Data Sheet LC019D Rev.1.4

Product Family Data Sheet
Rev. 1.4 2016.06.01
High Voltage LED Series
Chip on Board
LC019D
High efficacy COB LED package
well-suited for use in spotlight applications
Features & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
1#
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
ºC
-
Storage Temperature
Tstg
-40 ~ +120
ºC
-
LED Junction Temperature
TJ
140
ºC
-
Case Temperature
Tc
Forward Current
IF
970
mA
-
Power Dissipation
PD
51.8
W
-
ESD (HBM)
-
±2
kV
-
ESD (MM)
-
±0.5
kV
-
b) Electro-optical Characteristics
(IF = 540 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
5
80
-
-
Color Rendering Index (Ra)
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
1.0
-
Beam Angle
º
-
115
-
Nominal Power
W
20.3
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of:
forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics
CRI (Ra)
Min.
(IF = 540 mA)
Nominal
CCT (K)
Flux
Rank
Flux
Bin
J3
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
J3
2335
2458
-
D1
D1
2458
2581
-
J4
J4
2462
2592
-
D1
D1
2592
2722
-
J5
J5
2538
2672
-
D1
D1
2672
2805
-
J5
J5
2590
2726
-
D1
D1
2726
2863
-
J6
J6
2618
2756
-
D1
D1
2756
2894
-
J6
J6
2618
2756
-
D1
D1
2756
2894
-
J5
J5
2590
2726
-
D1
D1
2726
2863
-
Flux
Rank
Flux
Bin
H9
2700
3000
3500
80
4000
5000
5700
6500
CRI (Ra)
Min.
Nominal
CCT (K)
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
H9
1999
2104
-
D1
D1
2104
2210
-
J0
J0
2096
2207
-
D1
D1
2207
2317
-
J1
J1
2173
2287
-
D1
D1
2287
2402
-
J2
J2
2220
2337
-
D1
D1
2337
2454
-
2700
90
3000
3500
4000
Notes:
1)
The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
F
2
5
Y
Z
W
3
J
3
Digit
PKG Information
Code
Samsung Package High Power
SPH
Color
WH
Product Version
A
Form Factor
HD
9
Lens Type
N
No lens
10
Internal Code
F
LC019D
11
Chip Type
2
12
CRI & Sorting Temperature
1 2
3
4 5
6
7 8
13
14
15
CCT (K)
16
17
Forward Voltage (V)
Specification
Warm White
COB
5
Min. 80
(85℃)
7
Min. 90
(85℃)
YZ
31.8~37.5
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
2
MacAdam 2-step
3
MacAdam 3-step
MacAdam Step
18
Luminous Flux
H9
Min. 1900
J0
Min. 2000
J1
Min. 2100
J2
Min. 2200
J3
Min.2300
J4
Min. 2400
J5
Min. 2500
J6
Min. 2600
6
a) Binning Structure
CRI (Ra)
Min.
(IF = 540 mA, TJ = 85 ºC)
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDNF25YZW2J3
W2
W2
SPHWHAHDNF25YZW3J3
W3
W3
SPHWHAHDNF25YZW2D1
W2
W2
SPHWHAHDNF25YZW3D1
W3
W3
SPHWHAHDNF25YZV2J4
V2
V2
SPHWHAHDNF25YZV3J4
V3
V3
SPHWHAHDNF25YZV2D1
V2
V2
SPHWHAHDNF25YZV3D1
V3
V3
SPHWHAHDNF25YZU2J5
U2
U2
SPHWHAHDNF25YZU3J5
U3
U3
SPHWHAHDNF25YZU2D1
U2
U2
SPHWHAHDNF25YZU3D1
U3
U3
SPHWHAHDNF25YZT2J5
T2
T2
SPHWHAHDNF25YZT3J5
T3
T3
SPHWHAHDNF25YZT2D1
T2
T2
SPHWHAHDNF25YZT3D1
T3
T3
R3
R3
Product Code
2700
VF
Rank
Flux
Rank
Flux Range
(Φv, lm)
J3
2335 ~
D1
2458 ~
J4
2462 ~
D1
2592 ~
J5
2538 ~
D1
2672 ~
J5
2590 ~
D1
2726 ~
J6
2618 ~
D1
2756 ~
J6
2618 ~
D1
2756 ~
J5
2590 ~
D1
2726 ~
YZ
3000
YZ
3500
YZ
80
4000
YZ
SPHWHAHDNF25YZR3J6
5000
YZ
SPHWHAHDNF25YZR3D1
SPHWHAHDNF25YZQ3J6
5700
YZ
Q3
Q3
SPHWHAHDNF25YZQ3D1
SPHWHAHDNF25YZP3J5
6500
YZ
SPHWHAHDNF25YZP3D1
P3
P3
7
CRI (Ra)
Min.
