Product Family Data Sheet Rev. 0.9 2016.06.01 High Voltage LED Series Chip on Board LC060D High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits • Chip on Board (COB) solution makes it easy to design in • Simple assembly reduces manufacturing cost • Low thermal resistance • InGaN/GaN MQW LED with long time reliability Applications • Spotlight / Downlight • LED Retrofit Bulbs • Outdoor Illumination 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 9 4. Outline Drawing & Dimension ----------------------- 12 5. Reliability Test Items & Conditions ----------------------- 13 6. Label Structure ----------------------- 14 7. Packing Structure ----------------------- 15 8. Precautions in Handling & Use ----------------------- 17 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 ºC - Storage Temperature Tstg -40 ~ +120 ºC - LED Junction Temperature TJ 140 ºC - Case Temperature Tc 105 ºC Forward Current IF 1944 mA - Power Dissipation PD 155.1 W - ESD (HBM) - ±2 kV - ESD (MM) - ±0.5 kV - b) Electro-optical Characteristics (IF = 1080 mA, TJ = 85 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V 1Z 47.8 50.3 56.2 Color Rendering Index (Ra) - 5 80 - - Thermal Resistance (junction to chip point) ºC/W - 0.5 - Beam Angle º - 115 - Nominal Power W 56.2 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C) 2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1 3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range. 4 c) Luminous Flux Characteristics CRI (Ra) Min. 80 (IF = 1080 mA) Nominal CCT (K) Flux Rank 2700 Flux @ TJ = 85 °C (lm) Min. Typ. Max. P9 6937 7302 7667 3000 Q3 7309 7694 8079 3500 Q5 7540 7937 8334 4000 Q6 7697 8102 8507 5000 Q7 7735 8142 8549 5700 Q7 7773 8182 8591 6500 Q6 7692 8097 8502 Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = 85 °C). 2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H A H D N L 2 5 1 Z W 3 P 0 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version A Form Factor HD 9 Lens Type N No lens 10 Internal Code L LC060D 11 Chip Type 2 12 CRI & Sorting Temperature 5 Forward Voltage (V) 1Z 47.8~56.2 W 2700K V 3000K 1 2 3 4 5 6 7 8 13 14 15 CCT (K) 16 17 Specification White COB Min. 80 U 3500K T 4000K (85℃) R 5000K Q 5700K P 6500K 2 MacAdam 2-step 3 MacAdam 3-step MacAdam Step 18 Luminous Flux P0 Min. 6000 P2 Min. 6200 P5 Min. 6500 P6 Min. 6600 P9 Min. 6900 Q3 Min. 7300 Q5 Min. 7500 Q6 Min. 7600 Q7 Min. 7700 6 a) Binning Structure CRI (Ra) Min. (IF = 1080 mA, TC = 85 ºC) Nominal CCT (K) Product Code VF Rank SPHWHAHDNL251ZW2P9 2700 SPHWHAHDNL251ZV3Q3 6937 ~ 7667 Q3 7309 ~ 8079 Q5 7540 ~ 8334 Q6 7697 ~ 8507 V3 SPHWHAHDNL251ZU2Q5 U2 1Z SPHWHAHDNL251ZU3Q5 U3 SPHWHAHDNL251ZT2Q6 4000 P9 V2 1Z 3500 Flux Range (Φv, lm) W3 SPHWHAHDNL251ZV2Q3 3000 Flux Rank W2 1Z SPHWHAHDNL251ZW3P9 80 Chrom. Bin T2 1Z SPHWHAHDNL251ZT3Q6 T3 5000 SPHWHAHDNL251ZR3Q7 1Z R3 Q7 7735 ~ 8549 5700 SPHWHAHDNL251ZQ3Q7 1Z Q3 Q7 7773 ~ 8591 6500 SPHWHAHDNL271ZP3Q6 1Z P3 Q6 7692 ~ 8502 7 b) Chromaticity Region & Coordinates (IF = 1080 mA, TJ = 85 ºC) θ CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032 MacAdam Ellipse (P3) Step CIE x CIE y θ a b 3-step 0.3123 0.3282 58.5700 0.0067 0.0029 Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 8 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 1080 mA, TJ = 85 ºC) CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 Wavelength CCT: 3500 K (80 CRI) 60 40 20 0 500 600 700 800 Relative Emission Intensity(%) Relative Emission Intensity(%) 80 100 80 60 40 20 0 400 500 Wavelength 600 700 800 Wavelength CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI) Relative Intensity vs. Wavelength 100 80 60 40 20 0 500 600 Wavelength 700 800 Relative Emission Intensity(%) Relative Intensity vs. Wavelength Relative Emission Intensity(%) 800 Relative Intensity vs. Wavelength 100 400 700 CCT: 4000 K (80 