version A Form Factor HD 9 Lens Type N No lens 10 Internal Code B LC006D 11 Chip Type 2 12 CRI & Sorting Temperature 1 2 3 4 5 6 7 8 13 14 15 CCT (K) 16 17 Forward Voltage (V) Specification Warm White COB 5 Min. 80 (85℃) 7 Min. 90 (85℃) YZ 31.8~37.5 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K 2 MacAdam 2-step 3 MacAdam 3-step MacAdam Step 18 Luminous Flux (Lm) D7 E0 E4 E9 F3 F5 F7 F8 D1 Min. 670 Min. 700 Min. 740 Min. 790 Min. 830 Min. 850 Min. 870 Min. 880 Add Rank 6 a) Binning Structure CRI (Ra) Min. (IF = 180 mA, TJ = 85 ºC) Nominal CCT (K) Color Rank Chrom. Bin SPHWHAHDNB25YZW2E9 W2 W2 SPHWHAHDNB25YZW3E9 W3 W3 SPHWHAHDNB25YZW2D1 W2 W2 SPHWHAHDNB25YZW3D1 W3 W3 SPHWHAHDNB25YZV2F3 V2 V2 SPHWHAHDNB25YZV3F3 V3 V3 SPHWHAHDNB25YZV2D1 V2 V2 SPHWHAHDNB25YZV3D1 V3 V3 SPHWHAHDNB25YZU2F5 U2 U2 SPHWHAHDNB25YZU3F5 U3 U3 SPHWHAHDNB25YZU2D1 U2 U2 SPHWHAHDNB25YZU3D1 U3 U3 SPHWHAHDNB25YZT2F8 T2 T2 SPHWHAHDNB25YZT3F8 T3 T3 SPHWHAHDNB25YZT2D1 T2 T2 SPHWHAHDNB25YZT3D1 T3 T3 R2 Product Code 2700 Flux Rank Flux Range (Φv, lm) E9 791 ~ D1 832 ~ F3 831 ~ D1 875 ~ F5 857 ~ D1 902 ~ F8 877 ~ D1 923 ~ R2 F8 882 ~ R3 R3 D1 928 ~ Q2 Q2 F8 882 ~ Q3 Q3 D1 928 ~ P2 P2 F7 872 ~ P3 P3 D1 918 ~ YZ 3000 YZ 3500 80 VF Rank YZ 4000 YZ SPHWHAHDNB25YZR3F8 5000 YZ SPHWHAHDNB25YZR3D1 SPHWHAHDNB25YZQ3F8 5700 YZ SPHWHAHDNB25YZQ3D1 SPHWHAHDNB25YZP3F7 6500 YZ SPHWHAHDNB25YZP3D1 7 CRI (Ra) Min. Nominal CCT (K) Color Rank Chrom. Bin SPHWHAHDNB27YZW2D7 W2 W2 SPHWHAHDNB27YZW3D7 W3 W3 SPHWHAHDNB27YZW2D1 W2 W2 SPHWHAHDNB27YZW3D1 W3 W3 SPHWHAHDNB27YZV2E9 V2 V2 SPHWHAHDNB27YZV3E9 V3 V3 SPHWHAHDNB27YZV2D1 V2 V2 SPHWHAHDNB27YZV3D1 V3 V3 SPHWHAHDNB27YZU2E0 U2 U2 SPHWHAHDNB27YZU3E0 U3 U3 SPHWHAHDNB27YZU2D1 U2 U2 SPHWHAHDNB27YZU3D1 U3 U3 SPHWHAHDNB27YZT2E4 T2 T2 SPHWHAHDNB27YZT3E4 T3 T3 SPHWHAHDNB27YZT2D1 T2 T2 SPHWHAHDNB27YZT3D1 T3 T3 Product Code 2700 VF Rank Flux Rank Flux Range (Φv, lm) D7 673 ~ D1 709 ~ E9 706 ~ D1 743 ~ E0 730 ~ D1 768 ~ E4 745 ~ D1 784 ~ YZ 3000 YZ 90 3500 YZ 4000 YZ 8 b) Chromaticity Region & Coordinates (IF = 180 mA, TJ = 85 ºC) θ CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032 MacAdam Ellipse (P3) Step CIE x CIE y θ a b 3-step 0.3123 0.3282 58.5700 0.0067 0.0029 Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 9 3. Typical Characteristics Graphs b) Beam Angle Characteristics (IF = 180 mA, TJ = 85 ºC) CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 Wavelength CCT: 3500 K (80 CRI) 60 40 20 0 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) 80 100 80 60 40 20 0 400 500 Wavelength 600 700 800 Wavelength CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 500 600 Wavelength 700 800 Relative Emission Intensity(%) Relative Intensity vs. Wavelength Relative Emission Intensity(%) 800 Relative Intensity vs. Wavelength 100 400 700 CCT: 4000 K (80 CRI) Relative Intensity vs. Wavelength 400 600 Wavelength(nm) 100 80 60 40 20 0 400 500 600 Wavelength 700 800 10 CCT: 6500 K (80 CRI) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Wavelength b) Forward Current Characteristics (TJ = 85 ºC) Forward Voltage vs. Forward Current 400 Forward Voltage(V) Relative Luminous Flux(%) Relative luminous Flux vs. Forward Current 300 200 100 0 0 0.1 0.2 0.3 0.4 45 40 35 30 0.5 0 0.1 Forward Current(A) 