AOS Semiconductor Product Reliability Report AOD9N50, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD9N50. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD9N50 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Reliability Stress Test Summary and Result Reliability Evaluation Appendix: Test data I. Product Description: The AOD9N50 is fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability this parts can be adopted quickly into new and existing offline power supply designs. Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOD9N50 Standard sub-micron 500V N-Channel MOSFET TO252 Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOD9N50 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 15 lots 3003pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 2 lots 3 lots 4 lots 693pcs 0 JESD22A108 Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 2 lots 3 lots 4 lots 693pcs 0 JESD22A108 HAST 130°c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs 12 lots 924pcs 0 JESD22A110 Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs (Note A*) 12 lots 77 pcs / lot 924pcs 0 JESD22A102 (Note A*) 77 pcs / lot 0 JESD22A104 HTGB HTRB Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Lot Attribution 15 lots (Note A*) Total Sample size Number of Failures Reference Standard 77 pcs / lot 77 pcs / lot 1155pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.92 MTTF = 29102 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD9N50). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (4x77x168 +6x77x500 +8x77x1000) x259] = 3.92 9 8 MTTF = 10 / FIT = 2.55 x 10 hrs = 29102 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 x 10-5eV / K 130 deg C 150 deg C 2.59 1 3