CRI) Relative Intensity vs. Wavelength 400 600 Wavelength(nm) 100 80 60 40 20 0 400 500 600 Wavelength 700 800 9 CCT: 6500 K (80 CRI) Relative Emission Intensity(%) Relative Intensity vs. Wavelength 100 80 60 40 20 0 400 500 600 700 800 Wavelength b) Forward Current Characteristics (TJ = 85 ºC) Forward Voltage vs. Forward Current 250 60 Forward Voltage Relative Luminous Flux(%) Relative luminous Flux vs. Forward Current 200 150 100 50 0 50 40 30 0 0.4 0.8 1.2 1.6 2 2.4 0 2.8 0.4 Forward Current(A) 0.8 1.2 1.6 2 2.4 2.8 Forward Current(A) C) Temperature Characteristics (IF = 1080mA) Forward Voltage vs. Temperature 52.0 100 Forward Voltage(V) Relative Luminous Flux(%) Relative Luminous Flux vs. Temperature 105 95 90 85 80 51.5 51.0 50.5 50.0 49.5 20 70 Tc(℃) 20 40 60 Tc(℃) 80 100 10 d) Color Shift Characteristics (TJ = 25 ºC, IF = 1080mA, CRI80+) △CIEx,△CIEy vs. Temperature △CIEx,△CIEy vs. Forward Current △CIE x,△ CIE y △CIE x,△ CIE y 0 -0.01 -0.03 △CIE x △ CIE y -0.01 -0.02 -0.03 △CIE x -0.04 △ CIE y -0.05 -0.05 0 0.4 0.8 1.2 1.6 2 2.4 2.8 Relative Luminous Intensity (IF = 1080 mA, TJ = 85 ºC) 1.2 1 0.8 0.6 0.4 0.2 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle(°) f) Derating Characteristics Derating Curve 2500 If [ mA ] 2000 1500 1000 500 0 0 20 40 60 Tc [ ℃ ] 80 40 60 Tc(℃) Forward Current(A) e) Beam Angle Characteristics 20 100 120 80 100 11 4. Outline Drawing & Dimension Tc 1. Unit: mm 2. Tolerance: ± 0.3 mm Note: Item Dimension Tolerance Unit Length 28.0 ±0.15 mm Width 28.0 ±0.15 mm Height 1.50 ±0.20 mm Light Emitting Surface (LES) Diameter 22.0 ±0.15 mm Denoted product information above is only an example ( LC060D, CRI80+, 3000K ) 12 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 ºC, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 ºC, DC Derating, IF 1000 h Low Temperature Life Test -40 ºC, DC , IF = 1944 mA 1000 h Pulsed Operating Life Test 55 ℃, Pulse width 100 ㎲, duty cycle 3 % 1000 h High Temperature Storage 120 ºC 1000 h Low Temperature Storage -40 ºC 1000 h Temperature Humidity Storage 60 ºC, 90% RH 1000h Thermal Cycle -45 ºC / 15 min ↔ 125 ºC / 15 min temperature change in 5 min 500 cycles Temperature Cycle On/Off Test -40 ºC / 85 ºC each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 MΩ R2: 1.5 kΩ C: 100 pF ESD (HBM) V: 5 times ±2 kV R1: 10 MΩ R2: 0 kΩ ESD (MM) 5 times C: 200 pF V: ±0.2 kV Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency ↔ max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Sulfur Resistance 25 °C, 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Forward Voltage VF Luminous Flux Φv Limit Min. Max. IF = 1080 mA L.S.L. * 0.9 U.S.L. * 1.1 IF = 1080 mA L.S.L * 0.7 U.S.L * 1.3 13 6. Label Structure a) Label Structure ⓐⓑⓒⓓⓔⓕ 1ZW3P9 Bin Code SPHWHAHDNL251ZW3P9 1ZW3P9 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code G4AZC4001 / 1001 / xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: ⓐⓑ: Forward Voltage bin ⓒⓓ: Chromaticity bin ⓔⓕ: Luminous Flux bin (refer to page 11) (refer to page 9-10) (refer to page 6) b) Lot Number The lot number is composed of the following characters: 1ZW3P9 SPHWHAHDNL251ZW3P9 1ZW3P9 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs ① ② ③ ④ ⑤ ⑥⑦⑧⑨ ⓐⓑⓒ : Production site (S: Giheung, Korea, : 4 : Product state : Year : Month : Day (1~9, A, B~V) : Product serial number (001 ~ 999) G: Tianjin, China) (LED) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Z: 2015, A: 2016, B: 2017…) (1~9, A, B, C) 14 6. Packing Structure Packing material Tray Aluminum Bag Inner Box Outer Box Max. quantity in pcs of COB 16 32(2 trays) 128 1280 Length 160 210 230 476 Dimension(mm) Width 180 241 84 445 a) Packing Structure Label Label Height 10 260 272 Tolerance 1.0 10 2 5 15 b) Tray ① Cover c) Aluminum Vinyl Packing Bag ② Body 16 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com