Nominal
CCT (K)
Color
Rank
Chrom.
Bin
SPHWHAHDNF27YZW2H9
W2
W2
SPHWHAHDNF27YZW3H9
W2
W2
SPHWHAHDNF27YZW2D1
W2
W2
SPHWHAHDNF27YZW3D1
W2
W2
SPHWHAHDNF27YZV2J0
V2
V2
SPHWHAHDNF27YZV3J0
V3
V3
SPHWHAHDNF27YZV2D1
V2
V2
SPHWHAHDNF27YZV3D1
V3
V3
SPHWHAHDNF27YZU2J1
U2
U2
SPHWHAHDNF27YZU3J1
U3
U3
SPHWHAHDNF27YZU2D1
U2
U2
SPHWHAHDNF27YZU3D1
U3
U3
SPHWHAHDNF27YZT2J2
T2
T2
SPHWHAHDNF27YZT3J2
T3
T3
SPHWHAHDNF27YZT2D1
T2
T2
SPHWHAHDNF27YZT3D1
T3
T3
Product Code
2700
VF
Rank
Flux
Rank
Flux Range
(Φv, lm)
H9
1999 ~
D1
2104 ~
J0
2096 ~
D1
2207 ~
J1
2173 ~
D1
2287 ~
J2
2220 ~
D1
2337 ~
YZ
3000
YZ
90
3500
YZ
`4000
YZ
8
b) Chromaticity Region & Coordinates
(IF = 540 mA, TJ = 85 ºC)
θ
CIE x,y
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
θ
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of:
Cx, Cy = ±0.005
9
3. Typical Characteristics Graphs
a) Spectrum Distribution
(IF = 540 mA, TJ = 85 ºC)
CCT: 2700 K (80 CRI)
CCT: 3000 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
Wavelength
CCT: 3500 K (80 CRI)
60
40
20
0
500
600
700
800
Relative Emission Intensity(%)
Relative Emission Intensity(%)
80
100
80
60
40
20
0
400
500
Wavelength
600
700
800
Wavelength
CCT: 5000 K (80 CRI)
CCT: 5700 K (80 CRI)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
500
600
Wavelength
700
800
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
Relative Emission Intensity(%)
800
Relative Intensity vs. Wavelength
100
400
700
CCT: 4000 K (80 CRI)
Relative Intensity vs. Wavelength
400
600
Wavelength(nm)
100
80
60
40
20
0
400
500
600
Wavelength
700
800
10
CCT: 6500 K (80 CRI)
Relative Emission Intensity(%)
Relative Intensity vs. Wavelength
100
80
60
40
20
0
400
500
600
700
800
Wavelength
b) Forward Current Characteristics
(TJ = 85 ºC)
Forward Voltage vs. Forward Current
400
45
Forward Voltage(%)
Relative Luminous Flux(%)
Relative luminous Flux vs. Forward Current
300
200
100
0
40
35
30
0
0.3
0.6
0.9
1.2
0
0.3
Forward Current(A)
0.6
0.9
1.2
Forward Current(A)
C) Temperature Characteristics (IF = 540mA)
Forward Voltage vs. Temperature
36.5
105
Forward Voltage(V)
Relative Luminous Flux(%)
Relative Luminous Flux vs. Temperature
100
95
90
85
80
36.0
35.5
35.0
34.5
34.0
33.5
33.0
20
40
60
Tc(℃)
80
100
20
40
60
Tc(℃)
80
100
11
d) Color Shift Characteristics
△CIE x,△CIE y
(TJ = 85 ºC,
IF = 540mA,
CRI80+)
vs. Forward Current
△CIEx,△CIEy vs. Temperature
0
△CIE x,△ CIE y
△CIE x,△ CIE y
0
-0.01
-0.02
-0.03
△CIE x
-0.04
△ CIE y
0.35
0.70
1.05
1.40
-0.03
ΔCIE x
-0.04
ΔCIE y
e) Beam Angle Characteristics
(IF = 540 mA, TJ = 85 ºC)
1.2
1
0.8
0.6
0.4
0.2
0
-100 -80 -60 -40 -20 0
20 40 60 80 100
Angle(°)
f) Derating Characteristics
Derating Curve
1000
800
600
400
200
0
0
20
40
60
Tc [ ℃ ]
80
20
40
60
Tc(℃)
Forward Current(A)
