Product Family Data Sheet Rev. 1.4 2016.06.01 High Voltage LED Series Chip on Board LC013D High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits • Chip on Board (COB) solution makes it easy to design in • Simple assembly reduces manufacturing cost • Low thermal resistance • InGaN/GaN MQW LED with long time reliability Applications • Spotlight / Downlight • LED Retrofit Bulbs • Outdoor Illumination 1 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 9 4. Outline Drawing & Dimension ----------------------- 12 5. Reliability Test Items & Conditions ----------------------- 13 6. Label Structure ----------------------- 14 7. Packing Structure ----------------------- 15 8. Precautions in Handling & Use ----------------------- 17 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 ºC - Storage Temperature Tstg -40 ~ +120 ºC - LED Junction Temperature TJ 140 ºC - Case Temperature Tc Forward Current IF 700 mA - Power Dissipation PD 34.5 W - ESD (HBM) - ±2 kV - ESD (MM) - ±0.5 kV - b) Electro-optical Characteristics (IF = 360 mA, TJ = 85 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YZ 31.8 34.6 37.5 5 80 - - Color Rendering Index (Ra) 7 90 Thermal Resistance (junction to chip point) ºC/W - 1.4 - Beam Angle º - 115 - Nominal Power W 13.5 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C) 2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1 3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range. 4 c) Luminous Flux Characteristics CRI (Ra) Min. (IF = 360 mA) Nominal CCT (K) Flux Rank Flux @ TJ = 85 °C (lm) Min. Typ. Max. H5 1510 1589 - D1 1589 1669 - H5 1589 1673 - D1 1673 1757 - H6 1639 1725 - D1 1725 1812 - H6 1669 1757 - D1 1757 1844 - H6 1684 1772 - D1 1772 1861 - H6 1684 1772 - D1 1772 1861 - H6 1659 1746 - D1 1746 1834 - 2700 3000 3500 80 4000 5000 5700 6500 CRI (Ra) Min. Nominal CCT (K) Flux Rank Flux @ TJ = 85 °C (lm) Min. Typ. Max. H2 1291 1359 - D1 1359 1427 - H3 1352 1423 - D1 1423 1494 - H4 1400 1473 - D1 1473 1547 - H4 1429 1505 - D1 1505 1580 - 2700 3000 90 3500 4000 Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = 85 °C). 2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H A H D N D 2 5 Y Z W 3 H 5 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version A Form Factor HD 9 Lens Type N No lens 10 Internal Code D LC013D 11 Chip Type 2 12 CRI & Sorting Temperature 1 2 3 4 5 6 7 8 13 14 15 CCT (K) 16 17 Forward Voltage (V) Specification Warm White COB 5 Min. 80 (85℃) 7 Min. 90 (85℃) YZ 31.8~37.5 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K 2 MacAdam 2-step 3 MacAdam 3-step MacAdam Step 18 Luminous Flux (Lm) H2 Min. 1200 H3 Min. 1300 H4 Min. 1400 H5 Min. 1500 H6 D1 Min. 1600 Add rank 6 a) Binning Structure CRI (Ra) Min. (IF = 360 mA, TJ = 85 ºC) Nominal CCT (K) Color Rank Chrom. Bin SPHWHAHDND25YZW2H5 W2 W2 SPHWHAHDND25YZW3H5 W3 W3 SPHWHAHDND25YZW2D1 W2 W2 SPHWHAHDND25YZW3D1 W3 W3 SPHWHAHDND25YZV2H5 V2 V2 