Data Sheet LC006D Rev.1.4

Product Family Data Sheet
Rev. 1.4 2016.06.01
High Voltage LED Series
Chip on Board
LC006D
High efficacy COB LED package
well-suited for use in spotlight applications
Features & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
1#
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
ºC
-
Storage Temperature
Tstg
-40 ~ +120
ºC
-
LED Junction Temperature
TJ
140
ºC
-
Case Temperature
Tc
105
ºC
Forward Current
IF
320
mA
-
Power Dissipation
PD
17.2
W
-
ESD (HBM)
-
±2
kV
-
ESD (MM)
-
±0.5
kV
-
b) Electro-optical Characteristics
(IF = 180 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
5
80
-
-
Color Rendering Index (Ra)
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
2.4
-
Beam Angle
º
-
115
-
Nominal Power
W
6.4
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of:
forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics
CRI (Ra)
Min.
(IF = 180 mA)
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
E9
791
832
-
D1
832
874
-
F3
831
875
-
D1
875
919
-
F5
857
902
-
D1
902
947
-
F8
877
923
-
D1
923
969
-
F8
882
928
-
D1
928
975
-
F8
882
928
-
D1
928
975
-
F8
872
918
-
D1
918
964
-
2700
3000
3500
80
4000
5000
5700
6500
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
D7
673
709
-
D1
709
744
-
E9
706
743
-
D1
743
780
-
E0
730
768
-
D1
768
807
-
E4
745
784
-
D1
784
824
-
2700
3000
90
3500
4000
Notes:
1)
The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(Tj = Tc = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
B
2
5
Y
Z
W
3
E
9
Digit
PKG Information
Code
Samsung Package High Power
SPH
Color
WH
Product Version
A
Form Factor
HD
9
Lens Type
N
No lens
10
Internal Code
B
LC006D
11
Chip Type
2
12
CRI & Sorting Temperature
1 2
3
4 5
6
7 8
13
14
15
CCT (K)
16
17
Forward Voltage (V)
Specification
Warm White
COB
5
Min. 80
(85℃)
7
Min. 90
(85℃)
YZ
31.8~37.5
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
2
MacAdam 2-step
3
MacAdam 3-step
MacAdam Step
18
Luminous Flux (Lm)
D7
E0
E4
E9
F3
F5
F7
F8
D1
Min. 670
Min. 700
Min. 740
Min. 790
Min. 830
Min. 850
Min. 870
Min. 880
Add Rank
6
a) Binning Structure
CRI (Ra)
Min.
(IF = 180 mA, TJ = 85 ºC)
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDNB25YZW2E9
W2
W2
SPHWHAHDNB25YZW3E9
W3
W3
SPHWHAHDNB25YZW2D1
W2
W2
SPHWHAHDNB25YZW3D1
W3
W3
SPHWHAHDNB25YZV2F3
V2
V2
SPHWHAHDNB25YZV3F3
V3
V3
SPHWHAHDNB25YZV2D1
V2
V2
SPHWHAHDNB25YZV3D1
V3
V3
SPHWHAHDNB25YZU2F5
U2
U2
SPHWHAHDNB25YZU3F5
U3
U3
SPHWHAHDNB25YZU2D1
U2
U2
SPHWHAHDNB25YZU3D1
U3
U3
SPHWHAHDNB25YZT2F8
T2
T2
SPHWHAHDNB25YZT3F8
T3
T3
SPHWHAHDNB25YZT2D1
T2
T2
SPHWHAHDNB25YZT3D1
T3
T3
R2
Product Code
2700
Flux
Rank
Flux Range
(Φv, lm)
E9
791 ~
D1
832 ~
F3
831 ~
D1
875 ~
F5
857 ~
D1
902 ~
F8
877 ~
D1
923 ~
R2
F8
882 ~
R3
R3
D1
928 ~
Q2
Q2
F8
882 ~
Q3
Q3
D1
928 ~
P2
P2
F7
872 ~
P3
P3
D1
918 ~
YZ
3000
YZ
3500
80
VF
Rank
YZ
4000
YZ
SPHWHAHDNB25YZR3F8
5000
YZ
SPHWHAHDNB25YZR3D1
SPHWHAHDNB25YZQ3F8
5700
YZ
SPHWHAHDNB25YZQ3D1
SPHWHAHDNB25YZP3F7
6500
YZ
SPHWHAHDNB25YZP3D1
7
CRI (Ra)
Min.