Relative Luminous Intensity
-0.02
-0.05
-0.05
0.00
If [ mA ]
-0.01
100
120
80
100
12
4. Outline Drawing & Dimension
Tc
1. Unit:
mm
2. Tolerance: ± 0.3 mm
Note:
Item
Dimension
Tolerance
Unit
Length
19.0
±0.15
mm
Width
19.0
±0.15
mm
Height
1.50
±0.30
mm
Light Emitting Surface (LES) Diameter
14.5
±0.15
mm
Denoted product information above is only an example
( LC019D, CRI80+, 3000K )
13
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 970 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
ESD (HBM)
5 times
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
ESD (MM)
5 times
V: ±0.2 kV
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C,
75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Forward Voltage
VF
Luminous Flux
Φv
6. Label Structure
Limit
Min.
Max.
IF = 540 mA
L.S.L. * 0.9
U.S.L. * 1.1
IF = 540 mA
L.S.L * 0.7
U.S.L * 1.3
14
a) Label Structure
ⓐⓑⓒⓓⓔⓕ
YZW3J3
Bin Code
SPHWHAHDNF25YZW3J3 YZW3J3 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Product Code
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot Number
Note:
Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ:
Forward Voltage bin
ⓒⓓ:
Chromaticity bin
ⓔⓕ:
Luminous Flux bin
(refer to page 11)
(refer to page 9-10)
(refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
YZW3J3
SPHWHAHDNF25YZW3J3 YZW3J3 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①
③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
②
③
④
⑤
⑥⑦⑧⑨
ⓐⓑⓒ
:
Production site
(S: Giheung, Korea,
:
4
:
Product state
:
Year
:
Month
:
Day (1~9, A, B~V)
:
Product serial number (001 ~ 999)
G: Tianjin, China)
(LED)
(A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
(Z: 2015, A: 2016, B: 2017…)
(1~9, A, B, C)
15
6.
Packing Structure
Packing material
Tray
Aluminum Bag
Inner Box
Outer Box
Max. quantity
in pcs of COB
20
40(2 trays)
160
1600
Length
160
210
230
476
Dimension(mm)
Width
180
241
84
445
a) Packing Structure
Label
Label
Height
10
260
272
Tolerance
1.0
10
2
5
16
b) Tray
① Cover
c) Aluminum Vinyl Packing Bag
② Body
17
8.
Precautions in Handling & Use
1)
This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2)
LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3)
After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4)
Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5)
Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6)
Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7)
The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8)
VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9)
The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
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Specifications and designs are subject to change without notice. Non-metric
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