SPHWHAHDND25YZV3H5 V3 V3 SPHWHAHDND25YZV2D1 V2 V2 SPHWHAHDND25YZV3D1 V3 V3 SPHWHAHDND25YZU2H6 U2 U2 SPHWHAHDND25YZU3H6 U3 U3 SPHWHAHDND25YZU2D1 U2 U2 SPHWHAHDND25YZU3D1 U3 U3 SPHWHAHDND25YZT2H6 T2 T2 SPHWHAHDND25YZT3H6 T3 T3 SPHWHAHDND25YZT2D1 T2 T2 SPHWHAHDND25YZT3D1 T3 T3 R3 R3 Product Code 2700 VF Rank Flux Rank Flux Range (Φv, lm) H5 1510 ~ D1 1589 ~ H5 1589 ~ D1 1673 ~ H6 1639 ~ D1 1725 ~ H6 1669 ~ D1 1757 ~ H6 1684 ~ D1 1772 ~ H6 1684 ~ D1 1772 ~ H6 1659 ~ D1 1746 ~ YZ 3000 YZ 3500 YZ 80 4000 YZ SPHWHAHDND25YZR3H6 5000 YZ SPHWHAHDND25YZR3D1 SPHWHAHDND25YZQ3H6 5700 YZ Q3 Q3 SPHWHAHDND25YZQ3D1 SPHWHAHDND25YZP3H6 6500 YZ SPHWHAHDND25YZP3D1 P3 P3 7 CRI (Ra) Min. Nominal CCT (K) Color Rank Chrom. Bin SPHWHAHDND27YZW2H2 W2 W2 SPHWHAHDND27YZW3H2 W3 W3 SPHWHAHDND27YZW2D1 W2 W2 SPHWHAHDND27YZW3D2 W3 W3 SPHWHAHDND27YZV2H3 V2 V2 SPHWHAHDND27YZV3H3 V3 V3 SPHWHAHDND27YZV2D1 V2 V2 SPHWHAHDND27YZV3D1 V3 V3 SPHWHAHDND27YZU2H4 U2 U2 SPHWHAHDND27YZU3H4 U3 U3 SPHWHAHDND27YZU2D1 U2 U2 SPHWHAHDND27YZU3D1 U3 U3 SPHWHAHDND27YZT2H4 T2 T2 SPHWHAHDND27YZT3H4 T3 T3 SPHWHAHDND27YZT2D1 T2 T2 SPHWHAHDND27YZT3D1 T3 T3 Product Code 2700 VF Rank Flux Rank Flux Range (Φv, lm) H2 1291 ~ D1 1359 ~ H3 1352 ~ D1 1423 ~ H4 1400 ~ D1 1473 ~ H4 1429 ~ D1 1505 ~ YZ 3000 YZ 90 3500 YZ 4000 YZ 8 b) Chromaticity Region & Coordinates (IF = 360 mA, TJ = 85 ºC) θ CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032 MacAdam Ellipse (P3) Step CIE x CIE y θ a b 3-step 0.3123 0.3282 58.5700 0.0067 0.0029 Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 9 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 360, TJ = 85 ºC) CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 Wavelength CCT: 3500 K (80 CRI) 60 40 20 0 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) 80 100 80 60 40 20 0 400 500 Wavelength 600 700 800 Wavelength CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 500 600 Wavelength 700 800 Relative Emission Intensity(%) Relative Intensity vs. Wavelength Relative Emission Intensity(%) 800 Relative Intensity vs. Wavelength 100 400 700 CCT: 4000 K (80 CRI) Relative Intensity vs. Wavelength 400 600 Wavelength(nm) 100 80 60 40 20 0 400 500 600 Wavelength 700 800 10 CCT: 6500 K (80 CRI) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Wavelength b) Forward Current Characteristics (TJ = 85 ºC) Forward Voltage vs. Forward Current 42.5 250 Forward Voltage(%) Relative Luminous Flux(%) Relative luminous Flux vs. Forward Current 200 150 100 50 40 37.5 35 32.5 30 0 0 0.2 0.4 0.6 0.8 0 1 0.2 0.4 0.6 0.8 1 Forward Current(A) Forward Current(A) C) Temperature Characteristics (IF = 360mA) Forward Voltage vs. Temperature 105 36.5 Forward Voltage(V) Relative Luminous Flux(%) Relative Luminous Flux vs. Temperature 100 95 90 85 80 36.0 35.5 35.0 34.5 34.0 33.5 33.0 20 40 60 Tc(℃) 80 100 20 40 60 Tc(℃) 80 100 11 d) Color Shift Characteristics △CIE x,△CIE y (TJ = 25 ºC, IF = 360mA, CRI80+) vs. Forward