Brochure - CSP

CSP Array 3X3
MR16 Application
Legal and additional information.
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CSP Array 2X2
Candle Application
CSP 6V
Bulb Application
Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com
Samsung Chip scale package (CSP) LEDs
Significantly scale down the size that allows for
more flexible and compact designs
Added value provided with the advanced chip scale packaging technology
LM101A
CRI
Min.
Compact form factor for design flexibility
• 1 W class mid power LED
• LM80 (6000hrs) : Nov. 2015
• Compact footprint: 1.18 × 1.18 ㎟
Low Thermal Resistance
1.18
Anode
1.18
0.25 (Top Phosphor)
80
0.70
0.30
Small Form Factor
70%
Flip-chip CSP
Epi-up lead
frame package
30%
0.82
Cathode
0.17
Circuit board
Current
Better lm/W at high current
CRI
Min.
• LM80 (6000hrs) : Jun. 2016
High Reliability
• Compact footprint: 1.34 × 1.34 ㎟
0.223
Simple structure:
no wire, no silver reflector
Easy to design optics
• Suitable design for
omni directional bulb applications
•
0.98
1.34
Low FIT & No sulfurization
0.246
0.20
0.17
80
Anode
0.98
0.278
140∘Wide
0.25 (Top Phosphor)
0.278
1.34
120∘
Phosphor Wall
CRI
Min.
• 1W class mid power LED with white side wall
• Film on Chip structure
• Compact footprint: 1.42 x 1.42 ㎟
0.30
Anode
SCS8WT78EPL1W0S06E
SCS8VT78EPL1V0S06E
3500
52
68
4000
56
72
5000
58
74
SCS8UT78EPL1U0S06E
150
SCS8TT78EPL1T0S06E
SCS8RT78EPL1R0S06E
5700
53
69
SCS8QT78EPL1Q0S06E
6500
52
68
SCS8PT78EPL1P0S06E
CCT (K)
Luminous Flux (lm)
Typ.
IF (mA)
Part Number
2700
102
SCS8WT93HPL2W0S0XX
3000
106
SCS8VT93HPL2V0S0XX
3500
109
4000
116
SCS8UT93HPL2U0S0XX
150
(5.9V)
SCS8TT93HPL2T0S0XX
5000
119
SCS8RT93HPL2R0S0XX
5700
116
SCS8QT93HPL2Q0S0XX
6500
112
SCS8PT93HPL2P0S0XX
CCT (K)
Luminous Flux (lm)
IF (mA)
Part Number
Min.
Max.
2700
82
106
SCS8WT78EFL1W08ECK
3000
86
110
SCS8VT78EFL1V09FCK
300
94
118
98
122
SCS8RT78EFL1R0CICK
6500
94
118
SCS8PT78EFL1P0BHCK
0.82
4000
5000
SCS8TT78EFL1T0BHCK
※ Bin option is available, please refer to data sheet for more details.
LH141A
CRI
Min.
Samsung flip chip provides optimized solution
for torch / flash light
68
• Film on Chip structure
• Compact footprint: 1.46 x 1.46 ㎟
1.08
Anode
0.39
1.20
1.20
Cathode
0.39
0.17
Anode Mark
0.30
1.46
0.13
0.07 (Top Phosphor)
Luminous Flux (lm)
Min.
Typ.
110
135
6000
110
131
7600
110
124
IF (mA)
Part Number
SCS6RTB6EFL1R0FZ6K
350
SCS6JTB6EFL1J0FZ6K
SCS6NTB6EFL1N0FZ6K
※ Bin option is available, please refer to data sheet for more details.
Bulb, Candle, MR16, PAR, Spot light
1.46
CCT (K)
5000
• 2 W class high power LED
• Plastic-free structure delivers low thermal resistance
Applications
65
67
0.30
1.42
5000K
0.70
Cathode
0.17
3X3 Block
Customizable array arrangement
• Greater freedom of design
• One time certification
• Faster time-to-market cycle
• Low inventory burden
80
0.82
Anode Mark
0.20
0.10 (Top Phosphor)
0.25
1.42
2700K
•
49
51
LM131A
CCT Tunability
2X2 Block
2700
[Under development]
Superior Design Flexibility
1X1 Block
Part Number
※ Bin option is available, please refer to data sheet for more details.
Compact form factor for design flexibility
Building Block
IF (mA)
LM102A
• 6V, 1W class mid power LED
CSP
Max.
※ Bin option is available, please refer to data sheet for more details.
Compact form factor for design flexibility
Wide Beam Angle
Min.
3000
Flip-chip CSP
Epi-up lead
frame package
Rth(K/W)
Luminous Flux (lm)
0.30
LES
0.20
1.18
lm/W
CCT (K)
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