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDNB27YZW2D7
W2
W2
SPHWHAHDNB27YZW3D7
W3
W3
SPHWHAHDNB27YZW2D1
W2
W2
SPHWHAHDNB27YZW3D1
W3
W3
SPHWHAHDNB27YZV2E9
V2
V2
SPHWHAHDNB27YZV3E9
V3
V3
SPHWHAHDNB27YZV2D1
V2
V2
SPHWHAHDNB27YZV3D1
V3
V3
SPHWHAHDNB27YZU2E0
U2
U2
SPHWHAHDNB27YZU3E0
U3
U3
SPHWHAHDNB27YZU2D1
U2
U2
SPHWHAHDNB27YZU3D1
U3
U3
SPHWHAHDNB27YZT2E4
T2
T2
SPHWHAHDNB27YZT3E4
T3
T3
SPHWHAHDNB27YZT2D1
T2
T2
SPHWHAHDNB27YZT3D1
T3
T3
Product Code
2700
VF
Rank
Flux
Rank
Flux Range
(Φv, lm)
D7
673 ~
D1
709 ~
E9
706 ~
D1
743 ~
E0
730 ~
D1
768 ~
E4
745 ~
D1
784 ~
YZ
3000
YZ
90
3500
YZ
4000
YZ
8
b) Chromaticity Region & Coordinates
(IF = 180 mA, TJ = 85 ºC)
θ
CIE x,y
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
θ
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of:
Cx, Cy = ±0.005
9
3. Typical Characteristics Graphs
b) Beam Angle Characteristics
(IF = 180 mA, TJ = 85 ºC)
CCT: 2700 K (80 CRI)
CCT: 3000 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
Wavelength
CCT: 3500 K (80 CRI)
60
40
20
0
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
80
100
80
60
40
20
0
400
500
Wavelength
600
700
800
Wavelength
CCT: 5000 K (80 CRI)
CCT: 5700 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
500
600
Wavelength
700
800
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
Relative Emission Intensity(%)
800
Relative Intensity vs. Wavelength
100
400
700
CCT: 4000 K (80 CRI)
Relative Intensity vs. Wavelength
400
600
Wavelength(nm)
100
80
60
40
20
0
400
500
600
Wavelength
700
800
10
CCT: 6500 K (80 CRI)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Wavelength
b) Forward Current Characteristics
(TJ = 85 ºC)
Forward Voltage vs. Forward Current
400
Forward Voltage(V)
Relative Luminous Flux(%)
Relative luminous Flux vs. Forward Current
300
200
100
0
0
0.1
0.2
0.3
0.4
45
40
35
30
0.5
0
0.1
Forward Current(A)
0.2
0.3
0.4
0.5
Forward Current(A)
C) Temperature Characteristics (IF = 180mA)
Forward Voltage vs. Temperature
105
36.5
Forward Voltage(V)
Relative Luminous Flux(%)
Relative Luminous Flux vs. Temperature
100
95
90
85
80
36.0
35.5
35.0
34.5
34.0
33.5
33.0
20
40
60
Tc(℃)
80
100
20
40
60
Tc(℃)
80
100
11
d) Color Shift Characteristics (TJ = 85 ºC, CRI 80+)
△CIE x,△CIE y
vs. Forward Current
△CIEx,△CIEy vs. Temperature
0
△CIE x,△ CIE y
△CIE x,△ CIE y
0
-0.01
-0.02
-0.03
△CIE x
-0.04
△ CIE y
-0.05
0.00
0.10
0.20
0.30
0.40
0.50
Relative Luminous Intensity
(IF = 180 mA, TJ = 85 ºC)
1
0.8
0.6
0.4
0.2
20 40 60 80 100
Angle(°)
f) Derating Characteristics
Derating Curve
If [ mA ]
400
300
200
100
0
0
20
40
60
Tc [ ℃ ]
80
-0.03
ΔCIE x
-0.04
ΔCIE y
20
40
60
Tc(℃)
1.2
0
-100 -80 -60 -40 -20 0
-0.02
-0.05
Forward Current(A)
e) Beam Angle Characteristics
-0.01
100
120
80
100
12
4. Outline Drawing & Dimension
Tc
1. Unit:
mm
2. Tolerance: ± 0.3 mm
Note:
Item
Dimension
Tolerance
Unit
Length
13.5
±0.15
mm
Width
13.5
±0.15
mm
Height
1.50
±0.20
mm
Light Emitting Surface (LES) Diameter
9.8
±0.15
mm
Denoted product information above is only an example
( LC006D, CRI80+, 3000K )
13
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 320 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
ESD (HBM)
5 times
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
ESD (MM)
5 times
V: ±0.2 kV
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C,
75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Forward Voltage
VF
Luminous Flux
Φv
Limit
Min.
Max.
IF = 180 mA
L.S.L. * 0.9
U.S.L. * 1.1
IF = 180 mA
L.S.L * 0.7
U.S.L * 1.3
14
6. Label Structure
a) Label Structure
ⓐⓑⓒⓓⓔⓕ
YZW3E9
Bin Code
SPHWHAHDNB25YZW3E9 YZW3E9 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Product Code
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot Number
Note:
Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ:
Forward Voltage bin
ⓒⓓ:
Chromaticity bin
ⓔⓕ:
Luminous Flux bin
(refer to page 11)
(refer to page 9-10)
(refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
YZW3E9
SPHWHAHDNB25YZW3E9 YZW3E9 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①
③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
②
③
④
⑤
⑥⑦⑧⑨
ⓐⓑⓒ
:
Production site
(S: Giheung, Korea,
:
4
:
Product state
:
Year
:
Month
:
Day (1~9, A, B~V)
:
Product serial number (001 ~ 999)
G: Tianjin, China)
(LED)
(A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
(Z: 2015, A: 2016, B: 2017…)
(1~9, A, B, C)
15
7.
Packing Structure
Packing material
Tray
Aluminum Bag
Inner Box
Outer Box
Max. quantity
in pcs of COB
30
60(2 trays)
240
2400
Dimension(mm)
Width
180
241
84
445
Length
160
210
230
476
a) Packing Structure
Label
Label
Height
10
260
272
Tolerance
1.0
10
2
5
16
b) Tray
① Cover
c) Aluminum Vinyl Packing Bag
② Body
17
8.
Precautions in Handling & Use
1)
This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2)
LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3)
After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4)
Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5)
Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6)
Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7)
The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8)
VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9)
The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. inspires the world and shapes the future
with transformative ideas and technologies, redefining the worlds of TVs,
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www.samsung.com and our official blog at global.samsungtomorrow.com.
Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com
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