Data Sheet LC013D Rev.1.4

Product Family Data Sheet
Rev. 1.4 2016.06.01
High Voltage LED Series
Chip on Board
LC013D
High efficacy COB LED package
well-suited for use in spotlight applications
Features & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
1
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
ºC
-
Storage Temperature
Tstg
-40 ~ +120
ºC
-
LED Junction Temperature
TJ
140
ºC
-
Case Temperature
Tc
Forward Current
IF
700
mA
-
Power Dissipation
PD
34.5
W
-
ESD (HBM)
-
±2
kV
-
ESD (MM)
-
±0.5
kV
-
b) Electro-optical Characteristics
(IF = 360 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
5
80
-
-
Color Rendering Index (Ra)
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
1.4
-
Beam Angle
º
-
115
-
Nominal Power
W
13.5
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of:
forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics
CRI (Ra)
Min.
(IF = 360 mA)
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
H5
1510
1589
-
D1
1589
1669
-
H5
1589
1673
-
D1
1673
1757
-
H6
1639
1725
-
D1
1725
1812
-
H6
1669
1757
-
D1
1757
1844
-
H6
1684
1772
-
D1
1772
1861
-
H6
1684
1772
-
D1
1772
1861
-
H6
1659
1746
-
D1
1746
1834
-
2700
3000
3500
80
4000
5000
5700
6500
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
H2
1291
1359
-
D1
1359
1427
-
H3
1352
1423
-
D1
1423
1494
-
H4
1400
1473
-
D1
1473
1547
-
H4
1429
1505
-
D1
1505
1580
-
2700
3000
90
3500
4000
Notes:
1)
The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
D
2
5
Y
Z
W
3
H
5
Digit
PKG Information
Code
Samsung Package High Power
SPH
Color
WH
Product Version
A
Form Factor
HD
9
Lens Type
N
No lens
10
Internal Code
D
LC013D
11
Chip Type
2
12
CRI & Sorting Temperature
1 2
3
4 5
6
7 8
13
14
15
CCT (K)
16
17
Forward Voltage (V)
Specification
Warm White
COB
5
Min. 80
(85℃)
7
Min. 90
(85℃)
YZ
31.8~37.5
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
2
MacAdam 2-step
3
MacAdam 3-step
MacAdam Step
18
Luminous Flux (Lm)
H2
Min. 1200
H3
Min. 1300
H4
Min. 1400
H5
Min. 1500
H6
D1
Min. 1600
Add rank
6
a) Binning Structure
CRI (Ra)
Min.
(IF = 360 mA, TJ = 85 ºC)
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDND25YZW2H5
W2
W2
SPHWHAHDND25YZW3H5
W3
W3
SPHWHAHDND25YZW2D1
W2
W2
SPHWHAHDND25YZW3D1
W3
W3
SPHWHAHDND25YZV2H5
V2
V2
SPHWHAHDND25YZV3H5
V3
V3
SPHWHAHDND25YZV2D1
V2
V2
SPHWHAHDND25YZV3D1
V3
V3
SPHWHAHDND25YZU2H6
U2
U2
SPHWHAHDND25YZU3H6
U3
U3
SPHWHAHDND25YZU2D1
U2
U2
SPHWHAHDND25YZU3D1
U3
U3
SPHWHAHDND25YZT2H6
T2
T2
SPHWHAHDND25YZT3H6
T3
T3
SPHWHAHDND25YZT2D1
T2
T2
SPHWHAHDND25YZT3D1
T3
T3
R3
R3
Product Code
2700
VF
Rank
Flux
Rank
Flux Range
(Φv, lm)
H5
1510 ~
D1
1589 ~
H5
1589 ~
D1
1673 ~
H6
1639 ~
D1
1725 ~
H6
1669 ~
D1
1757 ~
H6
1684 ~
D1
1772 ~
H6
1684 ~
D1
1772 ~
H6
1659 ~
D1
1746 ~
YZ
3000
YZ
3500
YZ
80
4000
YZ
SPHWHAHDND25YZR3H6
5000
YZ
SPHWHAHDND25YZR3D1
SPHWHAHDND25YZQ3H6
5700
YZ
Q3
Q3
SPHWHAHDND25YZQ3D1
SPHWHAHDND25YZP3H6
6500
YZ
SPHWHAHDND25YZP3D1
P3
P3
7
CRI (Ra)
Min.