Current △CIEx,△CIEy vs. Temperature 0 △CIE x,△ CIE y △CIE x,△ CIE y 0 -0.01 -0.02 -0.03 △CIE -0.04 x 0.20 0.40 0.60 e) Beam Angle Characteristics Relative Luminous Intensity -0.03 ΔCIE x -0.04 ΔCIE y 20 0.80 (IF = 360 mA, Ta = 25 ºC) 1.2 1 0.8 0.6 0.4 0.2 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle(°) f) Derating Characteristics Derating Curve 750 600 450 300 150 0 0 20 40 60 Tc [ ℃ ] Outline Drawing & Dimension 80 40 60 Tc(℃) Forward Current(A) If [ mA ] -0.02 -0.05 -0.05 0.00 4. -0.01 100 120 80 100 12 Tc 1. Unit: mm 2. Tolerance: ± 0.3 mm Note: Item Dimension Tolerance Unit Length 13.5 ±0.15 mm Width 13.5 ±0.15 mm Height 1.50 ±0.20 mm Light Emitting Surface (LES) Diameter 9.8 ±0.15 mm Denoted product information above is only an example ( LC013D, CRI80+, 3000K ) 13 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 ºC, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 ºC, DC Derating, IF 1000 h Low Temperature Life Test -40 ºC, DC , IF = 700 mA 1000 h Pulsed Operating Life Test 55 ℃, Pulse width 100 ㎲, duty cycle 3 % 1000 h High Temperature Storage 120 ºC 1000 h Low Temperature Storage -40 ºC 1000 h Temperature Humidity Storage 60 ºC, 90% RH 1000h Temperature Cycle On/Off Test -40 ºC / 85 ºC each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 MΩ R2: 1.5 kΩ C: 100 pF ESD (HBM) V: 5 times ±2 kV R1: 10 MΩ R2: 0 kΩ C: 200 pF V: ±0.2 kV ESD (MM) 5 times Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency ↔ max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Sulfur Resistance 25 °C, 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Forward Voltage VF Luminous Flux Φv Limit Min. Max. IF = 360 mA L.S.L. * 0.9 U.S.L. * 1.1 IF = 360 mA L.S.L * 0.7 U.S.L * 1.3 14 6. Label Structure a) Label Structure ⓐⓑⓒⓓⓔⓕ YZW3H5 Bin Code SPHWHAHDND25YZW3H5 YZW3H5 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code G4AZC4001 / 1001 / xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: ⓐⓑ: Forward Voltage bin ⓒⓓ: Chromaticity bin ⓔⓕ: Luminous Flux bin (refer to page 11) (refer to page 9-10) (refer to page 6) b) Lot Number The lot number is composed of the following characters: YZW3H5 SPHWHAHDND25YZW3H5 YZW3H5 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs ① ② ③ ④ ⑤ ⑥⑦⑧⑨ ⓐⓑⓒ : Production site (S: Giheung, Korea, : 4 : Product state : Year : Month : Day (1~9, A, B~V) : Product serial number (001 ~ 999) G: Tianjin, China) (LED) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Z: 2015, A: 2016, B: 2017…) (1~9, A, B, C) 15 7. Packing Structure Max. quantity in pcs of COB 30 60(2 trays) 240 2400 Packing material Tray Aluminum Bag Inner Box Outer Box Length 160 210 230 476 Dimension(mm) Width 180 241 84 445 a) Packing Structure Label Label b) Tray ① Cover ② Body Height 10 260 272 Tolerance 1.0 10 2 5 16 c) Aluminum Vinyl Packing Bag 17 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. 18 Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com