0.2 0.3 0.4 0.5 Forward Current(A) C) Temperature Characteristics (IF = 180mA) Forward Voltage vs. Temperature 105 36.5 Forward Voltage(V) Relative Luminous Flux(%) Relative Luminous Flux vs. Temperature 100 95 90 85 80 36.0 35.5 35.0 34.5 34.0 33.5 33.0 20 40 60 Tc(℃) 80 100 20 40 60 Tc(℃) 80 100 11 d) Color Shift Characteristics (TJ = 85 ºC, CRI 80+) △CIE x,△CIE y vs. Forward Current △CIEx,△CIEy vs. Temperature 0 △CIE x,△ CIE y △CIE x,△ CIE y 0 -0.01 -0.02 -0.03 △CIE x -0.04 △ CIE y -0.05 0.00 0.10 0.20 0.30 0.40 0.50 Relative Luminous Intensity (IF = 180 mA, TJ = 85 ºC) 1 0.8 0.6 0.4 0.2 20 40 60 80 100 Angle(°) f) Derating Characteristics Derating Curve If [ mA ] 400 300 200 100 0 0 20 40 60 Tc [ ℃ ] 80 -0.03 ΔCIE x -0.04 ΔCIE y 20 40 60 Tc(℃) 1.2 0 -100 -80 -60 -40 -20 0 -0.02 -0.05 Forward Current(A) e) Beam Angle Characteristics -0.01 100 120 80 100 12 4. Outline Drawing & Dimension Tc 1. Unit: mm 2. Tolerance: ± 0.3 mm Note: Item Dimension Tolerance Unit Length 13.5 ±0.15 mm Width 13.5 ±0.15 mm Height 1.50 ±0.20 mm Light Emitting Surface (LES) Diameter 9.8 ±0.15 mm Denoted product information above is only an example ( LC006D, CRI80+, 3000K ) 13 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 ºC, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 ºC, DC Derating, IF 1000 h Low Temperature Life Test -40 ºC, DC , IF = 320 mA 1000 h Pulsed Operating Life Test 55 ℃, Pulse width 100 ㎲, duty cycle 3 % 1000 h High Temperature Storage 120 ºC 1000 h Low Temperature Storage -40 ºC 1000 h Temperature Humidity Storage 60 ºC, 90% RH 1000h Temperature Cycle On/Off Test -40 ºC / 85 ºC each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 MΩ R2: 1.5 kΩ C: 100 pF V: ±2 kV ESD (HBM) 5 times R1: 10 MΩ R2: 0 kΩ C: 200 pF ESD (MM) 5 times V: ±0.2 kV Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency ↔ max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Sulfur Resistance 25 °C, 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Forward Voltage VF Luminous Flux Φv Limit Min. Max. IF = 180 mA L.S.L. * 0.9 U.S.L. * 1.1 IF = 180 mA L.S.L * 0.7 U.S.L * 1.3 14 6. Label Structure a) Label Structure ⓐⓑⓒⓓⓔⓕ YZW3E9 Bin Code SPHWHAHDNB25YZW3E9 YZW3E9 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code G4AZC4001 / 1001 / xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: ⓐⓑ: Forward Voltage bin ⓒⓓ: Chromaticity bin ⓔⓕ: Luminous Flux bin (refer to page 11) (refer to page 9-10) (refer to page 6) b) Lot Number The lot number is composed of the following characters: YZW3E9 SPHWHAHDNB25YZW3E9 YZW3E9 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs ① ② ③ ④ ⑤ ⑥⑦⑧⑨ ⓐⓑⓒ : Production site (S: Giheung, Korea, : 4 : Product state : Year : Month : Day (1~9, A, B~V) : Product serial number (001 ~ 999) G: Tianjin, China) (LED) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Z: 2015, A: 2016, B: 2017…) (1~9, A, B, C) 15 7. Packing Structure Packing material Tray Aluminum Bag Inner Box Outer Box Max. quantity in pcs of COB 30 60(2 trays) 240 2400 Dimension(mm) Width 180 241 84 445 Length 160 210 230 476 a) Packing Structure Label Label Height 10 260 272 Tolerance 1.0 10 2 5 16 b) Tray ① Cover c) Aluminum Vinyl Packing Bag ② Body 17 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com