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDND27YZW2H2
W2
W2
SPHWHAHDND27YZW3H2
W3
W3
SPHWHAHDND27YZW2D1
W2
W2
SPHWHAHDND27YZW3D2
W3
W3
SPHWHAHDND27YZV2H3
V2
V2
SPHWHAHDND27YZV3H3
V3
V3
SPHWHAHDND27YZV2D1
V2
V2
SPHWHAHDND27YZV3D1
V3
V3
SPHWHAHDND27YZU2H4
U2
U2
SPHWHAHDND27YZU3H4
U3
U3
SPHWHAHDND27YZU2D1
U2
U2
SPHWHAHDND27YZU3D1
U3
U3
SPHWHAHDND27YZT2H4
T2
T2
SPHWHAHDND27YZT3H4
T3
T3
SPHWHAHDND27YZT2D1
T2
T2
SPHWHAHDND27YZT3D1
T3
T3
Product Code
2700
VF
Rank
Flux
Rank
Flux Range
(Φv, lm)
H2
1291 ~
D1
1359 ~
H3
1352 ~
D1
1423 ~
H4
1400 ~
D1
1473 ~
H4
1429 ~
D1
1505 ~
YZ
3000
YZ
90
3500
YZ
4000
YZ
8
b) Chromaticity Region & Coordinates
(IF = 360 mA, TJ = 85 ºC)
θ
CIE x,y
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
θ
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of:
Cx, Cy = ±0.005
9
3. Typical Characteristics Graphs
a) Spectrum Distribution
(IF = 360, TJ = 85 ºC)
CCT: 2700 K (80 CRI)
CCT: 3000 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
Wavelength
CCT: 3500 K (80 CRI)
60
40
20
0
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
80
100
80
60
40
20
0
400
500
Wavelength
600
700
800
Wavelength
CCT: 5000 K (80 CRI)
CCT: 5700 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
500
600
Wavelength
700
800
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
Relative Emission Intensity(%)
800
Relative Intensity vs. Wavelength
100
400
700
CCT: 4000 K (80 CRI)
Relative Intensity vs. Wavelength
400
600
Wavelength(nm)
100
80
60
40
20
0
400
500
600
Wavelength
700
800
10
CCT: 6500 K (80 CRI)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Wavelength
b) Forward Current Characteristics
(TJ = 85 ºC)
Forward Voltage vs. Forward Current
42.5
250
Forward Voltage(%)
Relative Luminous Flux(%)
Relative luminous Flux vs. Forward Current
200
150
100
50
40
37.5
35
32.5
30
0
0
0.2
0.4
0.6
0.8
0
1
0.2
0.4
0.6
0.8
1
Forward Current(A)
Forward Current(A)
C) Temperature Characteristics (IF = 360mA)
Forward Voltage vs. Temperature
105
36.5
Forward Voltage(V)
Relative Luminous Flux(%)
Relative Luminous Flux vs. Temperature
100
95
90
85
80
36.0
35.5
35.0
34.5
34.0
33.5
33.0
20
40
60
Tc(℃)
80
100
20
40
60
Tc(℃)
80
100
11
d) Color Shift Characteristics
△CIE x,△CIE y
(TJ = 25 ºC,
IF = 360mA,
CRI80+)
vs. Forward Current
△CIEx,△CIEy vs. Temperature
0
△CIE x,△ CIE y
△CIE x,△ CIE y
0
-0.01
-0.02
-0.03
△CIE
-0.04
x
0.20
0.40
0.60
e) Beam Angle Characteristics
Relative Luminous Intensity
-0.03
ΔCIE x
-0.04
ΔCIE y
20
0.80
(IF = 360 mA, Ta = 25 ºC)
1.2
1
0.8
0.6
0.4
0.2
0
-100 -80 -60 -40 -20 0
20 40 60 80 100
Angle(°)
f) Derating Characteristics
Derating Curve
750
600
450
300
150
0
0
20
40
60
Tc [ ℃ ]
Outline Drawing & Dimension
80
40
60
Tc(℃)
Forward Current(A)
If [ mA ]
-0.02
-0.05
-0.05
0.00
4.
-0.01
100
120
80
100
12
Tc
1. Unit:
mm
2. Tolerance: ± 0.3 mm
Note:
Item
Dimension
Tolerance
Unit
Length
13.5
±0.15
mm
Width
13.5
±0.15
mm
Height
1.50
±0.20
mm
Light Emitting Surface (LES) Diameter
9.8
±0.15
mm
Denoted product information above is only an example
( LC013D, CRI80+, 3000K )
13
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 700 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
ESD (HBM)
V:
5 times
±2 kV
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.2 kV
ESD (MM)
5 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C,
75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Forward Voltage
VF
Luminous Flux
Φv
Limit
Min.
Max.
IF = 360 mA
L.S.L. * 0.9
U.S.L. * 1.1
IF = 360 mA
L.S.L * 0.7
U.S.L * 1.3
14
6. Label Structure
a) Label Structure
ⓐⓑⓒⓓⓔⓕ
YZW3H5
Bin Code
SPHWHAHDND25YZW3H5 YZW3H5 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Product Code
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot Number
Note:
Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ:
Forward Voltage bin
ⓒⓓ:
Chromaticity bin
ⓔⓕ:
Luminous Flux bin
(refer to page 11)
(refer to page 9-10)
(refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
YZW3H5
SPHWHAHDND25YZW3H5 YZW3H5 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①
③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
②
③
④
⑤
⑥⑦⑧⑨
ⓐⓑⓒ
:
Production site
(S: Giheung, Korea,
:
4
:
Product state
:
Year
:
Month
:
Day (1~9, A, B~V)
:
Product serial number (001 ~ 999)
G: Tianjin, China)
(LED)
(A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
(Z: 2015, A: 2016, B: 2017…)
(1~9, A, B, C)
15
7.
Packing Structure
Max. quantity
in pcs of COB
30
60(2 trays)
240
2400
Packing material
Tray
Aluminum Bag
Inner Box
Outer Box
Length
160
210
230
476
Dimension(mm)
Width
180
241
84
445
a) Packing Structure
Label
Label
b) Tray
① Cover
② Body
Height
10
260
272
Tolerance
1.0
10
2
5
16
c) Aluminum Vinyl Packing Bag
17
8.
Precautions in Handling & Use
1)
This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is
recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2)
LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature
0~40 ºC, 0~90 % RH).
3)
After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4)
Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5)
Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6)
Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7)
The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage
or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8)
VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9)
The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
18
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. inspires the world and shapes the future
with transformative ideas and technologies, redefining the worlds of TVs,
smartphones, wearable devices, tablets, cameras, digital appliances,
printers, medical equipment, network systems and semiconductors.
We are also leading in the Internet of Things space through, among others,
our Digital Health and Smart Home initiatives. We employ 307,000 people
across 84 countries. To discover more, please visit our official website at
www.samsung.com and our official blog at global.samsungtomorrow.com.
Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com
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